CN101030542A - Production of triode lead wire frame - Google Patents
Production of triode lead wire frame Download PDFInfo
- Publication number
- CN101030542A CN101030542A CNA2007100676404A CN200710067640A CN101030542A CN 101030542 A CN101030542 A CN 101030542A CN A2007100676404 A CNA2007100676404 A CN A2007100676404A CN 200710067640 A CN200710067640 A CN 200710067640A CN 101030542 A CN101030542 A CN 101030542A
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- CN
- China
- Prior art keywords
- lead frame
- tape coiling
- contact
- slitting
- branch point
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
Abstract
The invention is concerned with manufacture method of the triode down-lead frame, includes: a. stampings the four single-row down-lead frame coils (-, -, -, -) that are parataxis and symmetry connection by the tangency point (-, -) or / and the tangency bar from the same workpiece; b. processes electroplating for the area that forms by the head (-) of the down-lead frame coil (-, -, -, -) and the outside the tangency point (-, -) or / and the tangency bar setting on the head of the down-lead frame coil (-); c. removals the tangency point (-, -) or / and the tangency bar, in order to get the down-lead frame coil (-, -, -, -) that separates into four rows; d. cuts off the single-row down-lead frame coil (-, -, -, -), in order to get several down-lead frame slices, each slice includes several down-lead frames. The invention is high producing efficiency, stable quality and low cost.
Description
Technical field
The present invention relates to the manufacture method of a kind of manufacture method of lead frame, particularly a kind of lead frame of triode.
Background technology
The manufacture method of prior art lead frame is divided into two kinds substantially, and a kind of is to make lead frame by etching; A kind of is to make lead frame by punching press.Compare with engraving method, the method for making lead frame by punching press has the ability (advantage) of High-speed machining.But prior art is made the manufacture method of lead frame of triode such as TO-92 (industry universal models) lead frame of triode by punching press, be at first to stamp out single tape coiling of lead frame, by electroplating work procedure the head zone of single tape coiling of lead frame is electroplated again, enter separation circuit then, tape coiling of lead frame is separated into a plurality of lead frame piece, wherein, comprise a plurality of lead frames in each lead frame piece.Because the tape coiling of lead frame that this method stamps out is single, so its production efficiency is lower, quality control is stable inadequately, each operation manpower and supplies consumption cost are higher, especially on electroplating work procedure, have wasted the energy, increased electroplating cost, so production cost is higher relatively; And disperse owing to electroplate, increased the harmful substance of electroplating discharging, increased the weight of pollution environment.
Summary of the invention
The technical problem to be solved in the present invention is that the manufacture method of the lead frame of triode of a kind of production efficiency height, steady quality and saving production cost is provided.
The present invention is achieved through the following technical solutions: the manufacture method of this lead frame of triode comprises:
A, stamp out the single tape coiling of lead frame of interconnective four rows from same workpiece, described single tape coiling of lead frame each other the branch point of contact by being located at tape coiling of lead frame head outer or/and divide slitting and be located at the branch point of contact of tape coiling of lead frame sideband outer or divide slitting to join side by side;
B, to the head of described tape coiling of lead frame and be located at the branch point of contact of tape coiling of lead frame head outer or/and divide the formed zone of slitting to electroplate;
C, excision branch point of contact are or/and divide slitting to obtain four rows single tape coiling of lead frame separately;
D, described single tape coiling of lead frame is cut off, obtained a plurality of lead frame piece, comprise a plurality of lead frames in each lead frame piece.
And the branch point of contact of being located at tape coiling of lead frame sideband outer or branch slitting is connected described single tape coiling of lead frame or/and divide slitting at branch point of contact by being located at tape coiling of lead frame head outer each other, is preferably symmetrically and joins side by side.
Manufacture method of the present invention makes the single tape coiling of lead frame of interconnective four rows form two plating areas, in the electroplating work procedure, as long as these two plating areas are implemented to electroplate, promptly realized the purpose that plating area on the single tape coiling of lead frame of four rows is electroplated.
It is that the manufacture method of the single lead frame of triode of TO-92 is compared that (punching press) manufacture method of lead frame of triode of the present invention and prior art are made lead frame of triode such as model by punching press, owing to adopted four row lead frame frame winding to carry out punching press simultaneously, four row lead frame frame winding are electroplated simultaneously, separate then, so the production efficiency on the per pass operation all greatly improves.From production cost, first, significantly reduced the mould and the maintenance cost thereof of punching press and separation circuit, human cost and the supplies consumption cost saved significantly; The second, on electroplating work procedure, saved the energy, reduced the human cost and the supplies consumption cost of electroplating work procedure.So its production cost is relatively low.Simultaneously, because control is simultaneously made in the winding of multi-row lead frame frame simultaneously, make constant product quality.Because the electroplating work procedure centralized production has reduced the harmful substance of electroplating discharging, has reduced the pollution to environment.
Description of drawings
Fig. 1 is single lead frame of triode winding and the plating area schematic diagram that the prior art manufacture method stamps out.
Fig. 2 is winding, coupling part and the plating area schematic diagram thereof of four row (TO-92) lead frames a kind of embodiment of stamping out of the manufacture method of lead frame of triode of the present invention.
Fig. 3 is winding, coupling part and the plating area schematic diagram thereof of the another kind of embodiment of four row's (TO-92) lead frames that stamp out of the manufacture method of lead frame of triode of the present invention.
Fig. 4 is four row's (TO-92) lead frames winding, coupling part and the plating area schematic diagram thereof of another kind of embodiment again that the manufacture method of lead frame of triode of the present invention stamps out.
Shown in the figure 1, middle muscle, 2, sideband, 3,4, divide the point of contact, 5,6,7,8, single tape coiling of lead frame, 9, the tape coiling of lead frame head, 10,11, divide slitting, the plating area of A, prior art tape coiling of lead frame, the plating area of B, tape coiling of lead frame of the present invention, the width at W1, branch point of contact 3, the width of W2, tape coiling of lead frame head 9.
Embodiment
The invention will be further described below in conjunction with the drawings and specific embodiments.
As shown in Figure 1, prior art makes lead frame of triode by punching press such as model is the manufacture method of the single lead frame of triode of TO-92, the single tape coiling of lead frame of the TO-92 that stamps out, its coupling part is middle muscle 1 and sideband 2, head 9 zones that its zone that need electroplate is a tape coiling of lead frame, i.e. a-quadrant shown in the figure.When tape coiling of lead frame is separated, laterally (custom claims vertically in the industry, promptly along vertical direction up and down among Fig. 1) cut off in muscle 1 and sideband 2, promptly can obtain a plurality of lead frame piece, comprise a plurality of lead frames in each lead frame piece.
As shown in Figure 2, first embodiment of the manufacture method of lead frame of triode of the present invention:
A, punching press tape coiling of lead frame: stamp out the single tape coiling of lead frame 5,6,7,8 of interconnective four rows from same workpiece, its coupling part also is middle muscle 1 and sideband 2.Described single tape coiling of lead frame 5,6,7,8 is joined symmetrically side by side by the branch point of contact 3 of being located at tape coiling of lead frame head 9 outers and the branch point of contact 4 of being located at tape coiling of lead frame sideband 2 outers each other.Each branch point of contact 3 is connected a pair of lead frame that joins side by side symmetrically respectively with branch point of contact 4, after distributing like this, has just formed two plating area B.
The width W 1 at the described branch point of contact 3 of being located at tape coiling of lead frame head 9 outers is greater than the width W 2 of tape coiling of lead frame head 9, like this, guaranteed not influence smooth smooth on tape coiling of lead frame head 9 limits when excision branch point of contact 3.
Because a variety of causes, draw the pulling force size of equipment of winding different in the electroplating work procedure, expectation equipment pulling force hour, described branch point of contact 3 four lead frames in every interval on the length direction of tape coiling of lead frame of being located at tape coiling of lead frame head 9 outers occur once, like this, at the equipment pulling force hour, both guarantee the bonding strength between the single tape coiling of lead frame of the row of two in the production process, saved the plating area again.
B, plating: the head 9 of described tape coiling of lead frame 5,6,7,8 and the branch point of contact 3 formed area B of being located at tape coiling of lead frame head 9 outers are electroplated.
Separate:
C, excision divide point of contact 3 and divide point of contact 4, obtain four rows single tape coiling of lead frame 5,6,7,8 separately;
D, laterally (custom claims vertically in the industry with described single tape coiling of lead frame 5,6,7,8, promptly along vertical direction up and down among Fig. 2) cut off, obtain a plurality of lead frame piece, comprise a plurality of lead frames in each lead frame piece again, in the reality operation, generally be to comprise 50 lead frames (together following, omitting in each lead frame piece of drawing among Fig. 2 and Fig. 3, Fig. 4 has 15 lead frames) in each lead frame piece.
As shown in Figure 3, second embodiment of the manufacture method of lead frame of triode of the present invention:
Manufacture method is basic identical with first embodiment, its difference is: when estimating that the equipment pulling force is moderate, join side by side symmetrically by branch slitting 10 and the branch point of contact 3 of being located at tape coiling of lead frame head 9 outers between the described single tape coiling of lead frame 5,6 and between the single tape coiling of lead frame 7,8.Divide slitting 10 and branch point of contact 3 being arranged as on the length direction of tape coiling of lead frame: slitting 10 appears once dividing in the lead frame in every interval, two pairs of lead frames that join side by side symmetrically of this minute slitting 10 connections, point of contact 3 appears once dividing in a lead frame at interval again, the a pair of lead frame that joins side by side symmetrically of this minute point of contact 3 connections, slitting 10 appears once dividing in a lead frame at interval again ..., so circulation repeatedly.The plating of first embodiment and excision only relate to branch point of contact 3 and branch point of contact 4, and the plating of present embodiment and excision also comprise branch slitting 10.Adopt the purpose of present embodiment to be, when the equipment pulling force is moderate, can guarantee the bonding strength between the single tape coiling of lead frame of the row of two in the production process, promptly do not produce distortion in any case, be beneficial to carrying out smoothly of subsequent handling.
As shown in Figure 4, the 3rd embodiment of the manufacture method of lead frame of triode of the present invention:
Manufacture method is basic identical with first embodiment, its difference is: when estimating that the equipment pulling force is big, between the described single tape coiling of lead frame 5,6 and join side by side symmetrically by the branch slitting 11 of being located at tape coiling of lead frame head 9 outers between the single tape coiling of lead frame 7,8.Divide slitting 11 uninterruptedly to extend along the length direction of tape coiling of lead frame.The plating of first embodiment and excision relate to is branch point of contact 3 and branchs point of contact 4, is branch slitting 11 and branch point of contact 4 and the plating of present embodiment and excision relate to.Adopt the purpose of present embodiment to be, when the equipment pulling force is big, can guarantee the bonding strength between the single tape coiling of lead frame of the row of two in the production process, promptly do not produce distortion in any case, be beneficial to carrying out smoothly of subsequent handling.
The foregoing description is used for explaining the present invention, rather than limitation of the present invention.In claim protection range of the present invention; the unsubstantiality ground that the present invention makes is revised and change; as the branch point of contact among three embodiment 3,4 and the variation etc. that divides each other exchange of slitting 10,11, divides the point of contact and divide the concrete width of slitting, all fall within the scope of protection of the present invention.
Claims (2)
1, a kind of manufacture method of lead frame of triode comprises:
A, stamp out interconnective four row's single tape coiling of lead frame (5,6,7,8) from same workpiece, described single tape coiling of lead frame (5,6,7,8) each other the branch point of contact (3) by being located at tape coiling of lead frame head (9) outer or/and the branch point of contact (4) or the branch slitting that divide slitting (10,11) and be located at tape coiling of lead frame sideband (2) outer join side by side;
B, to the head (9) of described tape coiling of lead frame (5,6,7,8) and be located at the branch point of contact (3) of tape coiling of lead frame head (9) outer or/and divide slitting (10,11) formed zones (B) to electroplate;
C, excision divide point of contact (3,4) or/and divide slitting (10,11), obtain four rows single tape coiling of lead frame (5,6,7,8) separately;
D, described single tape coiling of lead frame (5,6,7,8) is cut off, obtained a plurality of lead frame piece, comprise a plurality of lead frames in each lead frame piece.
2, the manufacture method of lead frame of triode according to claim 1, it is characterized in that: described single tape coiling of lead frame (5,6,7,8) the branch point of contact (3) by being located at tape coiling of lead frame head (9) outer each other refers to join side by side symmetrically or/and the branch point of contact (4) or the branch slitting that divide slitting (10,11) and be located at tape coiling of lead frame sideband (2) outer join side by side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007100676404A CN100454503C (en) | 2007-03-21 | 2007-03-21 | Production of triode lead wire frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007100676404A CN100454503C (en) | 2007-03-21 | 2007-03-21 | Production of triode lead wire frame |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101030542A true CN101030542A (en) | 2007-09-05 |
| CN100454503C CN100454503C (en) | 2009-01-21 |
Family
ID=38715768
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2007100676404A Active CN100454503C (en) | 2007-03-21 | 2007-03-21 | Production of triode lead wire frame |
Country Status (1)
| Country | Link |
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| CN (1) | CN100454503C (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102623357A (en) * | 2012-03-29 | 2012-08-01 | 宁波康强电子股份有限公司 | Manufacture method of triode lead frame |
| CN103617990A (en) * | 2013-11-21 | 2014-03-05 | 沈健 | Double-row plastic package lead frame |
| CN112595908A (en) * | 2020-11-25 | 2021-04-02 | 四川金湾电子有限责任公司 | Lead frame detection system and detection method |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0621293A (en) * | 1992-06-29 | 1994-01-28 | Rohm Co Ltd | Axial lead frame |
| JP2752558B2 (en) * | 1992-12-25 | 1998-05-18 | ローム株式会社 | Electronic component manufacturing method |
| KR0179925B1 (en) * | 1996-06-14 | 1999-03-20 | 문정환 | Lead frame, bottom lead semiconductor package using it |
| US5920113A (en) * | 1996-08-13 | 1999-07-06 | Motorola, Inc. | Leadframe structure having moveable sub-frame |
| JP2003124420A (en) * | 2001-10-16 | 2003-04-25 | Shinko Electric Ind Co Ltd | Lead frame and manufacturing method of semiconductor device using same |
| CN2618302Y (en) * | 2003-03-24 | 2004-05-26 | 上海仪电科技有限公司 | Improved semiconductor integrated circuit lead wire frame |
-
2007
- 2007-03-21 CN CNB2007100676404A patent/CN100454503C/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102623357A (en) * | 2012-03-29 | 2012-08-01 | 宁波康强电子股份有限公司 | Manufacture method of triode lead frame |
| CN103617990A (en) * | 2013-11-21 | 2014-03-05 | 沈健 | Double-row plastic package lead frame |
| CN112595908A (en) * | 2020-11-25 | 2021-04-02 | 四川金湾电子有限责任公司 | Lead frame detection system and detection method |
| CN112595908B (en) * | 2020-11-25 | 2023-11-17 | 四川金湾电子有限责任公司 | Lead frame detection system and detection method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100454503C (en) | 2009-01-21 |
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