CN103579159A - 封装组件及其形成方法 - Google Patents

封装组件及其形成方法 Download PDF

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Publication number
CN103579159A
CN103579159A CN201210575914.1A CN201210575914A CN103579159A CN 103579159 A CN103579159 A CN 103579159A CN 201210575914 A CN201210575914 A CN 201210575914A CN 103579159 A CN103579159 A CN 103579159A
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package parts
electrical connector
package
parts
face
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CN103579159B (zh
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陈宪伟
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Taiwan Semiconductor Manufacturing Co TSMC Ltd
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Taiwan Semiconductor Manufacturing Co TSMC Ltd
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Abstract

本发明涉及一种器件，该器件包括第一封装部件，以及位于第一封装部件下面的第二封装部件。第二封装部件包括位于第二封装部件的顶面上的第一电连接件，其中，第一电连接件与第一封装部件相接合。第二封装部件进一步包括位于第二封装部件的顶面上的第二电连接件，其中，没有封装部件位于第二电连接件上且与其相接合。本发明还提供了一种封装组件及其形成方法。

Description

封装组件及其形成方法
技术领域
本发明涉及半导体领域，更具体地，本发明涉及一种封装组件及其形成方法。
背景技术
在传统的封装工艺中，器件管芯被接合到底部封装部件，诸如封装衬底或印刷电路板(PCB)。器件管芯包括多个连接件，诸如接合焊盘或铜凸块，它们被用于接合底部封装部件的连接件。
器件管芯的连接件与底部封装部件的连接件相对准。底部封装部件中的电互连由器件管芯的设计来确定。因此，在底部封装部件的设计和制造中，底部封装件中的电互连是根据器件管芯的设计定制的。当器件管芯的设计改变时，底部封装部件也需要重新设计。
发明内容
为了解决现有技术中所存在的问题，根据本发明的一个方面，提供了一种器件，包括：第一封装部件；以及第二封装部件，位于所述第一封装部件下面，其中，所述第二封装部件包括：第一电连接件，位于所述第二封装部件的顶面，其中，所述第一电连接件与所述第一封装部件相接合；和第二电连接件，位于所述第二封装部件的顶面，其中，没有封装部件位于所述第二电连接件之上且与所述第二电连接件相接合。
在所述器件中，所述第二电连接件被所述第一封装部件覆盖，并且所述第二电连接件包括作为所述第二电连接件的顶层的预焊料层。
在所述器件中，进一步包括：覆盖着所述第二电连接件的焊料掩模。
在所述器件中，所述第二电连接件被所述第一封装部件覆盖。
在所述器件中，所述第二电连接件不与所述第一封装部件相对准。
在所述器件中，所述第二电连接件通过所述第二封装部件中的电连接件与所述第一电连接件电连接。
在所述器件中，所述第二电连接件与位于所述第二封装部件的底面的附加电连接件电连接。
根据本发明的另一方面，提供了一种器件，包括：第一封装部件；以及第二封装部件，包括：第一电连接件，位于所述第二封装部件的顶面，其中，所述第一电连接件通过有源接合件与所述第一封装部件相接合；第二电连接件，位于所述第二封装部件的顶面，其中，所述第二电连接件通过伪接合件与所述第一封装部件相接合；和第三电连接件，位于所述第二封装部件的顶面或底面，其中，所述第二电连接件与所述第三电连接件电连接。
在所述器件中，所述第一封装部件包括与所述第二电连接件相接合的第四电连接件，并且所述第四电连接件是伪连接件。
在所述器件中，所述第四电连接件不与所述第一封装部件的任何其他接合焊盘电连接。
在所述器件中，所述第四电连接件不与所述第一封装部件中的任何功能电路电连接。
在所述器件中，进一步包括：与所述第三电连接件相接合的第三封装部件，其中，所述第三电连接件位于所述第二封装部件的顶面。
在所述器件中，所述第三电连接件位于所述第二封装部件的底面。
在所述器件中，所述第一电连接件、所述第二电连接件和所述第三电连接件具有相同的结构并且由相同的材料形成。
根据本发明的又一方面，提供了一种方法，包括：接合第一封装部件和第二封装部件；以及接合第三封装部件和第四封装部件，其中，所述第二封装部件和所述第四封装部件基本相同，并且所述第二封装部件和所述第四封装部件均包括：第一电连接件，位于所述第二封装部件和所述第四封装部件中的相应一个的顶面，其中，所述第二封装部件的第一电连接件与所述第一封装部件相接合，所述第四封装部件的第一电连接件与所述第三封装部件相接合；和第二电连接件，位于所述第二封装部件和所述第四封装部件中的相应一个的顶面，其中，没有封装部件位于所述第二封装部件的第二电连接件上且与其相接合，并且所述第四封装部件的第二电连接件与上面的封装部件相接合。
在所述方法中，进一步包括：在接合所述第一封装部件的步骤之前，执行第一图案化步骤来图案化所述第二封装部件的顶部介电层并且暴露出所述第二封装部件的第一电连接件，其中，所述第二封装部件的第二电连接件被所述第二封装部件的顶部介电层覆盖；以及在接合所述第三封装部件的步骤之前，执行第二图案化步骤来图案化所述第四封装部件的顶部介电层并且暴露出所述第四封装部件的第一电连接件和第二电连接件。
在所述方法中，所述第一封装部件和第三封装部件相同。
在所述方法中，所述第一封装部件和所述第三封装部件相似或不相同。
在所述方法中，所述第二封装部件的第二电连接件被所述第一封装部件覆盖。
在所述方法中，所述第二封装部件的第二电连接件不与所述第一封装部件对准并且被焊料掩模所覆盖，并且所述方法进一步包括：将第五封装部件与所述第四封装部件的第二电连接件相接合。
附图说明
为了更全面地理解实施例及其优势，现将结合附图所进行的描述作为参考，其中：
图1至图6是根据一些示例性实施例的第一代封装件的制造中间阶段的截面图；
图7至图9是根据一些示例性实施例的第二代封装件的制造中间阶段的截面图；以及
图10示出了包括伪接合的第一代封装件。
具体实施方式
下面，详细讨论本发明各实施例的制造和使用。然而，应该理解，本发明提供了许多可以在各种具体环境中实现的可应用的概念。所讨论的具体实施例仅仅示出了制造和使用本发明的具体方式，而不用于限制本发明的范围。
根据多个示例性实施例提供了一种设计和封装封装部件的方法以及该封装部件的形成方法。示出了形成封装件的中间阶段。论述了封装工艺的变形例。在所有多个视图和说明性的实施例中，类似的参考标号用于示出类似的元件。
图1至图6示出了封装部件10的形成以及使用封装部件10进行封装。图3和图6中的相应的封装件在下文中被称为第一代封装件。图7至图9示出了封装部件100的形成以及使用封装部件100进行封装，该封装部件具有与图1中的封装部件10相同的结构。图9中相应的封装件在下文中被称为第二代封装件。第一代封装件和第二代封装件可以具有类似的功能和类似的结构。例如，图9中的封装部件130可以与图3和图6中的封装部件30相同。图3和图6中的封装部件30以及图9中的封装部件130也可以具有大部分彼此相同的电路，而封装部件30和130的小部分电路(例如，少于百分之10，或少于百分之5)彼此不相同。在一些实施例中，图9中的封装件是图3和图6中的封装件的改进形态。
参考图1，形成了封装部件10。在一些实施例中，封装部件10是中介层。在可选实施例中，封装部件10是封装衬底，诸如分层衬底或堆叠衬底(build-up substrate)。在其他实施例中，封装部件10是印刷电路板(PCB)。封装部件10包括位于顶面10A上的电连接件12(其进一步包括12A和12B)，其中，电连接件12可以包括接合焊盘、焊料凸块、包括覆盖有焊料盖的金属柱的复合电连接件等。电连接14形成在封装部件10中，并且可以互连电连接件12。电连接件12A和12B可以彼此相同或不相同。在一些封装部件10包括界面或封装件衬底的实施例中，电连接件16也被设置在封装部件10中，并且被用来将电连接件12与处在封装部件10的底面10B上的电连接件18相连接，其中，表面10A和10B是封装部件10的相对的面。在可选实施例中，例如，当封装部件10是PCB时，不形成任何电连接来连接封装部件10的底面10B。
在一些实施例中，形成介电层20来覆盖电连接件12，从而使电连接件12与外部的有害物质(诸如，湿气)相隔离。介电层20可以是封装部件10的顶层，或可以是封装部件10的顶部上的附加层。因此，介电层可以或不必被视作为封装部件10的一部分。介电层20可以是焊料掩模，并且由此在整个说明书中被称为焊料掩模20，然而也可以使用其他具有合适的绝缘性能的介电材料。
参考图2，执行图案化步骤来去除焊料掩模20的一些部分，从而暴露出下面的电连接件12。电连接件12B仍被焊料掩模20覆盖。可以通过蚀刻步骤来执行图案化，其中，光刻掩模22被用于例如，通过曝光被用于蚀刻焊料掩模20的光刻胶(未示出)来限定焊料掩模20的图案。光刻掩模22包括用于阻挡光的不透明的图案24以及允许光穿过的透明图案26。尽管图2示出了焊料掩模20的边缘与电连接件12A相互间隔开，然而在可选实施例中，焊料掩模20也覆盖了电连接件12A的边缘部分。
参考图3，封装部件30和/或封装部件32与电连接件12A相接合。封装部件30和32中的每个均可以是其中包括有源器件(诸如，晶体管)的器件管芯，或可以是封装件。封装部件30和32中的每个均还可以是独立的无源器件，诸如电感器、变压器、不平衡转换器等等。电连接件12B不与任何上面的封装部件相接合。电连接件12B可以包括被封装部件30所覆盖的电连接件12B1。电连接件12B另外包括未被任何封装部件所覆盖的电连接件12B2。电连接件12B2也不与封装部件30和32对准。可以通过焊料接合、直接的金属对金属接合等等来接合封装部件30和32。
如图3所示，电连接件12B尽管未被接合，但其仍可以与接合至上面的封装部件30和32的电连接件12A电连接，和/或与处于封装部件10底侧的电连接件18B相连接。因此，尽管电连接件12B未被接合，但电连接件12B可以是或不是电浮置的。在整个说明书中，在封装件中，不与其他封装部件相接合的电连接件12B被称为伪连接件。
图4至图6示出了根据可选实施例形成封装件的中间阶段的截面图。除非另有说明，在这些实施例中，部件的材料和形成方法基本上与图1至图3中所示的实施例中的由类似的参考标号所代表的类似部件相同。因此，可以在图1至图3所示的实施例论述中找到图4至图6中所示的类似部件的细节。参考图4，形成了封装部件10。除了预焊料层(pre-solder layer)23被形成为每个电连接件12的顶部以外，封装部件10基本上与图1所示的封装部件10相同。然后，如图5所示，图案化焊料掩模20，并且暴露出电连接件12A和12B。因此，被用于图案化步骤的光刻掩模122不同于图12中的光刻掩模22。
在下面的步骤中，如图6所示，封装部件30和/或32与电连接件12A相接合，而电连接件12B不与上面的封装部件相接合。在接合工艺之后，可以暴露出焊料层23，并且将其用于保护下面的金属部件。在可选实施例中，当形成了焊料层23时，可以省略焊料掩模20。除了没有焊料掩模20以外，所得到的结构基本上与图6所示的相同。
图7至图9示出了第二代封装件的形成，其中，重复利用封装件10的设计。参考图7，形成了封装部件100。封装部件100可以与图1中的封装部件相同。尤其是不包括焊料掩模20的封装部件10的部分与不包括焊料掩模20的封装部件100的部分相同。图1中的焊料掩模20可以与图7中的焊料掩模20相同或不同。
然后，如图8所示，执行图案化步骤来去除焊料掩模20的一些部分，从而暴露出下面的电连接件12A。可以通过蚀刻步骤来执行图案化，其中，光刻掩模122被用于例如，通过曝光光刻胶(未示出)来限定焊料掩模20的图案，光刻胶被用作为蚀刻焊料掩模20用的蚀刻掩模。光刻掩模122不同于图2中的光刻掩模22。因此，除了电连接件12A以外，暴露出了至少一个电连接件12B。在一些实施例中，暴露出了一个或多个电连接件12B，而一个或多个电连接件12B仍被焊料掩模20所覆盖着。在可选实施例中，暴露出了所有的电连接件12A和12B。
图9示出了将封装部件130、132和/或134与封装部件100相接合。封装部件130、132和134中的每个均可以是在其中包括有有源器件(诸如，晶体管)器件管芯、封装件、独立的无源器件等等。在一些示例性实施例中，图9中的封装部件130和图3或图6中的封装部件30彼此相同。在可选实施例中，封装部件130与图3或图6中的封装部件130类似，但彼此并不相同。例如，封装部件130和封装部件30可以具有90％的彼此相同的电路，而剩余的电路彼此不同。至少一个电连接件12B与上面的封装部件(诸如，130和134，如所示)相接合。在一些实施例中，所有电连接件12B均与上面的封装部件相接合。在可选实施例中(未示出)，一些电连接件12B保持未接合，并且可以在第三代封装件(未示出)中进行接合。未接合的电连接件12B可以被暴露出来，或可以被焊料掩模20所覆盖。
图10示出了根据可选实施例形成的封装件。在这些实施例中，电连接件12A通过有源接合件41与上面的封装部件30和32相接合，该有源接合件可以是例如，焊料接合件。有源接合件41被配置成在相接合的封装部件之间传送电压和/电流。伪接合件40可以由例如，伪焊料凸块40制成。相应的下面的电连接件12B由此也被称作为伪连接件。伪接合40接合了电连接件12B与上面的封装部件30。伪接合件40可以通过封装部件10中的电连接14/16与所得到的封装件的其他部分电连接。因此，在所得到的封装件工作的过程中，可以向伪接合40施加电压/信号。然而，以标记“x”示出的伪接合件40并不与功能电路42电连接，该功能电路可以包括例如，晶体管，以及封装部件30的不与电连接件12A相接合的其他有源接合焊盘31A。因此，没有电流流经伪接合件40。另外，封装部件30包括电连接件31B，该电连接件是伪电连接件，当封装部件30不与封装部件10相接合时，该伪电连接件是电浮置的。在这些实施例中，伪电连接件可以提供机械支撑，并且分担封装件中的应力，然而它们没有电功能。
在采用与封装部件10(图1和图4)以及100(图7)相同的设计的实施例中，设计和制造封装部件100的成本降低。其原因在于图9中的封装件可以是图3和图6中的封装件的后代，当第一代封装件已设计完毕时，额外的电连接件12B和相应的电连接可以重复使用在第二代封装件上。当形成了第二代封装件时，可以进行简单的修改来修正图8中的光刻掩模122，并且节省与封装部件100(图9)的设计相关的，与用于制造封装部件100的光刻掩模的设计和制造相关的成本。
根据实施例，一种器件包括第一封装部件，以及位于第一封装部件下面的第二封装部件。第二封装部件包括位于第二封装部件的顶面上的第一电连接件，其中，第一电连接件与第一封装部件相接合。第二封装部件进一步包括处在第二封装部件的顶面上的第二电连接件，其中，没有封装部件位于第二电连接件上且与其相接合。
根据其他实施例，一种器件包括第一封装部件和第二封装部件。第二封装部件包括位于第二封装部件的顶面上的第一电连接件，其中，第一电连接件通过有源接合件与第一封装部件相接合。第二封装部件进一步包括位于第二封装部件的顶面上的第二电连接件。第二电连接件通过伪接合与第一封装部件相接合。第三电连接件位于第二封装部件的顶面或底面上，其中，第二电连接件与第三电连接件电连接。
根据另外的其他实施例，一种方法包括接合第一封装部件和第二封装部件，以及接合第三封装部件和第四封装部件。第二和第四封装部件彼此大体上是相同的。第二和第四封装部件中的每个均包括处在第二和第四封装部件中相应的一个的顶面上的第一连接件，第二封装部件的第一电连接件与第一封装部件相接合，而第四封装部件的第一电连接件与第三封装部件相接合。第二和第四封装部件中的每个均另外包括处在第二和第四封装部件中的相应的一个的顶面上的第二电连接件，其中，没有封装部件位于第二封装部件的第二电连接件上并且与其相接合，并且其中，第四封装部件的第二电连接件与上面的封装部件相接合。
尽管已经详细地描述了本发明及其优势，但应该理解，可以在不背离所附权利要求限定的本发明主旨和范围的情况下，做各种不同的改变，替换和更改。而且，本申请的范围并不仅限于本说明书中描述的工艺、机器、制造、材料组分、装置、方法和步骤的特定实施例。作为本领域普通技术人员应理解，通过本发明，现有的或今后开发的用于执行与根据本发明所采用的所述相应实施例基本相同的功能或获得基本相同结果的工艺、机器、制造，材料组分、装置、方法或步骤根据本发明可以被使用。因此，所附权利要求应该包括在这样的工艺、机器、制造、材料组分、装置、方法或步骤的范围内。此外，每条权利要求构成单独的实施例，并且多个权利要求和实施例的组合在本发明的范围内。

Claims (10)

1.一种器件，包括：
第一封装部件；以及
第二封装部件，位于所述第一封装部件下面，其中，所述第二封装部件包括：
第一电连接件，位于所述第二封装部件的顶面，其中，所述第一
电连接件与所述第一封装部件相接合；和
第二电连接件，位于所述第二封装部件的顶面，其中，没有封装
部件位于所述第二电连接件之上且与所述第二电连接件相接合。
2.根据权利要求1所述的器件，其中，所述第二电连接件被所述第一封装部件覆盖，并且所述第二电连接件包括作为所述第二电连接件的顶层的预焊料层。
3.根据权利要求1所述的器件，进一步包括：覆盖着所述第二电连接件的焊料掩模。
4.根据权利要求3所述的器件，其中，所述第二电连接件被所述第一封装部件覆盖。
5.根据权利要求3所述的器件，其中，所述第二电连接件不与所述第一封装部件相对准。
6.根据权利要求1所述的器件，其中，所述第二电连接件通过所述第二封装部件中的电连接件与所述第一电连接件电连接。
7.根据权利要求1所述的器件，其中，所述第二电连接件与位于所述第二封装部件的底面的附加电连接件电连接。
8.一种器件，包括：
第一封装部件；以及
第二封装部件，包括：
第一电连接件，位于所述第二封装部件的顶面，其中，所述第一电连接件通过有源接合件与所述第一封装部件相接合；
第二电连接件，位于所述第二封装部件的顶面，其中，所述第二电连接件通过伪接合件与所述第一封装部件相接合；和
第三电连接件，位于所述第二封装部件的顶面或底面，其中，所述第二电连接件与所述第三电连接件电连接。
9.根据权利要求8所述的器件，其中，所述第一封装部件包括与所述第二电连接件相接合的第四电连接件，并且所述第四电连接件是伪连接件。
10.一种方法，包括：
接合第一封装部件和第二封装部件；以及
接合第三封装部件和第四封装部件，其中，所述第二封装部件和所述第四封装部件基本相同，并且所述第二封装部件和所述第四封装部件均包括：
第一电连接件，位于所述第二封装部件和所述第四封装部件中的相应一个的顶面，其中，所述第二封装部件的第一电连接件与所述第一封装部件相接合，所述第四封装部件的第一电连接件与所述第三封装部件相接合；和
第二电连接件，位于所述第二封装部件和所述第四封装部件中的相应一个的顶面，其中，没有封装部件位于所述第二封装部件的第二电连接件上且与其相接合，并且所述第四封装部件的第二电连接件与上面的封装部件相接合。
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