CN103579048A - 片材粘贴装置及片材粘贴方法 - Google Patents

片材粘贴装置及片材粘贴方法 Download PDF

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Publication number
CN103579048A
CN103579048A CN201310315065.0A CN201310315065A CN103579048A CN 103579048 A CN103579048 A CN 103579048A CN 201310315065 A CN201310315065 A CN 201310315065A CN 103579048 A CN103579048 A CN 103579048A
Authority
CN
China
Prior art keywords
unit
raw material
convered structure
sheet
framework
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201310315065.0A
Other languages
English (en)
Chinese (zh)
Inventor
加藤秀昭
高野健
辻本正树
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of CN103579048A publication Critical patent/CN103579048A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H29/00—Delivering or advancing articles from machines; Advancing articles to or into piles
    • B65H29/54—Article strippers, e.g. for stripping from advancing elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H35/00—Delivering articles from cutting or line-perforating machines; Article or web delivery apparatus incorporating cutting or line-perforating devices, e.g. adhesive tape dispensers
    • B65H35/0006—Article or web delivery apparatus incorporating cutting or line-perforating devices
    • B65H35/0013—Article or web delivery apparatus incorporating cutting or line-perforating devices and applying the article or the web by adhesive to a surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2207/00—Indexing codes relating to constructional details, configuration and additional features of a handling device, e.g. Conveyors
    • B65G2207/02—Use of adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2301/00—Handling processes for sheets or webs
    • B65H2301/40—Type of handling process
    • B65H2301/44—Moving, forwarding, guiding material
    • B65H2301/443—Moving, forwarding, guiding material by acting on surface of handled material
    • B65H2301/4433—Moving, forwarding, guiding material by acting on surface of handled material by means holding the material
    • B65H2301/44335—Moving, forwarding, guiding material by acting on surface of handled material by means holding the material using adhesive forces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
CN201310315065.0A 2012-07-27 2013-07-25 片材粘贴装置及片材粘贴方法 Pending CN103579048A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012167565A JP2014027171A (ja) 2012-07-27 2012-07-27 シート貼付装置およびシート貼付方法
JP2012-167565 2012-07-27

Publications (1)

Publication Number Publication Date
CN103579048A true CN103579048A (zh) 2014-02-12

Family

ID=50050541

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310315065.0A Pending CN103579048A (zh) 2012-07-27 2013-07-25 片材粘贴装置及片材粘贴方法

Country Status (4)

Country Link
JP (1) JP2014027171A (ko)
KR (1) KR20140013933A (ko)
CN (1) CN103579048A (ko)
TW (1) TWI623972B (ko)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107428538A (zh) * 2015-03-17 2017-12-01 琳得科株式会社 片材制造装置及制造方法
CN110911523A (zh) * 2015-02-11 2020-03-24 M10 工业股份公司 太阳能电池链的生产方法及设备
US20220208573A1 (en) * 2020-12-28 2022-06-30 Disco Corporation Tape mounter

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6833542B2 (ja) * 2017-02-08 2021-02-24 日東電工株式会社 テープ回収方法およびテープ回収装置
JP6915212B2 (ja) * 2017-07-26 2021-08-04 リンテック株式会社 シート貼付装置およびシート貼付方法
JP6915211B2 (ja) * 2017-07-26 2021-08-04 リンテック株式会社 シート貼付装置およびシート貼付方法
JP7049822B2 (ja) 2017-12-18 2022-04-07 株式会社ディスコ テープ貼着装置
KR102287615B1 (ko) * 2019-09-18 2021-08-10 주식회사 인지디스플레이 인슐레이션 어태치 장치
CN112992523B (zh) * 2021-04-23 2023-03-24 昆山联滔电子有限公司 线圈组装工艺

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006165385A (ja) * 2004-12-09 2006-06-22 Nitto Denko Corp ウエハマウント方法およびこれを用いたウエハマウント装置
CN101418193A (zh) * 2002-07-30 2009-04-29 日立化成工业株式会社 粘接材料带及其制造方法
US20110198038A1 (en) * 2008-10-22 2011-08-18 Lintec Corporation Sheet peeling apparatus and peeling method

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03267246A (ja) * 1990-03-16 1991-11-28 Hitachi Ltd フイルム状物の連続巻出装置
JP4052700B2 (ja) * 1997-11-11 2008-02-27 日東電工株式会社 半導体ウエハの自動貼付け装置
JP2003152058A (ja) * 2001-11-13 2003-05-23 Lintec Corp ウェハ転写装置
KR101019755B1 (ko) * 2009-07-15 2011-03-08 제일모직주식회사 다이접착필름, 다이접착필름 릴 장치 및 이를 포함하는 마운팅 장치
JP5558840B2 (ja) * 2010-01-08 2014-07-23 リンテック株式会社 シート剥離装置及び剥離方法
JP5543813B2 (ja) * 2010-03-23 2014-07-09 日東電工株式会社 ワーク搬送方法およびワーク搬送装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101418193A (zh) * 2002-07-30 2009-04-29 日立化成工业株式会社 粘接材料带及其制造方法
JP2006165385A (ja) * 2004-12-09 2006-06-22 Nitto Denko Corp ウエハマウント方法およびこれを用いたウエハマウント装置
US20110198038A1 (en) * 2008-10-22 2011-08-18 Lintec Corporation Sheet peeling apparatus and peeling method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110911523A (zh) * 2015-02-11 2020-03-24 M10 工业股份公司 太阳能电池链的生产方法及设备
CN110911523B (zh) * 2015-02-11 2023-12-12 M10 工业股份公司 太阳能电池链的生产方法及设备
CN107428538A (zh) * 2015-03-17 2017-12-01 琳得科株式会社 片材制造装置及制造方法
US20220208573A1 (en) * 2020-12-28 2022-06-30 Disco Corporation Tape mounter

Also Published As

Publication number Publication date
KR20140013933A (ko) 2014-02-05
JP2014027171A (ja) 2014-02-06
TW201407677A (zh) 2014-02-16
TWI623972B (zh) 2018-05-11

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PB01 Publication
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Application publication date: 20140212

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