CN103579048A - Sheet attaching device and sheet attaching method - Google Patents
Sheet attaching device and sheet attaching method Download PDFInfo
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- CN103579048A CN103579048A CN201310315065.0A CN201310315065A CN103579048A CN 103579048 A CN103579048 A CN 103579048A CN 201310315065 A CN201310315065 A CN 201310315065A CN 103579048 A CN103579048 A CN 103579048A
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- convered structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H29/00—Delivering or advancing articles from machines; Advancing articles to or into piles
- B65H29/54—Article strippers, e.g. for stripping from advancing elements
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H35/00—Delivering articles from cutting or line-perforating machines; Article or web delivery apparatus incorporating cutting or line-perforating devices, e.g. adhesive tape dispensers
- B65H35/0006—Article or web delivery apparatus incorporating cutting or line-perforating devices
- B65H35/0013—Article or web delivery apparatus incorporating cutting or line-perforating devices and applying the article or the web by adhesive to a surface
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2207/00—Indexing codes relating to constructional details, configuration and additional features of a handling device, e.g. Conveyors
- B65G2207/02—Use of adhesive
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2301/00—Handling processes for sheets or webs
- B65H2301/40—Type of handling process
- B65H2301/44—Moving, forwarding, guiding material
- B65H2301/443—Moving, forwarding, guiding material by acting on surface of handled material
- B65H2301/4433—Moving, forwarding, guiding material by acting on surface of handled material by means holding the material
- B65H2301/44335—Moving, forwarding, guiding material by acting on surface of handled material by means holding the material using adhesive forces
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Dicing (AREA)
Abstract
Provided is a sheet attaching device and sheet attaching method. The sheet attaching device is provided with a framework stocker which can be configured with a plurality of framework receiving units for receiving a plurality of framework components (RF); a support unit (4) supporting the framework components and an object to be attached (WF); a transfer unit used for taking out any received framework component of the plurality of framework receiving units configured in the framework stocker and transferring the framework component to the support unit; a sheet supplying unit (6) possessing a plurality of raw material support components (61) for the raw material (RS) attached with first attaching sheets (AS); a raw material connecting unit (7) used for connecting the terminal area of the raw material of any support in the plurality of raw material support components (61) with the front end area of the raw material of the support of other raw material support components; and an attaching unit (8) used for abutting and attaching the first attaching sheet to the framework components supported by the support unit and the object to be attached.
Description
Technical field
The present invention relates to sheet attaching apparatus and sheet attaching method.
Background technology
At present in ， semiconductor manufacturing process, (for example, reference literature 1: TOHKEMY 2006-165385 communique) to be known to paste the sheet attaching apparatus of adhesive sheet on semiconductor wafer (following, sometimes referred to as wafer) and annular frame.
The sheet attaching apparatus of recording in document 1 forms as follows: possess the multilayer of being filled with and take in the band supply unit of the wafer supply unit of the box of a plurality of wafers, the annular frame supply unit of taking in to multilayer annular frame, supply cutting belt, by the cutting belt from supplying with supply unit being sticked on to the back side of annular frame and wafer and by cutting belt severing, thus by cutting belt, annular frame and wafer is integrated.
But, in the existing sheet attaching apparatus of recording at document 1, because the band supply unit of supplying with as the cutting belt of supplying material can only configure one, therefore have when cutting belt being finished and again cutting belt is set to band supply unit, the operation of this device is forced to stop, the unfavorable condition that the disposal ability of unit interval reduces.
At this, even if possess a plurality of band supply units, but because the annular frame supply unit of supplying with as the annular frame of supplying material also can only configure one, so can not eliminate above-mentioned unfavorable condition completely.In addition, only, by possessing a plurality of band supply units and annular frame supply unit, if other parts are not corresponding with it, as whole device, can not set up.
Summary of the invention
The object of the present invention is to provide a kind of device that do not make to stop just supplying with supplying material, can prevent sheet attaching apparatus and sheet attaching method that the disposal ability of the unit interval of this device reduces.
To achieve these goals, sheet attaching apparatus of the present invention adopts following formation, that is, possess: framework accumulator, its configurable a plurality of framework housing units, this framework housing unit can be taken in a plurality of via the first adhesive sheet and by the integrated frame parts of convered structure; Bearing unit, it supports described frame parts and described by least frame parts in convered structure; Transfer unit, the arbitrary framework housing unit of its option and installment in a plurality of framework housing units of described framework accumulator, takes out and transfers load to described bearing unit by the described frame parts being accommodated in this arbitrary framework housing unit; Feeding sheet materials unit, it has a plurality of raw material support units that support be bonded with the raw material of described the first adhesive sheet temporarily; Raw material linkage unit, it is connected the raw-material terminal area of any supporting in described a plurality of raw material support units with the raw-material front end area by other raw material support unit supporting; Paste unit, it makes described the first adhesive sheet butt and is pasted on the frame parts being supported by described bearing unit or frame parts and by convered structure.
Now, in sheet attaching apparatus of the present invention, preferably, in the described one side by convered structure, be pasted with the second adhesive sheet, described sheet attaching apparatus possesses: peel off with band feed unit, it has supporting and peels off a plurality of band support units with band; Peel off with band linkage unit, its by by a plurality of with any supporting in support unit peel off with the terminal area of band with by other, with peeling off by the front end area of being with of support unit supporting, be connected; Peel off unit, it is pasted on described the second adhesive sheet and this is peeled off with band and gives tension force by peeling off described in general with band, thereby described the second adhesive sheet is peeled off by convered structure from described.
In addition, in sheet attaching apparatus of the present invention, preferably, possesses recovery unit accumulator, its configurable a plurality of recovery units, this recovery unit is taken in from described described the second adhesive sheet being peeled off by convered structure, and the arbitrary recovery unit of described transfer unit option and installment in a plurality of recovery units of described recovery unit accumulator can will be discarded to this arbitrary recovery unit by described the second adhesive sheet after peeling off unit and peeling off.
In addition, in sheet attaching apparatus of the present invention, preferably, possess by convered structure accumulator, they are configurable a plurality of by convered structure housing unit, this can be taken in a plurality of described by convered structure by convered structure housing unit, described transfer unit option and installment in described by convered structure accumulator a plurality of arbitrary by convered structure housing unit by convered structure housing unit, can arbitraryly by described in convered structure housing unit, by convered structure, be taken out and transfer load to described bearing unit by being accommodated in this.
On the other hand, sheet attaching method of the present invention comprises following operation: configure a plurality of framework housing units, it can take in a plurality of via the first adhesive sheet and by the integrated frame parts of convered structure; Support described frame parts and described by least frame parts in convered structure; Select the arbitrary framework housing unit in described a plurality of framework housing unit, the described frame parts being accommodated in this arbitrary framework housing unit is taken out and transfer load to bearing unit; By a plurality of raw material support units, to be bonded with the raw material of described the first adhesive sheet temporarily, supported; The raw-material terminal area of any supporting in described a plurality of raw material support units is connected with the raw-material front end area by other raw material support unit supportings; Make described the first adhesive sheet butt and be pasted on the frame parts being supported by described bearing unit or frame parts and by convered structure.
According to above the present invention, even when the raw material as supplying material are finished in (in the time of will being finished) and framework housing unit in the arbitrary situation during not as the frame parts of supplying material, do not make device stop just can carrying out the replacing of raw-material replacing and framework housing unit, the disposal ability that therefore, can prevent the unit interval of this device reduces.
In addition, even in the situation that peeled off on the second adhesive sheet of the one side of convered structure and by this second adhesive sheet peeling off to be adhered to stick on band, by setting, there are a plurality of band feed units with support unit, peel off with band linkage unit, peel off unit, can not make device stop and sustainable supply as the peeling off with band of supplying material, can prevent that the disposal ability of the unit interval of this device from reducing.
In addition, if be configured to the recovery unit accumulator that configurable a plurality of recovery units are set, or arrange configurable a plurality of by convered structure housing unit by convered structure accumulator, make the transfer unit can be corresponding with it, can obtain effect same as described above.
Accompanying drawing explanation
Fig. 1 is the plane graph of the sheet attaching apparatus of an embodiment of the present invention;
Fig. 2 is that the AR of stickup unit of sheet attaching apparatus is to view;
Fig. 3 is that the BR of raw material linkage unit of sheet attaching apparatus is to view;
Fig. 4 is that the AR that peels off unit of sheet attaching apparatus is to view;
Fig. 5 A is the action specification figure of raw material linkage unit;
Fig. 5 B is the action specification figure of raw material linkage unit;
Fig. 5 C is the action specification figure of raw material linkage unit;
Fig. 5 D is the action specification figure of raw material linkage unit;
Fig. 5 E is the action specification figure of raw material linkage unit;
Fig. 5 F is the action specification figure of raw material linkage unit.
Embodiment
Below, based on accompanying drawing, one embodiment of the present invention is described.
In addition, the X-axis in present embodiment, Y-axis, Z axis are respectively the relation of quadrature, and X-axis and Y-axis are the axle in horizontal plane, and Z axis is the axle with horizontal plane quadrature.In addition, in the present embodiment, the situation about observing from the arrow mark AR direction parallel with Y-axis of take is benchmark, in the situation that representing direction, " on " be Z axis arrow label orientation, D score for its in the other direction, " left side " is that arrow label orientation, " right side " of X-axis is its opposite direction, and the arrow label orientation that " front " is Y-axis, " afterwards " are its opposite direction.
In Fig. 1～Fig. 4, sheet attaching apparatus 1 possesses: by convered structure accumulator 2, its configurable first by convered structure housing unit 2A and second by convered structure housing unit 2B, this first by convered structure housing unit 2A and second by convered structure housing unit 2B can take in a plurality of as one side surperficial WF1 be pasted with the protection sheet material PS(Fig. 2 as the second adhesive sheet) conduct by the wafer W F of convered structure; Framework accumulator 3, its configurable first framework housing unit 3A and the second framework housing unit 3B, this first framework housing unit 3A and the second framework housing unit 3B can take in a plurality of via the adhesive sheet AS(Fig. 2 as the first adhesive sheet) and with the integrated annular frame RF as frame parts of wafer W F; Bearing unit 4, at least annular frame RF in its supporting annular frame RF and wafer W F; Transfer unit 5, its option and installment, in the first framework housing unit 3A of framework accumulator 3 and the arbitrary framework housing unit (3A or 3B) in the second framework housing unit 3B, takes out and transfers load to bearing unit 4 by the annular frame RF being accommodated in this arbitrary framework housing unit (3A or 3B); Feeding sheet materials unit 6, it has raw material to be bonded with adhesive sheet AS temporarily (former anti-) RS(Fig. 2) a plurality of first and second backing roll of backing roll 61(61A, 61B(Fig. 2 as raw material support unit of supporting)); Raw material linkage unit 7, it is connected the terminal area of the raw material RS of any supporting in a plurality of backing rolls 61 with the front end area of the raw material RS being supported by other backing roll; Paste unit 8, it makes adhesive sheet AS butt and is pasted on the annular frame RF being supported by bearing unit 4 or on annular frame RF and wafer W F; Peel off with band feed unit 9, it has supporting and peels off first and second backing roll of backing roll 91(91A, 91B(Fig. 4 with support unit with a plurality of conducts with PT)); Peel off with band linkage unit 10, it will be connected with the front end area of using with PT of peeling off being supported with support unit by other with peeling off with the terminal area with PT of any supporting in support unit 91 by a plurality of; Peel off unit 11, it is pasted on protection sheet material PS and gives tension force to peeling off with band PT by peeling off with band PT, thereby protection sheet material PS is peeled off from wafer W F; Recovery unit accumulator 12, its configurable the first recovery unit 12A and second recovery unit 12B that takes in the protection sheet material PS from wafer W F peels off, this sheet attaching apparatus 1 is supported by framework 13.
By convered structure accumulator 2, possessed and be formed at the first notch 131 of framework 13 and be located at the first notch 131 and can locate and fix first and second by the not shown positioning unit of convered structure housing unit 2A, 2B.First and second is possessed at above-below direction and takes in to multilayer respectively first and second wafer case 21A, the 21B of wafer W F and be provided with below by first and second chassis 20A, the 20B of castor and the not shown rotating rotating-wheel of driving arrangement by convered structure housing unit 2A, 2B, by convered structure accumulator 2 by configurable in the first notch 131 manually or automatically.
Framework accumulator 3 possesses and is formed at the second notch 132 of framework 13 and is located at the second notch 132 and can locates the not shown positioning unit of fixing first and second framework housing unit 3A, 3B.First and second framework housing unit 3A, 3B possess at above-below direction and take in to multilayer respectively first and second frame-box 31A, the 31B of annular frame RF and be provided with below by first and second chassis 30A, the 30B of castor and the not shown rotating rotating-wheel of driving arrangement, and framework accumulator 3 is by configurable in the second notch 132 manually or automatically.
Transfer unit 5 possesses the multi-joint manipulator 51 and the holding unit 52 of being located at the leading section of this multi-joint manipulator 51 as driving arrangement.Multi-joint manipulator 51 is for have what is called 6 axis robot in rotatable joint at six positions, and it is configured to and in the job area of this multi-joint manipulator 51, can makes the wafer W F that kept by holding unit 52 and annular frame RF with optional position, arbitrarily angled movement.As shown in the accompanying drawing of the AR direction representing from mark AA, holding unit 52 possesses at one side 54A and has the discoid maintenance framework 54 of recess 53, the adsorption plate 57 that is disposed at the XY worktable 55 in recess 53 and is supported on the efferent 56 of XY worktable 55, quadrature 2 direction of principal axis in the plane of the face 54A along maintenance framework 54 can make adsorption plate 57 move, and in this plane, can make adsorption plate 57 rotate.Adsorption plate 57 has the adsorption plane 59 that is provided with a plurality of adsorption holes 58, by being connected with multi-joint manipulator 51, thereby is connected with the attraction unit such as not shown drawdown pump and vacuum ejector, can adsorb and keep wafer W F and annular frame RF.In addition, in adsorption plate 57, exist absorption to keep the system of wafer W F and these two systems of system that absorption keeps annular frame RF.In addition, transfer unit 5 also possesses, option and installment in by convered structure accumulator 2 first by convered structure housing unit 2A and second arbitrary by convered structure housing unit (2A or 2B) by convered structure housing unit 2B, will be incorporated in this arbitrary function of being taken out and transfer load to bearing unit 4 by the wafer W F in convered structure housing unit (1A or 2B); , in the first recovery unit 12A of recovery unit accumulator 12 and the arbitrary recovery unit (12A or 12B) in the second recovery unit 12B the protection sheet material PS by after peeling off unit 11 and peeling off is discarded to the function of this arbitrary recovery unit (12A or 12B) with option and installment.
In the left side of transfer unit 5, be provided with the first detecting unit 141, it consists of optical pickocff and camera head, can detect wafer W F outer fringe position, be formed at azimuth mark, circuit pattern ,Hua road (ス ト リ ー ト) or the annular frame RF such as not shown V otch on wafer W F and directional plane outer rim and inner edge position, be located at the otch RF1 of annular frame RF periphery etc.
As shown in Figure 2, feeding sheet materials unit 6 possesses: a plurality of first and second backing roll of backing roll 61(61A, 61B), it sticks on the adhesive sheet AS with bond layer AD via this bond layer AD first and second raw material of raw material RS(RS1, the RS2 of the one side of banded releasing sheet RL temporarily) be bearing in respectively in the one side of substrate sheet BS; Roller holding unit 64, its output shaft 63 by the electric rotating machine 62 as driving arrangement is mounted pivotably, and at its two ends first and second backing roll of difference rotatably support 61A, 61B; A plurality of deflector rolls 65, it guides raw material RS; Peel plate 66, it is by turning back raw material RS and adhesive sheet AS is peeled off from releasing sheet RL; Driven roller 67, it is driven by the electric rotating machine 67A as driving arrangement; Pinch roll 68, it sandwiches releasing sheet RL between this pinch roll 68 and driven roller 67; Recycling roll 69, it drives to reclaim releasing sheet RL by not shown driving arrangement, and the integral body of feeding sheet materials unit 6 is supported by framework 60.In addition, be provided with the second detecting unit 142 below roller holding unit 64, it consists of optical pickocff and camera head etc., can detect the situation of the surplus minimizing of the raw material RS being supported by the backing roll 61 that is positioned at downside.
As shown in Figures 2 and 3, raw material linkage unit 7 possesses: downside absorbing unit 71, and it forms clearance C L in central authorities, and having can be from the maintenance face 711 of the attached maintenance raw material of side draught RS below by the not shown attraction unit such as drawdown pump and vacuum ejector; Upside absorbing unit 72, the top that it is located at downside absorbing unit 71, has by the not shown attraction unit such as drawdown pump and vacuum ejector and can keep from upper face side absorption the maintenance face 721 of raw material RS; Connect with feeding sheet materials unit 73, it is located at the place ahead of upside absorbing unit 72, supplies with the connection sheet material CS that connects raw material RS; Connect with sheet attaching unit 74, it is located at the below connecting with feeding sheet materials unit 73, and connection is sticked on to raw material RS with sheet material CS.In addition, the downside absorbing unit part 71A that is positioned at clearance C L right side can rotate by the electric rotating machine 71B as driving arrangement.
The cutting groove 722 that upside absorbing unit 72 extends before and after the central authorities of maintenance face 721 have, is supported on the output shaft 724 as the straight moving motor 723 of driving arrangement from upper face side.
Connect and possess with feeding sheet materials unit 73: backing roll 731, it supports with stock material RT with the connection that sheet material CS sticks on banded releasing sheet RM via this bond layer AE temporarily the one side at substrate sheet BU being had to the connection of bond layer AE; Deflector roll 732, it guides with stock material RT connecting; Stripper roll 733, it is by turning back connection and from releasing sheet RM, connection is peeled off with sheet material CS with stock material RT; Driven roller 735, it is driven by the electric rotating machine 734 as driving arrangement; Pinch roll 736, it sandwiches releasing sheet RM between this pinch roll 736 and driven roller 735; Recycling roll 737, it is driven and is reclaimed releasing sheet RM by not shown driving arrangement, connect and supported by not shown framework by the integral body of feeding sheet materials unit 73.In addition, connect and be provided with two with feeding sheet materials unit 73 paper orthogonal direction (X-direction) in Fig. 3, be set to can move at this accompanying drawing paper orthogonal direction by the not shown driving arrangements such as linear electric machine.
Connect and possess with sheet attaching unit 74: holding table 741, it has by attraction adsorbable maintenances in unit such as not shown drawdown pump and vacuum ejectors from connecting the maintenance face 742 of sheet material CS for the connection of feeding sheet materials unit 73 supplies of using; As the straight moving motor 744 of driving arrangement, its by output shaft 743 from side bearing holding table 741 below; As the linear electric machine 746 of driving arrangement, it directly moves motor 744 by slide block 745 from below supporting; Cutting knife 747, it is located at the rear end side on the maintenance face 742 of holding table 741.
As shown in Figure 4, peel off with band feed unit 9 and possess: a plurality of first and second backing roll of backing roll 91(91A, 91B), its by be laminated with temperature-sensitive cementability bond layer AG peel off that first and second is peeled off with being with PT1, PT2 with band PT() be bearing in respectively the one side of banded base material band BT; Roller holding unit 94, its output shaft 93 that is used as the electric rotating machine 92 of driving arrangement supports and is rotatable, and at its two ends first and second backing roll of difference rotatably support 91A, 91B; A plurality of deflector rolls 95, it guides peeling off with band PT; Front end bearing unit 96, its supporting is peeled off by the front end area with PT; Pullout unit 97, it will be peeled off with band PT and pull out; Peel off with band and paste unit 98, it will be peeled off with band PT and stick on protection sheet material PS; Cutting unit 99, it will be peeled off with band PT and cut off, and this is peeled off with being supported on framework 90 with feed unit 9 via not shown support etc.In addition, be provided with the 3rd detecting unit 143 below roller holding unit 94, it consists of optical pickocff and camera head etc., can detect by the situation with the surplus minimizing with PT of peeling off that is positioned at backing roll 91 supportings of downside.
Front end bearing unit 96 possesses sleeve 961, free to advance or retreat the bar 962 that is supported on sleeve 961, have the front end that is fixed on bar 962 cutting groove 963 with support plate 964, by with support plate 964 helical spring 965 of the direction application of force left.
Pullout unit 97 possess utilize a pair of control pawl 971 control peel off with the chuck cylinder as driving arrangement (チ ャ ッ Network シ リ Application ダ) 972 of PT, utilize the linear electric machine 974 as driving arrangement of slide block 973 supporting chuck cylinders 972.
Peel off and with band, paste unit 98 and possess the press head 983 be located at as the bottom of the output shaft 982 of the straight moving motor 98l of driving arrangement, these press head 983 lower ends are pressed to the heating units 985 such as face 984 winding heater that heat and infrared heater.
Peel off with being the formation same with above-mentioned raw material linkage unit 7 with linkage unit 10, by the mark that is 7 by the numbering beginning in raw material linkage unit 7 as illustrated in fig. 3, changing 10 into can describe, and therefore their description is omitted.
In addition, be provided with the 4th and the 5th detecting unit 144,145 in the left side of three cuts portion 133, it consists of optical pickocff and camera head etc., can detect the amount of the protection sheet material PS being incorporated in first and second recovery unit 12A, 12B.
In the sheet attaching apparatus 1 above, the order of pasting adhesive sheet AS on wafer W F and annular frame RF describes.
First, as shown in Figure 2, first and second raw material RS1, RS2 are placed in respectively to first and second backing roll 61A, 61B is upper and utilizes the maintenance face 721 of upside absorbing unit 72 to adsorb the front end area that keeps the second raw material RS2.In addition, as shown in Figure 4, first and second is peeled off with being placed in respectively first and second backing roll 91A with PT1, PT2,91B is upper and utilizes maintenance face 1021 absorption of upside absorbing unit 102 to keep second to peel off by the front end area with PT2.In addition, as shown in Figure 3, by connect with stock material RT be placed in respectively by raw material RS with and peel off with using and be respectively provided with respectively the feeding sheet materials unit 73(103 for connection of two with PT) each backing roll 721,1031 on, each connection is separately fixed to recycling roll 737,1037 with the front end of stock material RT.
In addition, as shown in Figure 1, first and second that take in wafer W F is placed in by convered structure accumulator 2 by convered structure housing unit 2A, 2B, first and second framework housing unit 3A, the 3B that take in annular frame RF are placed in to framework accumulator 3, first and second recovery unit 12A, the 12B of empty state are placed in to recovery unit accumulator 12.
After accomplishing the setting up as described above, transfer unit 5 drives multi-joint manipulator 51, makes holding unit 52 insert the inside of the first wafer case 21A and after adsorption plane 59 is contacted with wafer W F, drives not shown attraction unit, and absorption keeps this wafer W F.Then, transfer unit 5 drives multi-joint manipulator 51, makes wafer W F move to the position that can be detected by the first detecting unit 141, drives XY worktable 55, makes wafer W F rotation predetermined angular.Thus, the first detecting unit 141 detects the outer fringe position of wafer W F and not shown incision site, exports these all data to not shown control unit.All data of wafer W F are inputted after not shown control unit, calculate the center of wafer W F, transfer unit 5 drives XY worktable 55 and multi-joint manipulators 51, so that the center of wafer W F and not shown incision site become on the bearing-surface 41 that the mode of the position of regulation is positioned in workbench 42.
Then, transfer unit 5 drives multi-joint manipulator 51, makes holding unit 52 insert the inside of the first framework accumulator 31A and after adsorption plane 59 is contacted with annular frame RF, drives not shown attraction unit, and absorption keeps this annular frame RF.Then, transfer unit 5 drives multi-joint manipulator 51, make annular frame RF move to the position that can be detected by the first detecting unit 141, same action when the first detecting unit 141 carries out with above-mentioned wafer W F, afterwards, become the center state consistent with the center of the wafer W F of workbench 42 upper supports at the peristome of annular frame RF, and, the otch RF1 of annular frame RF, towards the state of the direction of regulation, loads this annular frame RF on the bearing-surface 41 of workbench 42.
Then, bearing unit 4 drives linear electric machines 44, make workbench 42 left direction move, when not shown detecting unit detects the position of wafer W F and annular frame RF arrival regulation, synchronize with the movement of workbench 42, feeding sheet materials unit 6 drives electric rotating machine 67A, exports the first raw material RS1.Thus, adhesive sheet AS is peeled off from releasing sheet RL by peel plate 66, adhesive sheet AS after peeling off is by sticking on by pressure roller 81 on wafer W F and annular frame RF, as shown in double dot dash line in Fig. 2, form wafer W F via adhesive sheet AS with the integrated wafer supporting body of annular frame RF WK.Form like this after wafer supporting body WK, by not shown detecting unit, detected, bearing unit 4 stops linear electric machine 44.And, transfer unit 5 drives multi-joint manipulator 51, lifts and make it to spin upside down wafer supporting body WK, and the not shown handing-over unit with the absorption bearing-surface relative with bearing-surface 41 is given in handing-over, by again loading in bearing-surface 41, wafer supporting body WK is turned upside down.Afterwards, bearing unit 4 drives linear electric machines 44, make workbench 42 left direction move.
Then, when not shown detecting unit detects the position of wafer supporting body WK arrival regulation, peel off with driving linear electric machine 974 with feed unit 9 making to control under the state that pawl 971 separates, the pawl 971 of controlling that is positioned at below is pressed into band support plate 964 to sleeve 961 directions, first peels off the front end area of using with PT1 enters upper and lower controlling between pawl 971.Then, peel off with band feed unit 9 drive chuck cylinders 976, will control pawl 971 closed and utilize and control pawl 971 and control first and peel off by the front end area with PT1.Then, peel off with band feed unit 9 driving linear electric machines 974, by first, peel off with band PT1 and pull out specific length and stop, driving straight moving motor 981, depress press head 983, utilization is pressed face 984 and is peeled off with band PT1 and be pressed on protection sheet material PS first.Now, peel off with band and paste unit 98 driving heating units 985, will press face 984 heating and peel off with band PT1 and stick on protection sheet material PS first.Afterwards, peel off with band feed unit 9 and drive cylinders 993, make it rise to cut off first after cutting knife 991 is declined and peel off with band PT1.
Then, double as the bearing unit 4 of peeling off unit 11 and drive linear electric machines 44, by make workbench 42 left direction move, protection sheet material PS is peeled off from wafer W F.And transfer unit 5 drives multi-joint manipulator 51, the protection sheet material PS after making adsorption plane 59 and peeling off contacts and drives not shown attraction unit, and absorption keeps this protection sheet material PS and discards to the first recovery unit 12A.In addition; the wafer supporting body WK that has peeled off protection sheet material PS by not shown conveyance unit conveyance to other operations; each portion that workbench 42 turns back to the ，Ge unit, position 9,10,11 shown in solid line in Fig. 1 revert to initial position, repeats and above-mentioned same action later.
As previously discussed, from the first wafer case 21A, take out whole wafer W F, transfer unit 5 carries out taking out wafer W F and loading in the action of bearing unit 4 from the second wafer case 21B,, if it is empty that the first or second wafer case 21A, 21B become, 5 of transfer unit carry out taking out from other the first or second wafer case 21A, 21B the selection action of wafer W F.In addition, same as above, empty if the first or second frame- box 31A, 31B become, transfer unit 5 carries out taking out from other the first or second frame- box 31A, 31B the selection action of annular frame RF.In addition, same as above, if the protected sheet material PS of the first or second collection box 121A, 121B fills up, transfer unit 5 carries out protection sheet material PS to discard to the selection action of other the first or second collection box 121A, 121B.
And, 5 moment of having carried out selection action in transfer unit, not shown control unit drives the warning unit such as not shown warning generating unit and lighting unit, and a certain wafer case (21A, 21B) and frame-box (31A, 31B) are become to advisory empty and that a certain collection box (121A, 121B) is filled to operator.Thus, operator will become empty by convered structure housing unit (2A, 2B) and framework housing unit (3A, 3B), the recovery unit (12A that fills up, 12B), respectively from by convered structure accumulator 2, framework accumulator 3,12 separation of recovery unit accumulator, being placed in respectively by convered structure accumulator 2, framework accumulator 3, recovery unit accumulator 12 by convered structure housing unit (2A, 2B), the framework housing unit (3A, 3B) of taking in annular frame RF, empty recovery unit (12A, 12B) of wafer W F will be taken in.
Thus, when supplementing wafer W F and annular frame RF, do not need to stop the operation of sheet attaching apparatus 1.
In addition, repeat the gluing treatment of above-mentioned adhesive sheet AS, if detecting the surplus of the first raw material RS1, reduces the second detecting unit 142, the in the situation that of present embodiment, if light-receiving device detects the light of light projector, raw material linkage unit 7 drives straight moving motor 744, make holding table 741 increase, the maintenance face of making 742, with after the substrate sheet BU butt being connected with sheet material CS, drives not shown attraction unit, utilizes 742 absorption of maintenance face to keep this connection sheet material CS.Then, raw material linkage unit 7 drives electric rotating machine 734, be connected with the action of stock material RT and synchronously drive linear electric machine 746 with output, by holding table 741 is rearward moved, utilize stripper roll 733 that connection is peeled off from releasing sheet RM with sheet material CS, as shown in double dot dash line in Fig. 3, the connection of peeling off is remained on holding table 741 with sheet material CS.And, in the moment that stops the output of the first raw material RS1, raw material linkage unit 7 drives not shown attraction unit, utilize the maintenance face 711 of downside absorbing unit 71 to adsorb after the back-end region of the releasing sheet RL that keeps the first raw material RS1, as shown in Figure 5A, drive straight moving motor 723, by upside absorbing unit 72 is declined, the back-end region of the releasing sheet RL of the first raw material RS1 is contacted with the front end area of the releasing sheet RL of the second raw material RS2.Then, raw material linkage unit 7 drives linear electric machine 746, and by holding table 741 is rearward moved, as shown in Figure 5 B, cutting knife 747 passes through in cutting groove 722, and cuts off the intersection of the first raw material RS1 and the second raw material RS2.Thus, the leftward position of the off-position in the first raw material RS1 forms the first raw material rearward end RS11, and forms the first raw material redundance RS12 in the right positions of off-position.In addition, the right positions of the off-position in the second raw material RS2 forms the second raw material leading section RS21, and forms the second raw material redundance RS22 in the leftward position of off-position.
After the cut-out of intersection finishes, the connection of being supported by holding table 741 is the position under the off-position of the first raw material RS1 and the second raw material RS2 with sheet material CS, and raw material linkage unit 7 stops the driving of linear electric machine 746.Afterwards, as shown in Figure 5 C, raw material linkage unit 7 drives electric rotating machine 71B, and downside absorbing unit part 71A is rotated downwards, makes the first raw material redundance RS12 separated from the second raw material leading section RS21.
And, as shown in Figure 5 D, raw material linkage unit 7 drives straight moving motor 744, makes holding table 741 increase and connection is sticked on to the first raw material rearward end RSl1 and the second raw material leading section RS21 with sheet material CS, connects the first raw material RS1 and the second raw material RS2.
Then, as shown in Fig. 5 E, raw material linkage unit 7 is controlled not shown attraction unit, stop the subregional attraction of right-hand part in Fig. 5 E on maintenance face 721, drive straight moving motor 723, by making upside absorbing unit 72 increase, make the second raw material redundance RS22 separated from the first raw material rearward end RS11, the absorption at maintenance face 711 and maintenance face 742 that stops the attraction unit based on not shown keeps.Afterwards, raw material linkage unit 7 drives straight moving motor 744 and linear electric machine 746, and by making holding table 741 revert to the position shown in solid line in Fig. 3, the connection of the front end area of the back-end region of the first raw material RSl and the second raw material RS2 finishes.Afterwards, feeding sheet materials unit 6 drives electric rotating machine 62, and roller holding unit 64 is counterclockwise rotated in Fig. 2, makes the second backing roll 61B that supports the second raw material RS2 be positioned at downside.
In addition, first and second raw material redundance RS12, RS22 are reclaimed by not shown recovery unit.In addition, operator removes the volume cores such as the paper tube of the first raw material RS1 that remains in the first backing roll 61A, the first new raw material RS1 is bearing in to the first backing roll 61A, utilizes the front end area of maintenance face 721 these first raw material of absorption maintenance RS1 of upside absorbing unit 72.
According to such formation, when supplementing raw material RS without the operation that stops sheet attaching apparatus 1.
In addition; by repeating the lift-off processing of above-mentioned protection sheet material PS; if the 3rd detecting unit 143 detects first and peels off with the surplus minimizing with PT1; the light of light projector in the situation that of present embodiment, for light-receiving device, detected, peel off with carry out the action same with raw material linkage unit 7 with linkage unit 10 and peel off with peeling off with the back-end region and second of PT1 by the front end area with PT2 to be connected first.According to such formation, peel off when with PT without the operation that stops sheet attaching apparatus 1 supplementing.
In addition, if by not shown detecting unit detect connect for feeding sheet materials unit 73(103) connection by the residue of sheet material CS, tail off, raw material linkage unit 7(10) drive the not shown driving arrangements such as linear electric machine, make to connect with feeding sheet materials unit 73(103) to X-direction, move, make new connection be positioned at holding table 741(1041 with stock material RT) on.By such formation, when supplement connecting with sheet material CS without the operation that stops sheet attaching apparatus 1.
According to above present embodiment, there is following effect.
; even at the wafer W F as supplying material, annular frame RF, raw material RS, peel off while being finished with band PT, raw material in arbitrary situation when (in the time of will being finished) and recovery unit are filled up; do not make sheet attaching apparatus 1 stop just can changing; the disposal ability that therefore, can prevent the unit interval of this sheet attaching apparatus 1 reduces.In addition, can reduce owing to worrying that the disposal ability of sheet attaching apparatus 1 reduces, operator must be in a hurry supplies with numerous and diverse property of this sheet attaching apparatus 1 by annular frame RF and adhesive sheet AS.
As mentioned above, in above-mentioned record, disclose for implementing preferred formation of the present invention, method etc., but the invention is not restricted to this.; the present invention relates generally to specific execution mode and illustrates especially and be illustrated; but those skilled in the art are not within departing from the scope of technological thought of the present invention and object; can, to above-described execution mode, in shape, material, quantity, other detailed formation, carry out various distortion.In addition, the record that defines above-mentioned disclosed shape, material etc. is exemplarily to record in order easily to understand the present invention, therefore do not limit the present invention, the record in the title of the parts except their part or all restriction of the restrictions such as shape, material is also contained in the present invention.
For example, can on workbench 42, only load annular frame RF, on this annular frame RF, paste adhesive sheet AS.
In addition, the pressing component of the formations such as sheet material, rubber, resin, sponge can be replaced adopting by pressure roller 81, also the formation of pressing by gas spray attachment can be adopted.
In addition, can replace peel plate 66 and adopt the peeling member being formed by roller etc., also can replace stripper roll 733(1033) and employing peel plate.
In addition, by convered structure housing unit 2A, 2B, framework housing unit 3A, 3B, recovery unit 12A, 12B, backing roll 61A, 61B, backing roll 91A, 91B, can be arranged more than three.
In addition, can make by convered structure housing unit 2A, 2B, framework housing unit 3A, 3B, recovery unit 12A, 12B at least any can not be from framework 13 separation.
In addition, can peel off with band PT1 and second and peel off with band PT2 and be connected by heat first.
In addition, being not particularly limited by the classification of convered structure and adhesive sheet AS and material etc. in the present invention, for example, and can be for there is the sheet material in intermediate layer between substrate sheet and bond layer, also can be for thering are three layers of above sheet material such as other layer of grade.In addition; semiconductor wafer can example semiconductor silicon wafer and compound semiconductor wafer etc.; the adhesive sheet of pasting on this semiconductor wafer is not limited to protect sheet material, cutting belt, chip attachment film (ダ イ ア タ ッ チ Off ィ Le system), can use the adhesive sheet etc. of purposes, shape arbitrarily of sheet material, film, band etc. arbitrarily.In addition, by convered structure, can be the substrate of CD, adhesive sheet can have the resin bed that forms recording layer.As by convered structure, be not limited only to other parts such as glass plate, steel plate, substrate, the parts of form and article etc. can become object arbitrarily.In addition, on the surface of wafer, being formed with the parts of pattern circuit also can be as object.
Driving arrangement in above-mentioned execution mode is except adopting electric rotating machine, the electrical equipment such as moving motor, linear electric machine, single-shaft mechanical arm, multi-joint manipulator directly, cylinder, hydraulic cylinder, without outside actuators such as bar cylinder and rotary cylinder etc., also can use they direct or indirect parts of combination (have with execution mode in the formation that repeats of the parts of example).
Claims (5)
1. a sheet attaching apparatus, is characterized in that, possesses:
Framework accumulator, its configurable a plurality of framework housing units, this framework housing unit can be taken in a plurality of via the first adhesive sheet and by the integrated frame parts of convered structure;
Bearing unit, it supports described frame parts and described by least frame parts in convered structure;
Transfer unit, the arbitrary framework housing unit of its option and installment in a plurality of framework housing units of described framework accumulator, takes out and transfers load to described bearing unit by the described frame parts being accommodated in this arbitrary framework housing unit;
Feeding sheet materials unit, it has a plurality of raw material support units that support be bonded with the raw material of described the first adhesive sheet temporarily;
Raw material linkage unit, it is connected the raw-material terminal area of any supporting in described a plurality of raw material support units with the raw-material front end area by other raw material support unit supporting;
Paste unit, it makes described the first adhesive sheet butt and is pasted on the frame parts being supported by described bearing unit or frame parts and by convered structure.
2. sheet attaching apparatus as claimed in claim 1, is characterized in that,
In the described one side by convered structure, be pasted with the second adhesive sheet,
Described sheet attaching apparatus possesses:
Peel off with band feed unit, it has supporting and peels off a plurality of band support units with band;
Peel off with band linkage unit, its by by a plurality of with any supporting in support unit peel off with the terminal area of band with by other, with peeling off by the front end area of being with of support unit supporting, be connected;
Peel off unit, it is pasted on described the second adhesive sheet and this is peeled off with band and gives tension force by peeling off described in general with band, thereby described the second adhesive sheet is peeled off by convered structure from described.
3. sheet attaching apparatus as claimed in claim 2, is characterized in that,
Possess recovery unit accumulator, its configurable a plurality of recovery units, this recovery unit is taken in from described described the second adhesive sheet being peeled off by convered structure,
The arbitrary recovery unit of described transfer unit option and installment in a plurality of recovery units of described recovery unit accumulator, can will be discarded to this arbitrary recovery unit by described the second adhesive sheet after peeling off unit and peeling off.
4. the sheet attaching apparatus as described in any one in claim 1～3, is characterized in that,
Possess by convered structure accumulator, they are configurable a plurality of by convered structure housing unit, and this can be taken in a plurality of described by convered structure by convered structure housing unit,
Described transfer unit option and installment in described by convered structure accumulator a plurality of arbitrary by convered structure housing unit by convered structure housing unit, can arbitraryly by described in convered structure housing unit, by convered structure, be taken out and transfer load to described bearing unit by being accommodated in this.
5. a sheet attaching method, is characterized in that, comprises following operation:
Configure a plurality of framework housing units, it can take in a plurality of via the first adhesive sheet and by the integrated frame parts of convered structure;
Support described frame parts and described by least frame parts in convered structure;
Select the arbitrary framework housing unit in described a plurality of framework housing unit, the described frame parts being accommodated in this arbitrary framework housing unit is taken out and transfer load to bearing unit;
By a plurality of raw material support units, to be bonded with the raw material of described the first adhesive sheet temporarily, supported;
The raw-material terminal area of any supporting in described a plurality of raw material support units is connected with the raw-material front end area by other raw material support unit supportings;
Make described the first adhesive sheet butt and be pasted on the frame parts being supported by described bearing unit or frame parts and by convered structure.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012-167565 | 2012-07-27 | ||
| JP2012167565A JP2014027171A (en) | 2012-07-27 | 2012-07-27 | Sheet sticking device and sheet sticking method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103579048A true CN103579048A (en) | 2014-02-12 |
Family
ID=50050541
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310315065.0A Pending CN103579048A (en) | 2012-07-27 | 2013-07-25 | Sheet attaching device and sheet attaching method |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2014027171A (en) |
| KR (1) | KR20140013933A (en) |
| CN (1) | CN103579048A (en) |
| TW (1) | TWI623972B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107428538A (en) * | 2015-03-17 | 2017-12-01 | 琳得科株式会社 | Sheet production apparatus and manufacture method |
| CN110911523A (en) * | 2015-02-11 | 2020-03-24 | M10 工业股份公司 | Method and device for producing solar cell chain |
| US20220208573A1 (en) * | 2020-12-28 | 2022-06-30 | Disco Corporation | Tape mounter |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6833542B2 (en) * | 2017-02-08 | 2021-02-24 | 日東電工株式会社 | Tape collection method and tape collection device |
| JP6915212B2 (en) * | 2017-07-26 | 2021-08-04 | リンテック株式会社 | Sheet pasting device and sheet pasting method |
| JP6915211B2 (en) * | 2017-07-26 | 2021-08-04 | リンテック株式会社 | Sheet pasting device and sheet pasting method |
| JP7049822B2 (en) | 2017-12-18 | 2022-04-07 | 株式会社ディスコ | Tape sticking device |
| KR102287615B1 (en) * | 2019-09-18 | 2021-08-10 | 주식회사 인지디스플레이 | Insulation attach apparatus |
| CN112992523B (en) * | 2021-04-23 | 2023-03-24 | 昆山联滔电子有限公司 | Coil assembling process |
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| JP5558840B2 (en) * | 2010-01-08 | 2014-07-23 | リンテック株式会社 | Sheet peeling apparatus and peeling method |
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- 2012-07-27 JP JP2012167565A patent/JP2014027171A/en active Pending
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- 2013-07-16 KR KR1020130083376A patent/KR20140013933A/en not_active Application Discontinuation
- 2013-07-25 CN CN201310315065.0A patent/CN103579048A/en active Pending
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| CN101418193A (en) * | 2002-07-30 | 2009-04-29 | 日立化成工业株式会社 | Adhesive material tape and method of producing the same |
| JP2006165385A (en) * | 2004-12-09 | 2006-06-22 | Nitto Denko Corp | Wafer mounting method and wafer mounting equipment using the same |
| US20110198038A1 (en) * | 2008-10-22 | 2011-08-18 | Lintec Corporation | Sheet peeling apparatus and peeling method |
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| CN110911523A (en) * | 2015-02-11 | 2020-03-24 | M10 工业股份公司 | Method and device for producing solar cell chain |
| CN110911523B (en) * | 2015-02-11 | 2023-12-12 | M10 工业股份公司 | Method and apparatus for producing solar cell chain |
| CN107428538A (en) * | 2015-03-17 | 2017-12-01 | 琳得科株式会社 | Sheet production apparatus and manufacture method |
| US20220208573A1 (en) * | 2020-12-28 | 2022-06-30 | Disco Corporation | Tape mounter |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201407677A (en) | 2014-02-16 |
| TWI623972B (en) | 2018-05-11 |
| JP2014027171A (en) | 2014-02-06 |
| KR20140013933A (en) | 2014-02-05 |
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