CN103531504A - Sheet adhesion apparatus and sheet adhesion method - Google Patents
Sheet adhesion apparatus and sheet adhesion method Download PDFInfo
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- CN103531504A CN103531504A CN201310283590.9A CN201310283590A CN103531504A CN 103531504 A CN103531504 A CN 103531504A CN 201310283590 A CN201310283590 A CN 201310283590A CN 103531504 A CN103531504 A CN 103531504A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68368—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used in a transfer process involving at least two transfer steps, i.e. including an intermediate handle substrate
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a sheet adhesion apparatus and a sheet adhesion method. The sheet adhesion apparatus (1) includes a frame receiving unit (3) which can receive a plurality of ring frames (RF) integrated with wafers (WF) by adhesion sheets (AS); a support unit (7) which supports at least the ring frames (RF) of the ring frames (RF) and the wafers (WF); a transfer unit (8) which gets the ring frames (RF) from the frame receiving unit (3) and transfers the ring frames (RF) to the support unit (7); and an adhesion unit (9) which makes the adhesion sheets (AS) to abut against and be adhered to the ring frames (RF), or the ring frames (RF) and the wafers (WF) supported by the support unit (7), wherein the frame receiving unit (3) is capable of receiving the ring frames (RF) vertically.
Description
Technical field
The present invention relates to paste sheet attaching apparatus and the sheet attaching method of adhesive sheet.
Background technology
At present, be known to paste splicing tape and on this is pasted with the annular frame of splicing tape, paste the erecting device of semiconductor wafer (following, sometimes referred to as wafer) at annular frame that (for example, reference literature 1: TOHKEMY 2005-33119 communique).
The erecting device of the document 1 forms as follows,, possess: the annular frame supply unit that the flat overlapping facing to horizontal plane direction lamination of annular frame is received, annular frame carrying mechanism adsorbs successively a sheet by a sheetly keep this annular frame of being received by flat overlapping and be carried to the position of pasting splicing tape from upside.
But, in the such formation of document 1, owing to receiving the formation of annular frame for the flat overlapping of annular frame supply unit, so there is operator's both hands supporting annular frame of having to, supplied with the unfavorable condition of annular frame supply unit.Particularly, in the situation that large-scale annular frame, to antigravity and the singlehanded annular frame that makes is that flat folded posture is very difficult, moreover in order not make the operating efficiency of device decline and once supply with multiple annular frames, if both hands supporting is not carried out operation and can not be carried out flat overlapping and receive.
Summary of the invention
The object of the present invention is to provide a kind of sheet attaching apparatus and the sheet attaching method that can easily supply with frame parts.
To achieve these goals, sheet attaching apparatus of the present invention possesses: framework housing unit, its can take in a plurality of via adhesive sheet with by the integrated frame parts of convered structure; Bearing unit, it supports described frame parts and described by least frame parts in convered structure; Transfer unit, it takes out and transfers load to described bearing unit from described framework housing unit by described frame parts; Paste unit, it makes described adhesive sheet butt and is pasted on the frame parts being supported by described bearing unit or frame parts and by convered structure, and described framework housing unit can vertically be taken in described frame parts.
Now, in sheet attaching apparatus of the present invention, preferably, described framework housing unit possesses the application of force unit to a direction application of force by described frame parts.
In addition, in sheet attaching apparatus of the present invention, preferably, described framework housing unit has makes the posture that move to a direction bottom of described frame parts maintain unit.
In addition, in sheet attaching apparatus of the present invention, preferably, described framework housing unit has the unit of pressing that prevents from simultaneously being taken out by described transfer unit a plurality of described frame partss.
On the other hand, sheet attaching method of the present invention, vertically taken in a plurality of via adhesive sheet with by the integrated frame parts of convered structure, described frame parts is transferred load to described frame parts and the described bearing unit being supported by least frame parts in convered structure, make described adhesive sheet butt and be pasted on the frame parts being supported by described bearing unit or frame parts and by convered structure.
According to above the present invention, because framework housing unit can vertically be taken in frame parts, so operator can easily supply with housing unit by frame parts.Particularly, in the situation that frame parts has opening in this wise as annular frame, operator can supply with palm and finger insertion peristome to grab the mode of extension annular frame, even so be for example large-scale annular frame, also can non-confrontational gravity and form vertical stack posture, can once and by one hand multiple annular frames be supplied with to housing unit.
In addition, " vertically " in the present invention refers to when frame parts is remained on to the position of departing from center of gravity, this frame parts with the direction along being pulled by gravity towards and mounting state.
Now, if framework housing unit is provided with application of force unit, transfer unit can always keep frame parts and carry out transfer at same position.
In addition, if framework housing unit is provided with posture, maintain unit, transfer unit can keep and transfer is always the frame parts of same posture.
In addition, if framework housing unit is provided with, press unit, while taking out frame parts in transfer unit, can also take out the frame parts of adjacency simultaneously and prevent that it is at random.
Accompanying drawing explanation
Fig. 1 is the plane graph of the sheet attaching apparatus of an embodiment of the present invention;
Fig. 2 A is the profile of framework housing unit;
Fig. 2 B is the action specification figure of transfer unit;
Fig. 2 C is the action specification figure of transfer unit;
Fig. 3 is that the BB of Fig. 2 B is to view.
Embodiment
Below, with reference to the accompanying drawings an embodiment of the present invention is described.
In addition, the X-axis in present embodiment, Y-axis, Z axis are respectively the relation of quadrature, and X-axis and Y-axis are the axle in horizontal plane, and Z axis is the axle with horizontal plane quadrature.In addition, in the present embodiment, the situation about observing from the arrow mark AR direction parallel with Y-axis of take is benchmark, in the situation that representing direction, " on " be Z axis arrow label orientation, D score for its in the other direction, " left side " is that arrow label orientation, " right side " of X-axis is its opposite direction, and the arrow label orientation that " front " is Y-axis, " afterwards " are its opposite direction.
In Fig. 1, sheet attaching apparatus 1 is supported by framework 10, and possesses: wafer storage unit 2, and it can take in a plurality of conducts by the wafer W F of convered structure; Framework housing unit 3, its can take in a plurality of via adhesive sheet AS with the integrated annular frame RF as frame parts of wafer W F; Bearing unit 7, at least annular frame RF in its supporting annular frame RF and wafer W F; Transfer unit 8, it takes out and transfers load to bearing unit 7 by wafer W F and annular frame RF from wafer storage unit 2 and framework housing unit 3; Paste unit 9, it makes adhesive sheet AS butt and sticks on the annular frame RF that is supported unit 7 supportings or on annular frame RF and wafer W F.
At this, at the outer peripheral face of annular frame RF, be provided with the planar portions RF1 that is located at interval at 90 ° everywhere, be configured in curved face part RF2 everywhere between adjacent planar portions RF1, the V otch RF3 of the curved face part RF2 at two adjacent places in being configured in curved face part RF2 everywhere respectively respectively, in inner side, be formed with peristome RF4.
Also as shown in Figure 2 A, framework housing unit 3A can vertically take in annular frame RF and form, possess take in annular frame RF frame-box 31A, will be accommodated in application of force unit 40 to a direction (right side) application of force of annular frame RF in this receiver 30, make the bottom of annular frame RF maintain unit 50 to the mobile posture of a direction (right side).
Application of force unit 40 have bottom surface sections be located at 31 inside a pair of driving arrangement of conduct linear electric machine 41, by being formed on the peristome 36 above of bottom surface sections 31, the slide block of linear electric machine separately 42 is linked to the force application board 43 arranging.
Posture maintains unit 50 to be had: driving pulley 52, and it is located at the inside of bottom surface sections 31, and is supported by pair of frames 55, by the electric rotating machine 51 as driving arrangement, rotatably arranges; Driven pulley 53, it is rotatably supported in this framework 55; Endless belt 54, it is wound on driving pulley 52 and driven pulley 53, and with above by peristome 36 be positioned at than bottom surface sections 31 above slightly the mode of the position of top arrange.
In the left side of transfer unit 8, be provided with azimuth marks such as can detecting the outer fringe position of wafer W F, the not shown V otch that is formed at wafer W F and directional plane, circuit pattern ,Hua road (ス ト リ ー ト) or annular frame RF outer rim and inner edge position, be located at the detecting unit being formed by optical pickocff and camera head etc. 89 of the otch RF3 etc. of annular frame RF periphery.
As shown in mark AA in Fig. 1 from shown in the accompanying drawing of AR direction, paste unit 9 and possess: bolster 91, it supports adhesive sheet AS is bonded in to the raw material RS of the one side of banded releasing sheet RL temporarily; Peel plate 92, it turns back releasing sheet RL and adhesive sheet AS is peeled off; As press unit by pressure roller 93, its adhesive sheet AS butt after making to peel off also sticks on wafer W F; Driven roller 95, it is driven and is rotated by the electric rotating machine 94 as driving arrangement; Pinch roll 96, sandwiches releasing sheet RL by this pinch roll 96 and driven roller 95; Recycling roll 98, it reclaims releasing sheet RL.
In addition; the in the situation that of present embodiment; and be provided with the not shown not member storage case 13 of peeling off unit 12 and the protection sheet material PS after peeling off being reclaimed that the protection sheet material PS that is pasted on wafer W F is peeled off, but they are not the necessary important documents of the present application, so omit detailed explanation.In addition; as the parts of peeling off unit 12 and can example recording such as the existing document of stripping off device of Japanese Patent Application 2008-285288 and Japanese Patent Application 2011-55508 etc.; as not wanting member storage case, so long as can take in and reclaim the parts of protection sheet material PS, be not just limited in any way.
In above sheet attaching apparatus 1, the order that adhesive sheet AS is sticked on wafer W F and annular frame RF is described.
First, raw material RS is arranged on as shown in the mark AA in Fig. 1 and pastes on unit 9, and wafer case 21 is arranged in the position shown in the figure 1.Then, if hold handle 35, by receiver 30, pull out the double dot dash line from transfer position to Fig. 1 or the supply position shown in chain-dotted line, and application of force unit 40 drives linear electric machines 41, as shown in the double dot dash line in Fig. 2 A, makes force application board 43 move to left end.Then, operator is supplied to the annular frame RF of any number in receiver 30 vertically.Now, operator in the peristome RF4 that hand or finger is inserted to annular frame RF and under the state of having been hung, this annular frame RF can be supplied in receiver 30, so can enough one hands simultaneously by a plurality of annular frame RF to supply in receiver 30.And, if the supply end switch that operator presses is not shown, posture maintains unit 50 and drives electric rotating machine 51, endless belt 54 is rotarilyd actuate around the clockwise direction of Fig. 2 A, Fig. 2 B, Fig. 2 C, and application of force unit 40 drives linear electric machine 41, makes force application board 43 move to the right as shown in the solid line in Fig. 2 A.Thus, the annular frame RF being incorporated in receiver 30 integrally moves to the right, and the annular frame RF and the right face 34 that are positioned at right-hand member fit tightly, and maintain the posture of this annular frame RF.Afterwards, operator makes receiver 30 move to transfer position.
And, transfer unit 8 drives multi-joint manipulator 81, after making the inside of holding unit 82 insertion wafer case 21 and wafer adsorption section 86 being contacted with wafer W F, drive not shown attraction unit, absorption keeps this wafer W F, makes wafer W F move to the position that can be detected by detecting unit 89.Then, detecting unit 89 detects the outer fringe position of wafer W F and not shown V incision site, exports these all data to not shown control unit.All data of wafer W F are transfused to after not shown control unit, calculate the center of wafer W F, transfer unit 8 drives multi-joint manipulator 81, make the center of wafer W F and the position that not shown V incision site becomes regulation, mounting is the bearing-surface 71 of the workbench 72 of the position standby shown in the double dot dash line in Fig. 1.If mounting wafer W F, bearing unit 7 drives not shown attraction unit absorption to keep this wafer W F.
In addition, transfer unit 8 drives multi-joint manipulator 81, as Fig. 2 B, as shown in Figure 3 holding unit 82 is inserted in the recess 34A of right faces 34 and framework adsorption section 84 is contacted with the right side of annular frame RF that is positioned at the right-hand member of receiver 30 after, drive not shown attraction unit, absorption remains in the annular frame RF of this right-hand member.Then, transfer unit 8 drives multi-joint manipulator 81, will be positioned at the annular frame RF drawing upward of right-hand member.Now, owing to being positioned at the annular frame RF of right-hand member, being biased unit 40 and posture and maintaining unit 50 and press to right face 34, so only have can not drawing by the attraction of framework adsorption section 84 situation, but hooking unit 88 is hooked on the peristome RF4 of annular frame RF, so can not produce such unfavorable condition.In addition, have when being positioned at the annular frame RF of right-hand member and carrying out drawing, also simultaneously drawing be positioned at this right-hand member annular frame RF left side adjacency annular frame RF and produce unfavorable condition at random, but because unit 38 is pressed in existence, so also can there is not such unfavorable condition.In addition, just in case as shown in Figure 2 C, even in the situation that the annular frame RF that is positioned at right-hand member is not fitted tightly by the rotary actuation of endless belt 54 with right face 34, the pressure that yet can detect under the attraction of framework adsorption section 84 does not decline, and can make holding unit 82 rotation clockwise as shown in figure.If the annular frame RF that is positioned at right-hand member is pulled out from receiver 30, by application of force unit 40 and posture, maintain unit 50 with the annular frame RF of left side adjacency that is positioned at the annular frame RF of this right-hand member and be compressed against right face 34.
Afterwards, transfer unit 8 drives multi-joint manipulator 81, make annular frame RF move to the position that can be detected by detecting unit 89, same action when detecting unit 89 carries out with above-mentioned wafer RF, afterwards, the center and the state towards the direction of regulation by the V otch RF3 of the consistent state in the center of the wafer W F of workbench 72 upper supports and annular frame RF that form the peristome RF4 of annular frame RF, be positioned in this annular frame RF on the bearing-surface 71 of workbench 72.If mounting annular frame RF, bearing unit 71 drives not shown attraction unit, and absorption keeps this annular frame RF.
Then, bearing unit 7 drives linear electric machines 73, make workbench 72 left direction move, if not shown detecting unit detects wafer W F and annular frame RF while having arrived the position of regulation, synchronize with the movement of workbench 72, paste unit 9 and drive electric rotating machine 94 transferring raw material RS.Thus, adhesive sheet AS is stripped from plate 94 and peels off, and the adhesive sheet AS after peeling off pastes wafer W F and annular frame RF by being pressed by pressure roller 93 upper, as shown in solid line in Fig. 1, forms wafer supporting body WK.Form like this wafer supporting body WK, by not shown detecting unit, detected, bearing unit 7 stops linear electric machine 73.And, transfer unit 8 drives multi-joint manipulator 81, lift and make it to spin upside down wafer supporting body WK, the not shown handing-over unit with the absorption bearing-surface relative with bearing-surface 71 is given in handing-over, and this handing-over unit declines wafer supporting body WK and again loads in bearing-surface 71.Thus, wafer supporting body WK is so that the state of protection sheet material PS towards top is supported in bearing-surface 71.Then, peel off unit 12 and on protection sheet material PS, paste not shown peeling off with band, stretching, this is peeled off with band to peel off protection sheet material PS(details from wafer W F with reference to the existing document of stripping off device).If peel off protection sheet material PS from wafer W F; transfer unit 8 drives multi-joint manipulator 81; make the protection sheet material PS contact wafer adsorption section 86 after peeling off and drive not shown attraction unit, absorption keeps this protection sheet material PS and discards to not shown not member storage case.And the wafer supporting body WK having peeled off after protection sheet material PS is carried to other operation by not shown carrying unit, workbench 72 turns back to the position shown in double dot dash line in Fig. 1, repeats and above-mentioned same action afterwards.
According to above-mentioned execution mode, operator can easily supply with annular frame RF to receiver 30, even if be for example large-scale annular frame RF, also can non-confrontational gravity and form longitudinal accumulation posture, can once to housing unit, supply with multiple annular frames by one hand.
As mentioned above, in above-mentioned record, disclose for implementing preferred formation of the present invention, method etc., but the invention is not restricted to this.; the present invention relates generally to specific execution mode and illustrates especially and be illustrated; but those skilled in the art are not within departing from the scope of technological thought of the present invention and object; can, to above-described execution mode, in shape, material, quantity, other detailed formation, carry out various distortion.In addition, the record that defines above-mentioned disclosed shape, material etc. is exemplarily to record in order easily to understand the present invention, therefore do not limit the present invention, the record in the title of the parts except their part or all restriction of the restrictions such as shape, material is also contained in the present invention.
For example, in the above-described embodiment, as frame parts, represented annular frame RF, to hand or finger being inserted in the peristome RF4 of this annular frame RF and situation about being accommodated in receiver 30 with the state of having hung is illustrated, even but for there is no the frame parts of peristome, when having grasped certainly the position of the centre-of gravity shift of this frame parts, this frame parts forms the formation of this frame parts being supplied with to housing unit towards (non-confrontational gravity towards) along the direction being pulled by gravity.
In addition, also can only annular frame RF be loaded on workbench 72, adhesive sheet AS is sticked on this annular frame RF.
In addition, force application board 43 can be configured to forming of being driven by same endless belt, the endless belt 54 with postural position unit 50, or the formation being stretched by elastomeric elements such as springs, thus to the annular frame RF application of force.
In addition, as shown in the double dot dash line in Fig. 1, also can arrange and there is maintaining part 61, V otch detecting unit 62, as the electric rotating machine 63 of driving arrangement and as the handing-over unit 6 of the straight moving motor 64 of driving arrangement, this maintaining part 61 has the framework adsorption section 60 of the annular frame RF that can adsorb the right-hand member that remains in receiver 30, this V otch detecting unit 62 can detect the V otch RF3 of the annular frame RF being kept by maintaining part 61, this electric rotating machine 63 make maintaining part 61 to the left and right direction move, and can make annular frame RF rotate in the face of this annular frame RF, this directly moves motor 64 can make electric rotating machine 63 in above-below direction lifting.And handing-over unit 6 drives electric rotating machine 63, by maintaining part 61 absorption, remained in the annular frame RF of receiver 30 right-hand members, drive straight moving motor 64, drawing is positioned at the annular frame RF of right-hand member.Afterwards, handing-over unit 6 drives electric rotating machine 63, makes annular frame RF rotation predetermined angular, and after detecting the position of V otch by V otch detecting unit 61, the mode that is positioned at the position of regulation with this V otch makes electric rotating machine 63 stop and locating.And, can be also that transfer unit 8 drives multi-joint manipulator 81, utilizes holding unit 82 to keep by the annular frame RF behind 6 location, handing-over unit.
In addition, being not particularly limited by the classification of convered structure and adhesive sheet AS and material etc. in the present invention, for example, adhesive sheet AS can be for having the sheet material in intermediate layer between substrate sheet and bond layer, also can be for there is the more than three layers sheet material such as cover layer on substrate sheet, it can also be the so-called double-sided adhesive sheet material that substrate sheet can be peeled off from bond layer, as such double-sided adhesive sheet material, can be for thering is the sheet material in the intermediate layer of single or multiple lift, and do not there is the sheet material of the single or multiple lift in intermediate layer.In addition, by convered structure, can be semiconductor wafer, adhesive sheet AS can be screening glass material, cutting belt, chip attachment film (ダ イ ア タ ッ チ Off ィ Le system) etc.Now, semiconductor wafer can example semiconductor silicon wafer and compound semiconductor wafer etc., and the adhesive sheet AS pasting on this semiconductor wafer is not limited to this, can use the adhesive sheet etc. of purposes, shape arbitrarily of sheet material, film, band etc. arbitrarily.In addition, by convered structure, can be the substrate of CD, adhesive sheet AS can have the resin bed that forms recording layer.As described above, as by convered structure, be not limited only to glass plate, steel plate, pottery, plank or resin plate etc. other by convered structure, the parts of form and article etc. can become object arbitrarily.
In addition, driving arrangement in above-mentioned execution mode is except adopting electric rotating machine, the electrical equipment such as moving motor, linear electric machine, single-shaft mechanical arm, multi-joint manipulator directly, cylinder, hydraulic cylinder, without outside actuators such as bar cylinder and rotary cylinder etc., also can use they direct or indirect parts of combination (have with execution mode in the formation that repeats of the parts of example).
Claims (5)
1. a sheet attaching apparatus, is characterized in that, possesses:
Framework housing unit, its can take in a plurality of via adhesive sheet with by the integrated frame parts of convered structure;
Bearing unit, it supports described frame parts and described by least frame parts in convered structure;
Transfer unit, it takes out and transfers load to described bearing unit from described framework housing unit by described frame parts;
Paste unit, it makes described adhesive sheet butt and is pasted on the frame parts being supported by described bearing unit or frame parts and by convered structure,
Described framework housing unit can vertically be taken in described frame parts.
2. sheet attaching apparatus as claimed in claim 1, is characterized in that, described framework housing unit possesses the application of force unit to a direction application of force by described frame parts.
3. sheet attaching apparatus as claimed in claim 1 or 2, is characterized in that, described framework housing unit has makes the posture that move to a direction bottom of described frame parts maintain unit.
4. sheet attaching apparatus as claimed in claim 1 or 2, is characterized in that, described framework housing unit has the unit of pressing that prevents from simultaneously being taken out by described transfer unit a plurality of described frame partss.
5. a sheet attaching method, is characterized in that,
Vertically taken in a plurality of via adhesive sheet with by the integrated frame parts of convered structure,
Described frame parts is transferred load to described frame parts and the described bearing unit being supported by least frame parts in convered structure,
Make described adhesive sheet butt and be pasted on the frame parts being supported by described bearing unit or frame parts and by convered structure.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012152242A JP6007008B2 (en) | 2012-07-06 | 2012-07-06 | Sheet pasting device |
| JP2012-152242 | 2012-07-06 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103531504A true CN103531504A (en) | 2014-01-22 |
| CN103531504B CN103531504B (en) | 2018-02-13 |
Family
ID=49933407
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310283590.9A Active CN103531504B (en) | 2012-07-06 | 2013-07-08 | Sheet attaching apparatus and sheet attaching method |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6007008B2 (en) |
| KR (1) | KR102033795B1 (en) |
| CN (1) | CN103531504B (en) |
| TW (1) | TWI623985B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105609447A (en) * | 2014-11-19 | 2016-05-25 | 琳得科株式会社 | Orderly arrangement device and orderly arrangement method |
| CN109817532A (en) * | 2019-03-28 | 2019-05-28 | 惠州市西文思实业有限公司 | A kind of process equipment for chip |
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| JPH0697267A (en) * | 1992-09-11 | 1994-04-08 | Nitto Denko Corp | Film releasing and cleaning device |
| JP2002128287A (en) * | 2000-10-23 | 2002-05-09 | Sony Corp | Paper feeding tray for printer and printer |
| CN1576203A (en) * | 2003-07-11 | 2005-02-09 | 日东电工株式会社 | Transport method and transport apparatus for semiconductor wafer |
| JP2006165385A (en) * | 2004-12-09 | 2006-06-22 | Nitto Denko Corp | Wafer mounting method and wafer mounting equipment using the same |
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| US6371476B2 (en) * | 1998-03-27 | 2002-04-16 | Minolta Co., Ltd. | Image producing apparatus wherein a paper feed unit and a paper stack are arranged in a vertical direction |
| JP3602981B2 (en) * | 1999-07-07 | 2004-12-15 | 之宏 吉村 | Spare blade case |
| JP5177192B2 (en) * | 2010-09-08 | 2013-04-03 | 大日本印刷株式会社 | Substrate storage container and substrate storage body |
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2012
- 2012-07-06 JP JP2012152242A patent/JP6007008B2/en active Active
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2013
- 2013-06-28 TW TW102123144A patent/TWI623985B/en active
- 2013-07-05 KR KR1020130078825A patent/KR102033795B1/en active IP Right Grant
- 2013-07-08 CN CN201310283590.9A patent/CN103531504B/en active Active
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|---|---|---|---|---|
| JPH0228347A (en) * | 1988-07-18 | 1990-01-30 | Nitto Denko Corp | Apparatus for automatically sticking semiconductor wafer |
| JPH0697267A (en) * | 1992-09-11 | 1994-04-08 | Nitto Denko Corp | Film releasing and cleaning device |
| JP2002128287A (en) * | 2000-10-23 | 2002-05-09 | Sony Corp | Paper feeding tray for printer and printer |
| CN1576203A (en) * | 2003-07-11 | 2005-02-09 | 日东电工株式会社 | Transport method and transport apparatus for semiconductor wafer |
| JP2006165385A (en) * | 2004-12-09 | 2006-06-22 | Nitto Denko Corp | Wafer mounting method and wafer mounting equipment using the same |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105609447A (en) * | 2014-11-19 | 2016-05-25 | 琳得科株式会社 | Orderly arrangement device and orderly arrangement method |
| CN105609447B (en) * | 2014-11-19 | 2020-06-02 | 琳得科株式会社 | Neatly arranging device and neatly arranging method |
| CN109817532A (en) * | 2019-03-28 | 2019-05-28 | 惠州市西文思实业有限公司 | A kind of process equipment for chip |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2014017307A (en) | 2014-01-30 |
| KR102033795B1 (en) | 2019-10-17 |
| KR20140005821A (en) | 2014-01-15 |
| CN103531504B (en) | 2018-02-13 |
| JP6007008B2 (en) | 2016-10-12 |
| TWI623985B (en) | 2018-05-11 |
| TW201407697A (en) | 2014-02-16 |
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