CN103531504B - Sheet attaching apparatus and sheet attaching method - Google Patents
Sheet attaching apparatus and sheet attaching method Download PDFInfo
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- CN103531504B CN103531504B CN201310283590.9A CN201310283590A CN103531504B CN 103531504 B CN103531504 B CN 103531504B CN 201310283590 A CN201310283590 A CN 201310283590A CN 103531504 B CN103531504 B CN 103531504B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68368—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used in a transfer process involving at least two transfer steps, i.e. including an intermediate handle substrate
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
A kind of sheet attaching apparatus and sheet attaching method.The sheet attaching apparatus of the present invention（1）Possess：Framework housing unit（3）, it can store multiple via adhesive sheet（AS）And and chip（WF）The annular frame of integration（RF）；Bearing unit（7）, it supports annular frame（RF）And chip（WF）In at least annular frame（RF）；Transfer unit（8）, it is from framework housing unit（3）By annular frame（RF）Take out and transfer load to bearing unit（7）；Application unit（9）, it makes adhesive sheet（AS）Abut and be pasted on and be supported by unit（7）The annular frame of supporting（RF）Upper or annular frame（RF）And chip（WF）On, framework housing unit（3）Can be by annular frame（RF）Vertical storage.
Description
Technical field
The present invention relates to the sheet attaching apparatus and sheet attaching method for pasting adhesive sheet.
Background technology
At present, it is known to and pastes splicing tape in annular frame and be pasted with to paste on the annular frame of splicing tape and partly lead at this
The erecting device of body chip (below, sometimes referred to simply as chip) is (for example, referring to document 1：Japanese Unexamined Patent Publication 2005-33119 public affairs
Report).
The erecting device of the document 1 is formed as follows, i.e. is possessed：By annular frame facing to horizontal plane direction lamination
The annular frame supply unit received of flat overlapping, absorption keeps this to be put down to annular frame carrying mechanism one by one successively from upside
Annular frame that overlapping is received simultaneously is carried to the position for pasting splicing tape.
But form document 1 is such, due to receiving the composition of annular frame for the flat overlapping of annular frame supply unit,
So it is supplied to the unfavorable condition of annular frame supply unit with operator's both hands supporting annular frame of having to.Particularly,
It is singlehanded to antigravity to make annular frame be that flat folded posture is extremely difficult in the case of large-scale annular frame, moreover
In order to do not make the work efficiency drop of device and if once supplying multiple annular frames, if not both hands support carry out operation if not
Flat overlapping can be carried out to receive.
The content of the invention
It is an object of the invention to provide a kind of sheet attaching apparatus that can readily supply frame parts and sheet material to glue
Patch method.
To achieve these goals, sheet attaching apparatus of the invention possesses：Framework housing unit, it can store multiple warps
The frame parts integrated with adherend by adhesive sheet；Bearing unit, it supports described frame parts and described glued
At least frame parts in junctor；Transfer unit, the frame parts is taken out and transferred load to from the framework housing unit by it
The bearing unit；Application unit, it abuts the adhesive sheet and is pasted on the frame section that is supported by the bearing unit
On part or in frame parts and adherend, the framework housing unit can store the frame parts vertically.
Now, in the sheet attaching apparatus of the present invention, it is preferred that the framework housing unit possesses the framework
The forcing unit that part exerts a force to a direction.
In addition, the present invention sheet attaching apparatus in, it is preferred that the framework housing unit have make the framework
The posture maintenance unit that the bottom of part is moved to a direction.
In addition, the present invention sheet attaching apparatus in, it is preferred that the framework housing unit have prevent by described
Transfer unit takes out the pressing unit of multiple frame parts simultaneously.
On the other hand, sheet attaching method of the invention, be accommodated with vertically it is multiple via adhesive sheet and and adherend
The frame parts of integration, the frame parts is transferred load to at least frame in the frame parts and the adherend
The bearing unit that frame part is supported, abut the adhesive sheet and be pasted on the frame section that is supported by the bearing unit
On part or in frame parts and adherend.
The present invention more than, because framework housing unit can store frame parts vertically, so operator's energy
It is enough that frame parts is readily supplied into housing unit.Particularly, there are the feelings of opening in this wise in frame parts such as annular frame
Under condition, operator can be supplied palm and finger insertion opening portion in a manner of grabbing and hang annular frame, so even if example
Such as be large-scale annular frame, also can non-confrontational gravity and be formed as vertical stack posture, can will more once and by one hand
Open annular frame supply housing unit.
In addition, when " vertical " in the present invention refers to frame parts being maintained at the position for deviateing center of gravity, the frame parts
The state loaded with the direction along the direction pulled by gravity.
Now, if framework housing unit is provided with forcing unit, transfer unit always can keep framework in same position
Part simultaneously carries out transfer.
In addition, if framework housing unit is provided with posture maintenance unit, transfer unit can be kept and transfer is always to be same
The frame parts of posture.
If in addition, framework housing unit be provided with pressing unit, transfer unit take out frame parts when, can also simultaneously
Take out adjacent frame parts and prevent that its is at random.
Brief description of the drawings
Fig. 1 is the plan of the sheet attaching apparatus of an embodiment of the present invention；
Fig. 2A is the profile of framework housing unit；
Fig. 2 B are the action specification figures of transfer unit；
Fig. 2 C are the action specification figures of transfer unit；
Fig. 3 is Fig. 2 B BB direction views.
Embodiment
Hereinafter, an embodiment of the present invention is illustrated with reference to the accompanying drawings.
In addition, the X-axis, Y-axis, Z axis in present embodiment are respectively orthogonal relation, X-axis and Y-axis are in horizontal plane
Axle, Z axis are the axle orthogonal with horizontal plane.In addition, in the present embodiment, to be seen from the arrow mark AR direction parallel with Y-axis
On the basis of situation about observing, in the case where representing direction, " on " be Z axis arrow mark direction, " under " be its opposite direction,
" left side " is the arrow mark direction of X-axis, " right side " is its opposite direction, and " preceding " is the arrow mark direction of Y-axis, " rear " is its negative side
To.
In Fig. 1, sheet attaching apparatus 1 is supported by framework 10, and possesses：Wafer storage unit 2, it can store multiple
Wafer W F as adherend；Framework housing unit 3, it can store multiple integrated with wafer W F via adhesive sheet AS
The annular frame RF as frame parts；Bearing unit 7, it supports at least annular frame in annular frame RF and wafer W F
RF；Transfer unit 8, it takes out wafer W F and annular frame RF simultaneously from wafer storage unit 2 and framework housing unit 3
Transfer load to bearing unit 7；Application unit 9, it abuts adhesive sheet AS and is pasted onto to be supported by the annular frame that unit 7 supports
RF is upper or annular frame RF and wafer W F on.
Here, the outer peripheral face in annular frame RF is provided with the 90 ° of planar portions being located at interval at everywhere RF1, is arranged respectively at
Curved face part RF2 everywhere between adjacent planar portions RF1, it is arranged respectively at adjacent two in curved face part RF2 everywhere
Curved face part RF2 V otch RF3, in inner side formed with opening portion RF4.
Wafer storage unit 2 by that the overlapping of multilayer Horizon can receive surface mount and have protection sheet material PS (reference pictures 1 along the vertical direction
In mark AA) wafer W F wafer case 21 form, to be detachably supported by relative to framework 11.
Also as shown in Figure 2 A, framework housing unit 3 can store annular frame RF vertically and form, and possess storage ring frame
Frame RF receiver 30, the forcing unit that the annular frame RF being accommodated in the receiver 30 exerts a force to a direction (right side)
40th, annular frame RF bottom is made to the posture maintenance unit 50 of a direction (right side) movement.
Receiver 30 has：Bottom surface sections 31, it is the rectangle box-like extended in the lateral direction；A pair of side surface parts, its from
The front of bottom surface sections 31 and the both ends at rear erect, the size being set as between the relative planar portions RF1 than annular frame RF
The big and interval smaller than the size between relative curved face part RF2, the outside as the outer rim supporting to annular frame RF support
Unit；Left facial part 33, it is erected from the left side ora terminalis of bottom surface sections 31；Right face 34, it is erected from the right side ora terminalis of bottom surface sections 31,
In center formed with recess 34A；Unit 38 is pressed, it is provided with the annular of more than one and less than two between right face 34
Framework RF gap, prevent by transfer unit 8 while take out (drawing) multiple annular frame RF.In the side surface part 32 positioned at front
Provided with handle 35, can be connect by operating the handle 35 via guide rail (not shown) by receiver 30 is shown in solid in Fig. 1
In the transfer position of nearly transfer unit 8 and Fig. 1 shown in double dot dash line between the supply position that transfer unit leaves forwards, backwards
Direction pulls out., can be via guide rail (not shown) by receiver 30 alternatively, it is also possible to be configured to handle 35 being located at left facial part 33
Pulled out in the lateral direction between the supply position shown in Fig. 1 chain lines；Msy be also constructed to combine above-mentioned composition and
Can by receiver 30 in front-rear direction and left and right directions both sides pull out.
Forcing unit 40 have located at bottom surface sections 31 inside as a pair of driving equipments linear electric machine 41, pass through shape
The force application board 43 for setting the sliding block 42 of respective linear electric machine with linking into the opening portion 36 above bottom surface sections 31.
Posture maintenance unit 50 has：Driving pulley 52, it is located at the inside of bottom surface sections 31, and by a pair of frames 55
Hold, be rotatably arranged by the electric rotating machine 51 for being used as driving equipment；Driven pulley 53, it is rotatably supported in the framework
55；Endless belt 54, its on driving pulley 52 and driven pulley 53, and with above with opening portion 36 and positioned at than
The mode of position above bottom surface sections 31 just above is set.
Bearing unit 7 has：Workbench 72, its have can pass through the attraction list such as drawdown pump (not shown) and vacuum syringe
Member absorption keeps wafer W F and annular frame RF bearing-surface 71；Linear electric machine 73, it utilizes sliding block 74 as driving equipment
Hold workbench 72.
Transfer unit 8 has as the multi-joint manipulator 81 of driving equipment, located at the front end of the multi-joint manipulator 81
The holding unit 82 in portion.Multi-joint manipulator 81 is so-called 6 axis robot for having at six positions rotatable joint, is formed
For can make in the job area of the multi-joint manipulator 81 the wafer W F and the annular frame RF that are kept by holding unit 82 with
Arbitrary position, arbitrary angle displacement.Holding unit 82 possesses provided with multiple adsorption holes 83 and the framework about being located at
Adsorption section 84, the chip adsorption section 86 provided with multiple adsorption holes 85 and between framework adsorption section 84, there is annular frame RF
Thickness below height and the hooking unit 88 that can haunt or can not haunt from the retaining surface 87 of holding unit 82.Framework
Adsorption section 84 and chip adsorption section 86 by be connected with multi-joint manipulator 81 and respectively with drawdown pump (not shown) and vacuum impregnating
Emitter etc. attracts unit connection, can adsorb and keep wafer W F or annular frame RF.
It is provided with the left side of transfer unit 8 and can detects wafer W F outer fringe position, is formed at wafer W F V (not shown)
The azimuth mark such as otch and directional plane, circuit pattern, road plan (ス ト リ ー ト) or annular frame RF outer rim and inner edge position
Put, the detection unit 89 being made up of optical sensor and camera device etc. located at the otch RF3 of annular frame RF peripheries etc..
As marked in Fig. 1 shown in the accompanying drawing from AR directions shown in AA, application unit 9 possesses：Support shaft 91, it will be to that will glue
Contact pin material AS temporary bonds are supported in the raw material RS of the releasing sheet RL of banding one side；Peel plate 92, it is by stripping film
Material RL turns back and peels off adhesive sheet AS；As the pressing roller 93 of pressing unit, it abuts the adhesive sheet AS after stripping
And it is pasted onto on wafer W F；Driven roller 95, it drives rotation by being used as the electric rotating machine 94 of driving equipment；Pinch roll 96, lead to
Cross the pinch roll 96 and driven roller 95 sandwiches releasing sheet RL；Recycling roll 97, it reclaims releasing sheet RL.
In addition, in this case, and provided with the stripping for peeling off the protection sheet material PS for being pasted on wafer W F
Unit 12 and by the protection sheet material PS after stripping reclaim it is (not shown) should not member storage case, but they are not the present application
Necessary important document, so omit detailed description.In addition, can example such as Japanese Patent Application 2008- as stripping unit 12
Part described in 285288 and Japanese Patent Application 2011-55508 etc. stripping off device existing literature, as should not member storage
Case, as long as can store and reclaim protection sheet material PS part, just it is not limited in any way.
It is suitable on wafer W F and annular frame RF to adhesive sheet AS is pasted onto in sheet attaching apparatus 1 more than
Sequence illustrates.
First, raw material RS is arranged on application unit 9 as shown in the mark AA in Fig. 1, and wafer case 21 is set
Put in the position shown in the figure 1.Then, if holding handle 35 by receiver 30 from double dot dash line of the transfer position into Fig. 1 or
Supply position shown in chain-dotted line pulls out, then forcing unit 40 drives linear electric machine 41, as shown in the double dot dash line in Fig. 2A,
Force application board 43 is set to be moved to left end.Then, the annular frame RF of any number is vertically supplied in receiver 30 by operator.
Now, operator, being capable of general in the state of it will hang in hand or finger insertion annular frame RF opening portion RF4
Annular frame RF is supplied in receiver 30, so simultaneously can be supplied multiple annular frame RF into receiver 30 with singlehanded
Give.Moreover, if operator presses supply end switch (not shown), posture maintenance unit 50 drives electric rotating machine 51, makes ring
Shape band 54 is rotated clockwise driving around Fig. 2A, Fig. 2 B, Fig. 2 C, and forcing unit 40 drives linear electric machine 41, such as schemes
Force application board 43 is set to move to the right shown in solidly in 2A.Thus, the annular frame RF being incorporated in receiver 30 is overall
Ground is moved to the right, and the annular frame RF and right face 34 positioned at right-hand member are brought into close contact, and maintain annular frame RF posture.It
Afterwards, operator makes receiver 30 be moved to transfer position.
Moreover, the driving driving multi-joint manipulator 81 of transfer unit 8, makes holding unit 82 insert the inside of wafer case 21 simultaneously
After chip adsorption section 86 is contacted with wafer W F, attraction unit (not shown) is driven, absorption keeps wafer W F, moves wafer W F
Move the position that can be detected by detection unit 89.It is then detected that unit 89 detects wafer W F outer fringe position and not shown
V incision sites, by these all data outputs to control unit (not shown).Wafer W F all data are transfused to control (not shown)
After unit processed, wafer W F center is calculated, transfer unit 8 drives multi-joint manipulator 81, makes wafer W F center
Turn into defined position with V incision sites (not shown), load in the standby work in the position shown in the double dot dash line in Fig. 1
The bearing-surface 71 of platform 72.If loading wafer W F, bearing unit 7, which drives attraction unit (not shown) and adsorbed, keeps the chip
WF。
In addition, transfer unit 8 drives multi-joint manipulator 81, the right side is inserted such as Fig. 2 B, as shown in Figure 3 by holding unit 82
In the recess 34A in portion 34 and make framework adsorption section 84 with positioned at receiver 30 right-hand member annular frame RF the right side contact after,
Attraction unit (not shown) is driven, absorption remains in the annular frame RF of the right-hand member.Then, transfer unit 8 drives multi-joint
Manipulator 81, by positioned at the annular frame RF drawings upward of right-hand member.Now, because the annular frame RF positioned at right-hand member is exerted a force
Unit 40 and posture maintenance unit 50 are pressed against to right face 34, so with being only unable to drawing by the attraction of framework adsorption section 84
Situation, but hooking unit 88 is hooked on annular frame RF opening portion RF4, so such unfavorable condition will not be produced.Separately
Outside, have when the annular frame RF for being pointed to right-hand member carries out drawing, also drawing simultaneously and the annular frame RF positioned at the right-hand member
Left side adjoining annular frame RF and produce unfavorable condition at random, but unit 38 is pressed due to existing, so will not also send out
Unfavorable condition as life.In addition, just in case as shown in Figure 2 C, make even in the rotation driving by endless belt 54 positioned at the right side
In the case that the annular frame RF at end is not brought into close contact with right face 34, also it is able to detect that under the attraction of framework adsorption section 84
Pressure does not decline, and can make holding unit 82 as shown about being rotated clockwise.If by positioned at the annular frame of right-hand member
RF pulls out from receiver 30, then the annular frame RF abutted with the left side of the annular frame RF positioned at the right-hand member passes through forcing unit
40 and posture maintenance unit 50 be compressed against right face 34.
Afterwards, transfer unit 8 drives multi-joint manipulator 81, and being moved to annular frame RF can be examined by detection unit 89
The position measured, detection unit 89 carry out the action same with during above-mentioned chip RF, afterwards, are formed as opening for annular frame RF
The consistent state in wafer W F of the oral area RF4 center with being supported on workbench 72 center and annular frame RF's
The state in V otch RF3 directions as defined in, annular frame RF is positioned on the bearing-surface 71 of workbench 72.If mounting
Annular frame RF, then bearing unit 71 drive attraction unit (not shown), absorption keeps annular frame RF.
Then, bearing unit 7 drives linear electric machine 73, moves the left direction of workbench 72, if detection (not shown) is single
When member detects that wafer W F and annular frame RF reaches defined position, mobile synchronous with workbench 72, application unit 9 drives
Dynamic electric rotating machine 94 and transferring raw material RS.Thus, adhesive sheet AS is stripped plate 92 and peeled off, and the adhesive sheet AS after stripping passes through
Pressing roller 93 and be pressed and paste on wafer W F and annular frame RF, as shown in solid lines in fig. 1, form wafer supports WK.
If so forming wafer supports WK, detected by detection unit (not shown), bearing unit 7 stops linear electric machine 73.
Moreover, transfer unit 8 drives multi-joint manipulator 81, wafer supports WK is lifted and spins upside down it, being transferred to has
The transfer unit (not shown) of relative with bearing-surface 71 absorption bearing-surface, the transfer unit make wafer supports WK decline and again
It is secondary to be placed in bearing-surface 71.Thus, wafer supports WK is so that the states of protection sheet material PS upward are supported in bearing-surface
71.Then, stripping unit 12 pastes stripping band (not shown) on protection sheet material PS, stretches the stripping band with from wafer W F
Peel off protection sheet material PS (existing literature of the details with reference to stripping off device).If peel off protection sheet material PS, transfer from wafer W F
Unit 8 drives multi-joint manipulator 81, makes the contact chips of the protection sheet material PS after stripping adsorption section 86 and drives suction (not shown)
Draw unit, absorption keep protection sheet material PS and discard to it is (not shown) should not member storage case.Moreover, protection sheet material is peeled off
Wafer supports WK after PS is carried to other processes by handling unit (not shown), and workbench 72 returns to double in Fig. 1
Position shown in chain-dotted line, action similar to the above is repeated afterwards.
According to above-mentioned embodiment, operator can easily supply annular frame RF to receiver 30, even if example
Such as be large-scale annular frame RF, also can non-confrontational gravity and formed longitudinal direction accumulation posture, can from one hand once to storage
Unit supplies multiple annular frames.
As described above, have disclosed in above-mentioned record for implementing the preferably comprising of the present invention, method etc., but the present invention is not
It is limited to this.That is, illustrate the invention mainly relates to specific embodiment and especially and be illustrated, but those skilled in the art
In the range of the technological thought of the present invention and purpose is not departed from, can to embodiments described above, shape, material,
Quantity, other detailed compositions carry out various modifications.In addition, the record for defining shape disclosed above, material etc. be in order to
It is readily appreciated that the present invention and exemplarily records, does not limit the present invention, therefore except one of the restrictions such as their shape, material
Point or whole restrictions outside part title in record be also contained in the present invention.
For example, in the above-described embodiment, annular frame RF is illustrated as frame parts, to hand or finger insertion are somebody's turn to do
In annular frame RF opening portion RF4 and situation that the state to have hung is accommodated in receiver 30 is illustrated, but i.e.
Make for the frame parts of no opening portion, when having grasped from the position of the centre-of gravity shift of the frame parts, the frame parts shape
The frame parts is supplied to housing unit into the direction (direction of non-confrontational gravity) along the direction pulled by gravity
Composition.
Alternatively, it is also possible to which only annular frame RF is placed on workbench 72, adhesive sheet AS is pasted onto the ring frame
On frame RF.
In addition, force application board 43 may be constructed as by the endless belt driving same with the endless belt 54 of postural position unit 50
Form, or the composition stretched by elastomeric elements such as springs, thus annular frame RF is exerted a force.
In addition, as shown in the double dot dash line in Fig. 1, it can also set with maintaining part 61, V otch detection unit 62, make
The transfer unit 6 of electric rotating machine 63 for driving equipment and the direct acting motor 64 as driving equipment, the maintaining part 61 have
The annular frame RF for the right-hand member for remaining in receiver 30 framework adsorption section 60 can be adsorbed, the energy of V otch detection unit 62
The annular frame RF kept by maintaining part 61 V otch RF3 are enough detected, the electric rotating machine 63 enables the right to the left of maintaining part 61
To movement, and annular frame RF can be made to make electric rotating in annular frame RF face internal rotation, the direct acting motor 64
Machine 63 lifts in above-below direction.Moreover, transfer unit 6 drives electric rotating machine 63, receiver is remained in by the absorption of maintaining part 61
The annular frame RF of 30 right-hand members, driving direct acting motor 64, drawing is located at the annular frame RF of right-hand member.Afterwards, transfer unit 6 drives
Electric rotating machine 63, annular frame RF is set to rotate predetermined angular, after the position of V otch is detected by V otch detection unit 61,
Stop electric rotating machine 63 in a manner of the V otch is located at defined position and position.Furthermore, it is also possible to be, transfer unit 8 drives
Dynamic multi-joint manipulator 81, the annular frame RF after being positioned by transfer unit 6 is kept using holding unit 82.
In addition, adherend and adhesive sheet AS classification and material in the present invention etc. is not particularly limited, for example, viscous
Contact pin material AS can be the sheet material for having between substrate sheet and bond layer intermediate layer, or in the upper of substrate sheet
Face has the sheet material of more than three layers of coating etc., can also be the so-called double-sided adhesive that can peel off substrate sheet from bond layer
Contact pin material, can be the sheet material in the intermediate layer with single or multiple lift as such double-sided adhesive sheet material, and without centre
The sheet material of the single or multiple lift of layer.In addition, adherend can be semiconductor wafer, adhesive sheet AS can be protection sheet material,
Cutting belt, chip attachment film (ダ イ ア タ ッ チ Off ィ Le system) etc..Now, semiconductor wafer can example semiconductor silicon wafer and
Compound semiconductor wafer etc., the adhesive sheet AS not limited to this pasted on this semiconductor wafer, can be used arbitrary piece
Adhesive sheet etc. of the arbitrary purposes such as material, film, band, shape.In addition, adherend can be the substrate of CD, adhesive sheet
Material AS can have the resin bed for forming recording layer.As described above, as adherend, glass plate, steel plate, pottery are not limited only to
Other adherend such as device, plank or resin plate, part and article of any form etc. can turn into object.
In addition, driving equipment in above-mentioned embodiment except can use electric rotating machine, direct acting motor, linear electric machine,
The electrical equipments such as single-shaft mechanical arm, multi-joint manipulator, it is cylinder, hydraulic cylinder, outer without actuator such as bar cylinder and rotary cylinder etc., also may be used
To use the part for directly or indirectly combining them (there is the composition repeated with the part of example in embodiment).
Claims (1)
1. a kind of sheet attaching apparatus, it is characterised in that possess：
Framework housing unit, it can store multiple frame parts integrated with adherend via adhesive sheet；
Bearing unit, it supports at least frame parts in the frame parts and the adherend；
Transfer unit, the frame parts is taken out and transfers load to the bearing unit by it from the framework housing unit；
Application unit, it abuts the adhesive sheet and is pasted on the frame parts supported by the bearing unit or frame
On frame part and adherend,
The framework housing unit can store the frame parts vertically, also, with the bottom for making the frame parts
The posture maintenance unit moved to a direction.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012-152242 | 2012-07-06 | ||
| JP2012152242A JP6007008B2 (en) | 2012-07-06 | 2012-07-06 | Sheet pasting device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103531504A CN103531504A (en) | 2014-01-22 |
| CN103531504B true CN103531504B (en) | 2018-02-13 |
Family
ID=49933407
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310283590.9A Active CN103531504B (en) | 2012-07-06 | 2013-07-08 | Sheet attaching apparatus and sheet attaching method |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6007008B2 (en) |
| KR (1) | KR102033795B1 (en) |
| CN (1) | CN103531504B (en) |
| TW (1) | TWI623985B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6393596B2 (en) * | 2014-11-19 | 2018-09-19 | リンテック株式会社 | Alignment apparatus and alignment method |
| CN109817532B (en) * | 2019-03-28 | 2020-12-15 | 惠州西文思技术股份有限公司 | Processing equipment for chip |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1576203A (en) * | 2003-07-11 | 2005-02-09 | 日东电工株式会社 | Transport method and transport apparatus for semiconductor wafer |
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|---|---|---|---|---|
| JPH0228347A (en) * | 1988-07-18 | 1990-01-30 | Nitto Denko Corp | Apparatus for automatically sticking semiconductor wafer |
| JPH0697267A (en) * | 1992-09-11 | 1994-04-08 | Nitto Denko Corp | Film releasing and cleaning device |
| US6371476B2 (en) * | 1998-03-27 | 2002-04-16 | Minolta Co., Ltd. | Image producing apparatus wherein a paper feed unit and a paper stack are arranged in a vertical direction |
| JP3602981B2 (en) * | 1999-07-07 | 2004-12-15 | 之宏 吉村 | Spare blade case |
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| JP4549172B2 (en) * | 2004-12-09 | 2010-09-22 | 日東電工株式会社 | Wafer mounting method and wafer mounting apparatus using the same |
| JP5177192B2 (en) * | 2010-09-08 | 2013-04-03 | 大日本印刷株式会社 | Substrate storage container and substrate storage body |
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2012
- 2012-07-06 JP JP2012152242A patent/JP6007008B2/en active Active
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2013
- 2013-06-28 TW TW102123144A patent/TWI623985B/en active
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1576203A (en) * | 2003-07-11 | 2005-02-09 | 日东电工株式会社 | Transport method and transport apparatus for semiconductor wafer |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2014017307A (en) | 2014-01-30 |
| JP6007008B2 (en) | 2016-10-12 |
| TW201407697A (en) | 2014-02-16 |
| CN103531504A (en) | 2014-01-22 |
| KR20140005821A (en) | 2014-01-15 |
| KR102033795B1 (en) | 2019-10-17 |
| TWI623985B (en) | 2018-05-11 |
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