CN103429690B - 粘合带 - Google Patents

粘合带 Download PDF

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Publication number
CN103429690B
CN103429690B CN201280013540.2A CN201280013540A CN103429690B CN 103429690 B CN103429690 B CN 103429690B CN 201280013540 A CN201280013540 A CN 201280013540A CN 103429690 B CN103429690 B CN 103429690B
Authority
CN
China
Prior art keywords
adhesive tape
self adhesive
binder layer
propylene
butylene
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201280013540.2A
Other languages
English (en)
Chinese (zh)
Other versions
CN103429690A (zh
Inventor
佐佐木贵俊
土生刚志
生岛伸祐
龟井胜利
浅井文辉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of CN103429690A publication Critical patent/CN103429690A/zh
Application granted granted Critical
Publication of CN103429690B publication Critical patent/CN103429690B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J123/10—Homopolymers or copolymers of propene
    • C09J123/14—Copolymers of propene
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer

Landscapes

  • Organic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
CN201280013540.2A 2011-03-17 2012-03-05 粘合带 Expired - Fee Related CN103429690B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011-058944 2011-03-17
JP2011058944A JP5685118B2 (ja) 2011-03-17 2011-03-17 粘着テープ
PCT/JP2012/055557 WO2012124519A1 (ja) 2011-03-17 2012-03-05 粘着テープ

Publications (2)

Publication Number Publication Date
CN103429690A CN103429690A (zh) 2013-12-04
CN103429690B true CN103429690B (zh) 2015-09-02

Family

ID=46830594

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201280013540.2A Expired - Fee Related CN103429690B (zh) 2011-03-17 2012-03-05 粘合带

Country Status (4)

Country Link
JP (1) JP5685118B2 (ja)
CN (1) CN103429690B (ja)
TW (1) TWI521039B (ja)
WO (1) WO2012124519A1 (ja)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013163775A (ja) * 2012-02-13 2013-08-22 Nitto Denko Corp 粘着テープ
JP2013163774A (ja) * 2012-02-13 2013-08-22 Nitto Denko Corp 粘着テープ
JP5959240B2 (ja) * 2012-03-12 2016-08-02 日東電工株式会社 粘着シート
CN104768981B (zh) 2012-11-02 2017-10-24 出光兴产株式会社 聚烯烃、含有其的粘接剂组合物和使用其的粘接胶带
JP2014173027A (ja) * 2013-03-11 2014-09-22 Nitto Denko Corp 粘着シート
US9523191B2 (en) * 2013-07-25 2016-12-20 Interman Corporation Mobile terminal booth
JP6556120B2 (ja) * 2014-03-18 2019-08-07 綜研化学株式会社 偏光板用粘着剤組成物、粘着剤層、粘着シートおよび粘着剤層付き偏光板
CN105622805B (zh) * 2014-10-30 2018-05-15 中国石油化工股份有限公司 一种1-丁烯聚合物的制备方法
KR102499977B1 (ko) * 2016-07-13 2023-02-15 삼성전자주식회사 접착 테이프 부착 장치 및 이를 이용한 반도체 패키지의 제조 방법
JP7015139B2 (ja) * 2017-10-18 2022-02-02 株式会社ディスコ 被加工物の研削方法及び研削装置
JP2018100422A (ja) * 2018-03-20 2018-06-28 リンテック株式会社 粘着テープおよび半導体装置の製造方法
JP7090542B2 (ja) * 2018-12-28 2022-06-24 ユニ・チャーム株式会社 吸収性物品

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1395602A (zh) * 2000-11-22 2003-02-05 三井化学株式会社 晶片机械加工粘结带及其制造和使用方法
CN1961053A (zh) * 2004-03-19 2007-05-09 三井化学株式会社 粘着材、粘着薄膜及其使用方法
CN101560274A (zh) * 2008-01-24 2009-10-21 赢创德固赛有限责任公司 具有间同立构结构单元的聚烯烃的制备方法,聚烯烃及其用途
CN101617013A (zh) * 2007-02-23 2009-12-30 日东电工株式会社 表面保护片

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09137013A (ja) * 1995-11-13 1997-05-27 Mitsui Petrochem Ind Ltd 剥離性保護フィルム用組成物およびそのフィルム
JP4424565B2 (ja) * 1999-10-08 2010-03-03 大日本印刷株式会社 体積ホログラム積層体、および体積ホログラム積層体作製用ラベル
JP2005298703A (ja) * 2004-04-13 2005-10-27 Mitsui Chemicals Inc 粘着性フィルム、筐体およびそれを用いた有機ｅｌ発光素子
JP4711777B2 (ja) * 2005-08-11 2011-06-29 日東電工株式会社 粘着シートとその製造方法、及び、製品の加工方法
JP2008214437A (ja) * 2007-03-01 2008-09-18 Sekisui Chem Co Ltd 表面保護フィルム
JP2009299023A (ja) * 2008-04-23 2009-12-24 Toyobo Co Ltd 粘着フィルムロール
JP5736139B2 (ja) * 2010-09-16 2015-06-17 日東電工株式会社 粘着テープ

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1395602A (zh) * 2000-11-22 2003-02-05 三井化学株式会社 晶片机械加工粘结带及其制造和使用方法
CN1961053A (zh) * 2004-03-19 2007-05-09 三井化学株式会社 粘着材、粘着薄膜及其使用方法
CN101617013A (zh) * 2007-02-23 2009-12-30 日东电工株式会社 表面保护片
CN101560274A (zh) * 2008-01-24 2009-10-21 赢创德固赛有限责任公司 具有间同立构结构单元的聚烯烃的制备方法,聚烯烃及其用途

Also Published As

Publication number Publication date
TWI521039B (zh) 2016-02-11
TW201249953A (en) 2012-12-16
WO2012124519A1 (ja) 2012-09-20
JP5685118B2 (ja) 2015-03-18
JP2012193295A (ja) 2012-10-11
CN103429690A (zh) 2013-12-04

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Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20150902

Termination date: 20180305

CF01 Termination of patent right due to non-payment of annual fee