TW201249953A - Adhesive tape - Google Patents

Abstract

Provided is an adhesive tape which has unevenness followability capable of sufficiently filling unevenness of an adherend and can hold a state in which unevenness is sufficiently filled over time. The adhesive tape includes an adhesive agent layer and a substrate layer, and the adhesive agent layer has a storage elasticity modulus at 20 DEG C of 0.5 106 Pa to 1.0 108 Pa and a loss tangent tan d at 20 DEG C to 80 DEG C of 0.1 or more. In a preferred embodiment, the adhesive agent layer contains an amorphous propylene-(1-butene) copolymer obtained by polymerization using a metallocene catalyst, and the propylene-(1-butene) copolymer has a weight average molecular weight (Mw) of 200,000 or more and a molecular weight distribution (Mw/Mn) of 2 or less.

Description

201249953 VI. Description of the Invention: [Technical Field to Which the Invention Is Ascribed] The present invention relates to an adhesive tape. [Prior Art] • A semiconductor wafer containing germanium, gallium, arsenic, etc. is made into a large diameter state, and after the surface is patterned, the back surface is ground, and the thickness of the wafer is usually reduced to about 100 to 600 μm. Further, the separation (cutting) is performed as a small piece of the component, and then transferred to the mounting step of the step of grinding the back surface of the semiconductor wafer (back grinding step), and the adhesion is used to protect the surface (pattern surface) of the semiconductor wafer. band. The adhesive tape is usually peeled off after the back grinding step. The adhesive tape used for such a purpose must have an adhesive force which does not peel off in the back grinding step, and on the other hand, it is required to be easily peeled off after the back grinding step and the semiconductor wafer is not damaged. Less adhesion. Conventionally, as such an adhesive tape, an adhesive tape coated with an adhesive on a substrate is used, for example, an adhesive coated with an acrylic adhesive is provided on a substrate containing a polyethylene resin. Adhesive tape of the layer (Patent Document 丨). But 'this kind of previous sticky #带带& "filling the semiconductor wafer map - (d) the bump, or even if the bump is buried after the bump, the adhesive tape is bulging with the passage of _ and When the back grinding step is applied, the unevenness of the pattern surface cannot be sufficiently filled. When the pattern surface of the semiconductor wafer cannot be sufficiently filled, the pressure of the semiconductor wafer during grinding becomes uneven, and the unevenness of the pattern surface affects the back surface of the semiconductor wafer, resulting in inability to smoothly grind. The problem, or the problem of cracking on the semiconductor wafer. The semiconductor wafer of 163077.doc 201249953 is more than the lamination step, and the same problem occurs as described above. In the case of the actual step, when the adhesive tape is bonded to the adhesive tape, the adhesive tape is embossed for a certain period of time, and the adhesive tape is embossed. [Patent Document 1] International Publication WO2007/U6856 [Abstract] PROBLEM TO BE SOLVED BY THE INVENTION The present invention has been made to solve the above problems. It is an object of the invention to provide an adhesive tape which has a step-following property which can sufficiently fill the unevenness of the adherend, and which can maintain a state in which the unevenness is sufficiently filled over time. Solution to Problem The adhesive tape of the present invention has an adhesive layer and a substrate layer, and the storage elastic modulus of the adhesive layer at 20 C is 〇5xl〇6 Pa~i 〇xl〇8 Pa, the adhesive layer In 2 (TC~8 (the loss tangent tanS under rc is above. In a preferred embodiment, the above adhesive layer comprises amorphous propylene_(1-butene) copolymer obtained by polymerization using a metallocene catalyst) The weight average molecular weight (Mw) of the propylene-butene copolymer is 200,000 or more, and the molecular weight distribution (Mw/Mn) of the propylene-(1·butene) copolymer is 2 or less. In a preferred embodiment, The 180 for the mirror surface of the semiconductor mirror wafer is specified in JIS-Z-0237. The peel adhesion is 22 n/20 mm to 3.0 N/20 mm. In the preferred embodiment, the adhesive tape of the present invention According to the present invention, an adhesive tape can be provided which has a specific storage elastic modulus by co-extruding the adhesive layer forming material with the base material forming material. I63077.doc -4 · 201249953 Number and loss tangent tan5 adhesive layer, and can be filled with paste The step of the unevenness of the body is maintained, and the state in which the unevenness is sufficiently filled can be maintained over time. [Embodiment] The entire structure of the adhesive tape is a circle 1 and the outline of the adhesive tape of the preferred embodiment of the present invention is obtained. The adhesive tape 100 is provided with an adhesive layer 10 and a substrate layer 20. The thickness of the adhesive tape 100 is preferably 25 μηη to 500 μηι, more preferably 6 μηηι to 300 μιη, and particularly preferably 13〇μηι~265 The thickness of the adhesive layer 10 is preferably from 20 μm to 100 μm, and further preferably from 3 μm to 65 μm. The thickness of the substrate layer 20 is preferably 5 μm to 4 μm, and more preferably 1 μm. Further, the adhesive tape of the present invention may further comprise any other suitable layer. The other layer may, for example, be provided on the opposite side of the substrate layer from the adhesive. A surface layer capable of imparting heat resistance to the adhesive tape. The adhesive tape of the present invention can be provided in the form of a protective layer by a spacer layer. The adhesive tape of the present invention can be wound into a hydrophilic barrier layer in a state of being protected by a spacer layer. Make The protective tape is protected until it is provided as a practical protective material. Examples of the spacer layer include surface coating by a release agent such as a bismuth-based release agent fluorine-based release agent or a long-chain acrylic-based vinegar-based release agent. Plastic film (such as polyethylene terephthalate 163077.doc 201249953 (PET), polyethylene, polypropylene), film formed from non-polar materials (such as polyethylene, polypropylene), non-woven fabric or paper, etc. The adhesive tape of the present invention may be subjected to back treatment on the outermost side opposite to the adhesive layer, for example, when it is not protected by the spacer layer. The back treatment can be carried out, for example, by using a release agent such as a ruthenium release agent or a long-chain alkyl acrylate release agent. The adhesive tape of the present invention can be wound into a roll shape by performing a backside treatment. The adhesive tape of the present invention is 180 as defined by JIS_z_0237 of the mirror surface of the semiconductor mirror wafer. The peeling adhesive force is preferably 〇2 N/2〇mm~3 〇N/20mm, and further preferably 〇.4N/2〇mm~2.5N/2〇mm, and particularly preferably 〇·4 N/20 mm~ 2.0 N/20 mm. In the case of such a range, adhesiveness and releasability can be simultaneously provided, for example, an adhesive tape which can be easily peeled off after the grinding process without being peeled off during the grinding process of the back grinding step of the semiconductor wafer. In addition, in the present specification, the above-mentioned adhesive force refers to the method of manufacturing the adhesive tape after the thief is matured for 2 days, by the method according to Jisz (the fitting condition: 2 kg round trip, peeling speed: 300 mm) / min, peel angle ι8 〇〇) The measured adhesion. In the present specification, the index of the step followability of the adhesive tape is "the width of the ridge of the ridge" as shown in FIG. 2, which means that the adhesive tape 100 is attached to the step x with the step difference When the body 20 is smashed, the adhesive tape is swelled and has a width of 3 which is in contact with the body. The width of the ridge is small, and it is excellent in the followability of the step, and the unevenness of the filler can be satisfactorily filled. When the adhesive tape of the present invention is attached to a Shihwa semiconductor mirror wafer, the adhesion width of the adhesive tape of the present invention to the step 3G (four) after the bonding of I63077.doc 201249953 is preferably 420 (four) or less. Further preferably, it is preferably 5 (four) ~ then called, and particularly preferably 1 〇 220 (4). The adhesive tape of the present invention has a small ridge degree, and the bump of the adhesive body (for example, a pattern of a semiconductor wafer) has good followability and can be well landfilled. The C5 & when the adhesive tape is used for the pattern surface protection in the semiconductor wafer processing, when the back grinding step is performed, the material conductor wafer uniformly applies the house force, and the unevenness of the pattern surface is not Will have an impact on the greedy surface of semiconductor wafers' smoothing Ground grinding, which prevents cracking of the semiconductor wafer. Further, it prevents the grinding water from immersing between the semiconductor wafer and the adhesive tape.

When the adhesive tape of the present invention is attached to a tantalum semiconductor mirror wafer, the amount of increase in the width of the ridge width of 30 μm is preferably within 1% by weight, and more preferably 5 Å/min. Within. As long as it is in this range, after the adhesive tape is attached to the semiconductor wafer, after a certain period of time, even if the semiconductor wafer is supplied to the back grinding step, the semiconductor wafer can be well filled. The state of the unevenness of the pattern surface can smoothly grind the back surface as described above, and the crack of the semiconductor wafer can be prevented. It is particularly preferable that the above-mentioned adhesive tape does not increase in the width of the ridge after one hour after the bonding. When the adhesive tape of the present invention is attached to a tantalum semiconductor mirror wafer, the adhesion width of the adhesive tape of the present invention to the step of 3 〇μm is preferably 470 μηι or less after one hour of bonding. Further preferably, 1 〇 μιη to 35 〇 μιη ' is preferably 2 〇 μηι to 300 μηι, and most preferably 30 μηι to 250 μηι. Β·Adhesive layer The storage elastic modulus (Gi) of the above adhesive layer at 20t is 〇5χ1〇6 163077.doc 201249953

Pa~UMO8 Pa' is preferably 〇8xl〇6 Pa~3.0M07 Pae as long as the storage elastic modulus (G,) of the above adhesive layer is in such a range, an adhesive tape excellent in step followability can be obtained. More specifically, as described above, an adhesive tape having a small ridge width can be obtained. If such an adhesive tape is used for the back grinding step of the semiconductor wafer processing, the back surface can be smoothly ground as described above, and the crack of the semiconductor wafer can be prevented. Further, as long as the storage elastic modulus (G·) of the pressure-sensitive adhesive layer is in the above range, an adhesive tape which can simultaneously have sufficient adhesion to the adherend having irregularities on the surface and moderate peeling property can be obtained. Further, the storage elastic modulus (G,) of the present invention can be measured by dynamic viscoelasticity measurement. The adhesive layer is 2 (TC~8 (the loss tangent tanS at TC is 〇 or more), preferably 0.2 or more, and further preferably 〇.2 to 1. The adhesive layer is at 2 〇. The tanS is preferably 0.1 to 0.5' and further preferably 〇" to 〇 25. The loss tangent taM of the adhesive layer at 80eC is preferably 〇.2~h〇, more preferably 0.45~1, and particularly preferably 〇. .5~1. Thus, the adhesive layer having a high loss tangent tanS in a high temperature region has a high adhesion in a high temperature region and is difficult to deform. Here, the difficulty of deforming the adhesive layer in a high temperature region can be based on The theory of the time-temperature conversion algorithm is converted into a slow deformation of the adhesive layer generated at room temperature over time. That is, it is considered that the adhesive having a more tangent tan tan5 in the high temperature region as described above is considered. The layer is slowly deformed at room temperature (specifically, the phenomenon that the width of the ridge increases with time) is suppressed. Therefore, as long as the loss tangent tanS of the above adhesive layer is in the range described above, After a certain period of time after fitting, Holder I63077.doc 201249953 The adhesive tape 0 having a small width and a good landfill in the state of the unevenness of the adherend is used as the material constituting the above adhesive layer, as long as the above-mentioned special (4) can be obtained. The material of the crucible is typically a polyolefin-based resin. The adhesive layer preferably comprises an amorphous propylene (1-butylene) copolymer. 'There is a number of steps which can be made by co-extrusion with the substrate layer, and the adhesive tape can be obtained without using an organic solvent. In addition, in this specification, the term "amorphous" is used. It means a property which does not have a clear melting point like crystalline. The above amorphous propylene succinimide copolymer can be obtained by polymerizing propylene and butene using a metallocene catalyst. In more detail, the amorphous propylene-(1-butene) copolymer can be obtained, for example, by a polymerization step of polymerizing propylene and h using a dioxin=catalyst, in which the polymerization is repeated. Thereafter, the post-processing step "amorphous propylene disulfide" copolymer such as the (four) medium residual removal step and the foreign matter removal step is obtained by such a step, for example, in the form of =. As the metallocene catalyst, for example, a di-pentametal compound and a dimetallocene metal of the oxy-enriched metal can be uniformly mixed with a metallocene-supporting catalyst. The amorphous propylene dimer obtained by polymerization of the ruthenium metallocene catalyst exhibits a narrow molecular weight distribution. The molecular weight distribution (Mw/Mn) of the amorphous propylene and the second is preferably 2 or less, and is preferably Η2 to 2'. Since the molecular weight distribution is narrow, I63077.doc 201249953 ^amorphous propane (tetra)-butene) copolymer has a low molecular weight component, so that if such an amorphous propylene pentene copolymer is used, it can be prevented from being low. An adhesive tape caused by the overflow of the molecular weight component to the contaminated body. Such an adhesive tape can be suitably used, for example, for semiconductor wafer processing purposes. In the above amorphous propylene-(1-butene) copolymer, the content ratio of the composition derived from propylene is preferably from 9% to 99% by mole, and more preferably from 0% to 99% by mole. %, especially good for 9 〇 耳 %%%%%. The content ratio of the constituent unit derived from i•butylene in the above amorphous propylene-(1-butylene) copolymer is preferably from ? mol% to 15 mol%, and further preferably i mol. /. ~1G Mo. In the case of such a range, an adhesive tape having excellent balance between the properties and the flexibility and having a small width of the above-mentioned ridges can be obtained. The amorphous propylene (1-butylene) copolymer can be a block copolymer. Further, the random copolymer may be a weight average molecular weight (Mw) of the amorphous propylene-(1.butene) copolymer of preferably 200,000 or more, and more preferably 2 〇〇〇〇〇 to 5 〇. 〇, _, 尤佳, 0,000~300, _. As long as the average molecular weight (Mw) of the amorphous propylene (1·butene) copolymer is in this range, the styrene-based thermoplastic resin can be obtained. Acrylic thermoplastic resin (—1 〇〇, _ or less) is an adhesive tape that is less than a low knives + component and can prevent contamination by the adherend. In the case where an adhesive layer is formed and an appropriate adhesive force is obtained. The amorphous propylene-(1-butene) copolymer is at 23 Å. The melt flow rate under 〇, 2 16 coffee is preferably 1 g/10. Min~5〇g/1〇min, further preferably 5 g/l〇min~30 g/10 min, particularly preferably 5 g/1〇min~2〇g/i〇min. 163077.doc 201249953 To be amorphous, (1, butyl, meth, m, 'the melt flow rate of the copolymer) is a rare one, and it can be used for this kind of uniform by co-extrusion. Adhesive layer: The measurement is carried out by forming a thickness method in the case of poor workmanship. "The rate of motion can be determined by the basis of JISK7210, ie, the polymer does not impair the effect of the present invention. Further, other monomers derived from the effect of the month may be further included, and examples thereof include ethylene: a constituent unit, and dilute, 1-decene, 4-methyl i hexamethylene, and 1-hexene. I-octyl is preferably a (tetra) hydrocarbon such as methyl pentene. Preferably, the upper 4 adhesive layer is substantially NO; ·, scv·, Li+, Na+ r 3 CI, Br, Ν〇2·,

Li, Na, κ, Μ 2+ 2+ lie in: it prevents the ionic contamination of the viscous/body NH4. The reason for this is that, for the case of semiconductor wafer processing applications, the circuit is not broken or short-circuited. The adhesive which does not contain the above-mentioned ions is polymerized as described above using a metallocene catalyst, and the amorphous propylene-(1-butene) copolymer contained in the adhesive layer is polymerized. In the bath polymerization using the metallocene catalyst, the amorphous (four) human. 々 only (d) d-butan) copolymer can be used in different types of poor solvent soil, cut into the sputum The purification is carried out by the (reprecipitation method)', so that an adhesive layer not containing the above ions can be obtained. Furthermore, in the present specification, the phrase "substantially does not include η Br, NCV, Ν〇3·, s〇42-, u+, he+, κ+, heart, μ, Λ" means standard ion chromatography. The detection limit (for example, ion chromatographic analysis using the company name "DX-32" and "DX_5G") is not reached. * Body means relative to the dot layer ig, F ·, C i · , ΒΓ·, Ν〇2-, Ν〇3·, δ〇4^κ, ^〇49_τ ι^ I63077.doc • 11 201249953

Na is 0.20 μ§ or less, and M 2+ NH/ is. , the following situation / and. Knife is not. ~ Next, in order to adjust the adhesion of the adhesive layer (the result is the upper elastic modulus, the above adhesive layer may also contain crystal: = resin. By containing a crystalline polypropylene resin, it can be lowered 4^ Increasing the above-mentioned elastic modulus of the material. The ratio of the crystalline polypropylene resin can be set according to the required adhesive force and the storage elastic modulus, and the ratio is relative to the above-mentioned amorphous propylene sulfonate copolymer L. The total weight of the crystalline polypropylene resin is preferably 〇% by weight to 45% by weight, more preferably 〇% by weight to 〇4% by weight, more preferably 〇 Weight %~20 weight 〇/. . The above crystalline polypropylene-based resin may be a homopolypropylene or a copolymer obtained by copolymerizing propylene with a monomer copolymerizable with propylene. Examples of the monomer copolymerizable with the propylene group include, for example, ethylene, pentene, κ hexene, octene, decene, 4 methyl-1, daughter, and 3-methyl pentane. Dilute α-anthracene and the like. The crystalline polypropylene-based resin is preferably obtained by polymerization using a metallocene catalyst in the same manner as the above amorphous propylene (!) butene copolymer. When the crystalline polypropylene resin obtained in this manner is used, contamination of the adherend due to overflow of the low molecular weight component can be prevented. The crystallinity of the above crystalline polypropylene resin is preferably 1% by mole or more, and more preferably 20% or more. Typically, crystallinity is obtained by differential scanning calorimeter (DSC) or X-ray diffraction. 163077.doc 201249953 The above-mentioned adhesion (4) may be carried out without impairing the effects of the present invention, and may further include other components. Examples of the other component include an antioxidant, an ultraviolet absorber, a light stabilizer, a heat stabilizer, and an electric resistance. The type and amount of other ingredients may be appropriately selected depending on the purpose. 1 c. Substrate layer $ As the material constituting the above substrate layer, any appropriate material can be used. Examples of the material constituting the base material layer include a polyester resin such as polyethylene terephthalate (ethylene) or a polyolefin resin such as polyethylene (ρρ) or the like; Brewed imine (ΡΙ); ethylene · acetic acid ethyl acetate copolymer (EVA) · 'polyether ether _ (ΡΕΕΚ); polystyrene (pvc) and other gas-rich vinyl resin; polystyrene resin; acrylic Resin; fluorine-based resin; cellulose-based resin; polycarbonate-based resin; metal; paper, and the like. The substrate layer may also be a multilayer construction comprising materials of the same or different species.

The above-mentioned adhesive layer may further contain other components as the other component, for example, the same as the other components which can be included in the adhesive layer described in the above item B, and may be contained in the range which does not impair the effects of the present invention. ingredient. D. Method for Producing Adhesive Tape The adhesive tape of the present invention is preferably produced by co-extruding a material for forming the above-mentioned adhesive layer and the above-mentioned base material layer. By co-extrusion molding, an adhesive tape having good adhesion between layers can be produced with a small number of steps and without using an organic solvent. In the above co-extrusion molding, the adhesive layer and the substrate layer can be formed. The material obtained by mixing the components of the above layers by any appropriate method is 163077.doc 201249953. As a specific method of the above co-extrusion molding, for example, the following method may be mentioned: at least 2 extrusions connected to the mold Below the machine A | J Dan T - the supply of the adhesive layer forming material, and the supply of the base material to the other substrate: after the melting (4), by the contact roll forming method, while borrowing (4) The closer the portion where the forming materials are joined, the closer the sigma (mould lip) is to the mold. The reason for this is that it is difficult to cause a poor merging of the respective forming materials in the mold. For A, as the above mold, a mold in the form of a multi-manifold is suitably used. Further, in the case where the merging failure occurs, appearance defects such as uneven merging may occur, and in particular, wavy appearance unevenness may occur between the extruded adhesive layer and the substrate layer, which is not preferable. Further, the confluence failure is caused, for example, by the fact that the difference in fluidity (melt viscosity) of the different kinds of forming materials in the mold is large, and the difference in the shear rate of the material forming the layers is large, so if a multi-manifold is used, The form of the mold, for different types of forming materials with poor fluidity, the range of material selection is wider than other forms (such as the form of the feed module). The type of screw used for the extrusion of each of the formed materials may be a single shaft or a double shaft. There are also more than 3 extruders. When the number of extruders is three or more, the material for forming the other layers can be further supplied. In the case where an adhesive tape having a two-layer structure (base material layer + adhesive layer) is produced by using three or more extruders, the same forming material may be supplied to two or more adjacent extruders, for example, for example, In the case of using three extruders, the same forming material can be supplied to two adjacent extruders. The forming temperature of the above co-extrusion molding is preferably from 16 ° C to 22 ° C, and more preferably from 170 C to 200 ° C. As long as it is in this range, the forming stability is excellent 163077.doc .14 · 201249953 is different. The difference between the adhesive layer forming material and the shearing viscosity of the substrate layer forming material under the conditions of temperature c and shear rate _see•丨 (adhesive forming material_base layer forming material) is preferably -150 Pa.s to 600 Pa.s, further preferably -100 Pa, s~55 〇 pa _ _ _ _ 〇 〜 〜 〜 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 The fluidity of the base material forming material in the mold is close to each other, and the occurrence of poor joining can be prevented. Further, the shear viscosity can be measured by using a double capillary type elongational viscometer. EXAMPLES Hereinafter, the present invention will be specifically described by examples, but the present invention is not limited by the examples. Further, in the examples, "parts" and "%" are based on weight unless otherwise specified. [Example 1] The adhesive layer forming material was an amorphous propylene-(1-butene) copolymer obtained by polymerization using a metallocene catalyst (manufactured by Sumitomo Chemical Co., Ltd., trade name "Tafthren H5002": derived from The constituent unit of propylene is 9% by mole%, and the constituent unit derived from 1-butylene is 1%, Mw=230,000, Mw/Mn = 1.8) The base material layer forming material is ethylene-vinyl acetate copolymer. (EVA) (manufactured by Mitsui DuPont, trade name "Evafiex ρ_ 1 〇〇7"). The adhesive forming material and the base material forming material were respectively put into a weaving machine to perform a melt-co-extrusion of a die-type mold (extrusion machine: manufactured by the company, trade name "GM30-28" / Τ mold: 163077 .doc 201249953 Feeding module method; extrusion temperature: 18 〇. The resin in the molten state and the Si-coated PET spacer layer that is passed through the forming section of the contact roll (manufactured by Mitsubishi Chemical Corporation, trade name "Diafoil MRF") : 38 μηι) After lamination, cooling is performed to obtain an adhesive tape having a thickness of 45 μm and a thickness of the substrate layer of 16 〇μηι. Further, the thickness of each layer is determined by the shape of the outlet of the τ-die. [Example 2] The adhesive layer forming material was an amorphous propylene-(1-butene) copolymer obtained by polymerization using a metallocene catalyst (manufactured by Sumitomo Chemical Co., Ltd., trade name "Tafthren Η5002": The constituent unit derived from propylene 9 〇 mol % / the constituent unit derived from 1-butene 10 mol %, Mw = 230,000 ' Mw / Mn = 1.8) 80 parts, and obtained by polymerization using a metallocene catalyst Crystalline polypropylene resin A mixture of 20 parts of the product of the company, trade name: r WINTEC WFX4", Mw = 363,000, Mw / Mn = 2.87). The base material forming material is ethylene-vinyl acetate copolymer (manufactured by Mitsui DuPont, trade name " Evaflex P-1007").

The adhesive forming material and the substrate layer forming material were respectively placed in an extruder to perform T-die melt co-extrusion (extruder: GM ENGINEERING, trade name "GM30-28" / T-die: The feed module method; the extrusion temperature of 180 〇, and the resin in the molten state and the Si-coated PET spacer layer which is passed through the forming portion of the contact roll (manufactured by Mitsubishi Chemical Corporation, trade name "Diafoil MRF": 38 μιη) After the lamination, cooling is performed to obtain a viscous tape having a thickness of the adhesive layer of 45 μm and a thickness of the substrate layer of 160 μη. 163077.doc • 16-201249953 [Example 3] In addition to amorphous propylene· (1. Dilute) The amount of the copolymer was changed from 8 parts to 6 parts. 'The amount of the crystalline poly(tetra) resin was changed from 2G to 4 parts, and the adhesive tape was obtained in the same manner as in Example 2. [Comparative Example 1] In addition to changing the mixing amount of the amorphous propylene-(1-butene) copolymer from 8 parts to 5 parts, the amount of the crystalline polypropylene resin was changed from 2 parts to 2 parts. In addition to 5 parts, an adhesive tape was obtained in the same manner as in Example 2. [Comparative Example 2] Formulation of butyl acrylate Copolymer obtained by copolymerization of 1 part of ester with 5 parts of acrylic acid (weight average molecular weight: 9 Å, hydrazine, solid content: 20%), 100 parts, isocyanate crosslinking as a crosslinking agent Two parts of a solvent (manufactured by Nippon Polyurethane Co., Ltd., trade name "Coronate L") and an epoxy-based crosslinking agent (manufactured by Mitsubishi Gas Corporation, trade name r Tetrad C) were prepared in one part to prepare an adhesive layer forming material. The adhesive layer forming material was applied to a polyester film (thickness: 38 μm) which was subjected to a ruthenium peeling treatment to a thickness of 45 μm after drying to dry at 120 C for 2 minutes to obtain an acrylic adhesive. Then, the above-mentioned acrylic adhesive was transferred onto a substrate layer (thickness: 160 μm) using an ethylene-acetic acid 6-olefin vinegar copolymer as a forming material to obtain an adhesive tape. [Evaluation] In the examples and comparative examples, The obtained adhesive tape was used for the following evaluation. The results are shown in Table 1. 163077.doc 17 201249953 (1) Adhesion (peeling speed 300 mm/min) After the obtained adhesive tape was aged at 50 ° C for 2 days, Mirrored by a 4 inch semiconductor wafer ( ()) and according to JIS Z 0237 (2000) method (bonding conditions: 2 kg roll back and forth, peeling speed: 3 〇〇 mm / min, peeling angle 180 °). (2) Width of the semiconductor An aluminum plate having a thickness of 30 μm and a width of 2 cm is placed on the wafer. The adhesive tape cut into a length of 1 cm and a width of 2 cm is attached across the aluminum plate (2 kg pro-reciprocated once). The observation under the microscope was carried out for the width of the ridge of the step 3 〇 μιη. The width of the ridge is measured immediately after attaching the adhesive tape and after 1 hour of attachment. (3) Storage elastic modulus (G·) Storage elastic modulus of the adhesive layer using a dynamic viscoelastic spectrometer (Rheometric Scientific The company's manufacturing, product name "ares", is measured in the range of frequency Η) Hz, heating rate 5t/min, and ~1Q()t. (4) Loss tangent tan5 The storage elastic modulus and the loss elastic modulus (G") are measured under the same conditions as the above stored elastic modulus (G,). The adhesive layer is calculated at 20 C by the following formula. Loss tangent tan δ at 80C. Loss tangent tank loss elastic modulus (G,,) / storage elastic modulus (5) Molecular weight determination example and comparative food used in the use of the metallocene catalyst to obtain amorphous polypropylene The molecular weight of the copolymer (manufactured by Sumitomo Chemical Co., Ltd.: 163077.doc • 18·201249953, trade name "Tafthren H5002") and the copolymer used in Comparative Example 3 was measured by the following method. That is, the sample was prepared as a THFg/Ι THF solution and allowed to stand overnight, and then filtered through a membrane filter having a pore size of 0.45 μm, and the obtained filtrate was poured into an HLC-8120GPC manufactured by TOSOH Co., Ltd. The measurement was carried out under the following conditions, and the molecular weight was calculated by polystyrene conversion. Column: TSKgel Super HZM-H/HZ4000/HZ3000/HZ2000 Column Size: 6.0 mm I.D.x 150 mm

Column temperature: 40 ° C

Dissolution: THF Flow rate: 0.6 ml/min Injection amount: 20 μΐ Detector: RI (differential refractive index detector) Further, the polymerization using a metallocene catalyst was used in Examples 2 to 3 and Comparative Example 1. The molecular weight of the crystalline polypropylene resin (manufactured by Nippon Polypropylene Co., Ltd., trade name "WINTEC WFX4") was measured by the following method. That is, the sample was prepared as a 0.10% (w/w) o-diphenylbenzene solution, and after dissolving at 140 ° C, the solution was filtered through a sintered filter having a pore size of 1.0 μm, and the obtained solution was obtained. The filtrate was poured into a gel permeation chromatograph Alliance GPC 2000 manufactured by Waters Co., Ltd., and the measurement was carried out under the following conditions, and the molecular weight was calculated by conversion of polystyrene.

Column: TSKgel GMH6-HT, TSKgel GMH6-HTL Column size: 7.5 mm IDx300 mm 2 columns Temperature: 140°C 163077.doc -19- 201249953 Dissolution: O-dibenzene flow: 1.0 ml/ Min Injection amount: 0 · 4 m 1 Detector: RI (differential refractive index detector) [Table 1] Example 1 Example 2 Example 3 Comparative Example 1 Comparative Example 2 Substrate layer material EVA EVA EVA EVA EVA Thickness ( Ηηι) 160 160 160 160 160 Adhesive layer main resin amorphous propylene-(1-butene) copolymer acrylic adhesive additive resin - crystalline polypropylene resin - blending ratio (main resin wt% / added resin wt %) 100/0 80/20 60/40 50/50 100/0 Thickness (μηι) 45 45 45 45 45 Evaluation of adhesion (N/20mm) 1.22 0.55 0.25 0.18 0.75 Storage elasticity only (20°C) MPa) 1.8 4.1 23.6 105 0.42 tan8 20°C 0.23 0.21 0.11 0.07 0.09 80°C 0.52 0.46 0.22 0.08 0.03 Width (μηι) Just attached 210 290 420 640 280 Attached 1 hour later 215 298 440 750 360 Increase rate 2.4 2.8 4.8 17.2 28.6 It is known from Table 1 that the adhesive tape of the present invention has a specific storage by the adhesive layer. Elastic modulus and the ridge width is small but also, by having a specific loss tangent of the smaller rate of increase tanS bulge width. Such an adhesive tape has good followability to the unevenness of the adherend (e.g., a pattern of a semiconductor wafer), and the unevenness can be well filled. Industrial Applicability The adhesive tape of the present invention can be suitably used, for example, for the protection of a workpiece (semiconductor wafer or the like) at the time of manufacture of a semiconductor device. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic cross-sectional view showing an adhesive tape according to a preferred embodiment of the present invention. • 20-163077.doc 201249953 Fig. 2 is a view showing the "bump width" which is an index of the step followability of the adhesive tape of the present invention. [Main component symbol description] 10 Adhesive layer 20 • Substrate layer 100 Adhesive tape 163077.doc -21 ·

Claims (1)

201249953 VII. Applying for the patent garden, the adhesive tape, which has the agent layer and the substrate layer, and the storage elastic modulus of the β-adhesive layer under 2〇〇c is 〇Pa Pa 'the adhesive layer is 20 The loss tangent tan5 at °c~80°c is 〇.〗 above. 2. For example, the Lemod+x of the item I of the fifth aspect, the pair of the above-mentioned adhesive layer containing the amorphous propylene-indene butene copolymer obtained by polymerization using a metallocene catalyst, the C The weight average molecular weight (Mw) of the copolymer is 200, the molecular weight distribution of the copolymer of propylene-0·butene) (Mw ic/\ p 〇 叫 叫 I I I I I I I The mirror of the needle is τ 7 made of the conductor mirror wafer 疋 疋 180. Peeling adhesion _~3·〇Ν/20_β f The knife is 0.2 Ν/20 4· The item 丨 or 2 of the adhesive tape, the system will The adhesive layer forming material is obtained by co-extrusion molding. The adhesive material of the base material and the base material of the adhesive layer is obtained by co-extruding the adhesive layer forming material. % (four) material and base Material 163077.doc