CN103380493B - 用于处理基片的设备和方法 - Google Patents

用于处理基片的设备和方法 Download PDF

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Publication number
CN103380493B
CN103380493B CN201280004525.1A CN201280004525A CN103380493B CN 103380493 B CN103380493 B CN 103380493B CN 201280004525 A CN201280004525 A CN 201280004525A CN 103380493 B CN103380493 B CN 103380493B
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CN
China
Prior art keywords
gripping
gripper
manipulator body
path
guide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201280004525.1A
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English (en)
Chinese (zh)
Other versions
CN103380493A (zh
Inventor
金京英
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Irecto Science Industry Co ltd
Original Assignee
Irecto Science Industry Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Irecto Science Industry Co ltd filed Critical Irecto Science Industry Co ltd
Publication of CN103380493A publication Critical patent/CN103380493A/zh
Application granted granted Critical
Publication of CN103380493B publication Critical patent/CN103380493B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/0019—End effectors other than grippers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J18/00—Arms
    • B25J18/007—Arms the end effector rotating around a fixed point
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/10—Program-controlled manipulators characterised by positioning means for manipulator elements
    • B25J9/1005—Program-controlled manipulators characterised by positioning means for manipulator elements comprising adjusting means
    • B25J9/1015—Program-controlled manipulators characterised by positioning means for manipulator elements comprising adjusting means using additional, e.g. microadjustment of the end effector
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Manipulator (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN201280004525.1A 2011-01-05 2012-01-05 用于处理基片的设备和方法 Expired - Fee Related CN103380493B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201161430029P 2011-01-05 2011-01-05
US61/430,029 2011-01-05
US13/343,506 2012-01-04
US13/343,506 US8702142B2 (en) 2011-01-05 2012-01-04 Apparatus and method for handling a substrate
PCT/US2012/020293 WO2012094470A2 (en) 2011-01-05 2012-01-05 Apparatus and method for handling a substrate

Publications (2)

Publication Number Publication Date
CN103380493A CN103380493A (zh) 2013-10-30
CN103380493B true CN103380493B (zh) 2016-04-13

Family

ID=46380100

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201280004525.1A Expired - Fee Related CN103380493B (zh) 2011-01-05 2012-01-05 用于处理基片的设备和方法

Country Status (6)

Country Link
US (1) US8702142B2 (https=)
JP (1) JP2014503121A (https=)
KR (1) KR20140039137A (https=)
CN (1) CN103380493B (https=)
TW (1) TWI546888B (https=)
WO (1) WO2012094470A2 (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9859141B2 (en) 2010-04-15 2018-01-02 Suss Microtec Lithography Gmbh Apparatus and method for aligning and centering wafers
US9837295B2 (en) 2010-04-15 2017-12-05 Suss Microtec Lithography Gmbh Apparatus and method for semiconductor wafer leveling, force balancing and contact sensing
RU2585000C1 (ru) * 2012-04-06 2016-05-27 Фудзи Сейко Ко., Лтд. Захватывающее устройство для бортового кольца
JP6013824B2 (ja) * 2012-07-27 2016-10-25 株式会社荏原製作所 ワーク搬送装置
CN104108605B (zh) * 2014-07-08 2016-08-17 深圳市华星光电技术有限公司 一种玻璃基板的取放装置
JP6534210B2 (ja) * 2015-10-14 2019-06-26 ローツェ株式会社 テープフレーム搬送のためのエンドエフェクタ、及びこれを備える搬送ロボット
KR102020294B1 (ko) * 2017-09-15 2019-09-11 (주)상아프론테크 슬롯 구조체 및 이를 포함하는 웨이퍼 보관 용기
SE544090C2 (en) * 2018-04-22 2021-12-21 Zenrobotics Oy Waste Sorting Gantry Robot
EP3657537A1 (en) * 2018-11-23 2020-05-27 ATOTECH Deutschland GmbH End effector for slab formed substrates
CN211208421U (zh) * 2020-03-05 2020-08-07 福建北电新材料科技有限公司 一种可拆卸蚀刻多片碳化硅蚀刻工装治具

Citations (5)

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Publication number Priority date Publication date Assignee Title
US6092971A (en) * 1996-10-09 2000-07-25 Staeubli Ag Wafer gripping device adapted to swivel wafers taken from a horizontal position in a storage container
US6109677A (en) * 1998-05-28 2000-08-29 Sez North America, Inc. Apparatus for handling and transporting plate like substrates
CN1308585A (zh) * 1998-07-10 2001-08-15 奥维尔·雷·霍布洛克斯 智能化的晶片搬运系统和方法
JP2002170862A (ja) * 2000-12-01 2002-06-14 Yaskawa Electric Corp ウェハー把持装置
US6540468B1 (en) * 1998-09-02 2003-04-01 Tec-Sem Ag Device and method for handling individual wafers

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Publication number Priority date Publication date Assignee Title
JPS6357190A (ja) * 1986-08-29 1988-03-11 キヤノン株式会社 物体移動用関節ア−ム装置
KR900006017B1 (ko) * 1987-12-18 1990-08-20 한국전기통신공사 가변직경형 웨이퍼운송장치
US5230599A (en) * 1991-09-27 1993-07-27 Orr Bobby J Trailer chassis handling apparatus
JP3173918B2 (ja) * 1993-05-18 2001-06-04 キヤノン株式会社 基板搬送ハンドおよびこれを備えた基板搬送装置
JPH0722502A (ja) 1993-06-30 1995-01-24 Hitachi Ltd 半導体ウエハのハンドリング装置
JP4190161B2 (ja) * 2001-05-08 2008-12-03 株式会社新川 ウェーハリングの供給返送装置
US20040102858A1 (en) 2001-09-04 2004-05-27 Boris Kesil Soft-touch gripping mechanism for flat objects
US7140655B2 (en) 2001-09-04 2006-11-28 Multimetrixs Llc Precision soft-touch gripping mechanism for flat objects
DE10259836A1 (de) * 2002-12-19 2004-07-15 Siemens Ag Greifer und Betriebsverfahren
US7300082B2 (en) 2003-07-21 2007-11-27 Asyst Technologies, Inc. Active edge gripping and effector
JP3944485B2 (ja) * 2004-01-19 2007-07-11 島田理化工業株式会社 基板チャッキング装置
JP4230973B2 (ja) * 2004-08-23 2009-02-25 株式会社東芝 基板搬送装置
US20060157998A1 (en) 2005-01-18 2006-07-20 Elik Gershenzon Contamination-free edge gripping mechanism and method for loading/unloading and transferring flat objects
US7318612B2 (en) * 2005-05-27 2008-01-15 Delbridge Wallace K Gravity actuated retrieval device
US20070018469A1 (en) 2005-07-25 2007-01-25 Multimetrixs, Llc Contamination-free edge gripping mechanism with withdrawable pads and method for loading/unloading and transferring flat objects
JP2007157996A (ja) * 2005-12-05 2007-06-21 Tokyo Seimitsu Co Ltd ワーク搬送装置及びワーク搬送方法
US20080213076A1 (en) 2007-03-02 2008-09-04 Stephen Hanson Edge grip end effector
JP4883017B2 (ja) 2008-01-24 2012-02-22 株式会社安川電機 基板把持装置およびそれを備えた基板搬送ロボット、半導体製造装置
JP5551878B2 (ja) * 2009-01-16 2014-07-16 リンテック株式会社 半導体ウエハの搬送装置
US8485413B2 (en) 2009-02-05 2013-07-16 Ethicon Endo-Surgery, Inc. Surgical stapling instrument comprising an articulation joint

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6092971A (en) * 1996-10-09 2000-07-25 Staeubli Ag Wafer gripping device adapted to swivel wafers taken from a horizontal position in a storage container
US6109677A (en) * 1998-05-28 2000-08-29 Sez North America, Inc. Apparatus for handling and transporting plate like substrates
CN1308585A (zh) * 1998-07-10 2001-08-15 奥维尔·雷·霍布洛克斯 智能化的晶片搬运系统和方法
US6540468B1 (en) * 1998-09-02 2003-04-01 Tec-Sem Ag Device and method for handling individual wafers
JP2002170862A (ja) * 2000-12-01 2002-06-14 Yaskawa Electric Corp ウェハー把持装置

Also Published As

Publication number Publication date
TWI546888B (zh) 2016-08-21
TW201232697A (en) 2012-08-01
WO2012094470A2 (en) 2012-07-12
US8702142B2 (en) 2014-04-22
JP2014503121A (ja) 2014-02-06
US20120169079A1 (en) 2012-07-05
CN103380493A (zh) 2013-10-30
WO2012094470A3 (en) 2012-09-13
KR20140039137A (ko) 2014-04-01

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Granted publication date: 20160413

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