KR20140039137A - 기판 조작 장치 및 방법 - Google Patents

기판 조작 장치 및 방법 Download PDF

Info

Publication number
KR20140039137A
KR20140039137A KR1020137016483A KR20137016483A KR20140039137A KR 20140039137 A KR20140039137 A KR 20140039137A KR 1020137016483 A KR1020137016483 A KR 1020137016483A KR 20137016483 A KR20137016483 A KR 20137016483A KR 20140039137 A KR20140039137 A KR 20140039137A
Authority
KR
South Korea
Prior art keywords
grip
grip member
effector
end effector
gripper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020137016483A
Other languages
English (en)
Korean (ko)
Inventor
김경영
Original Assignee
일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 filed Critical 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드
Publication of KR20140039137A publication Critical patent/KR20140039137A/ko
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/0019—End effectors other than grippers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J18/00—Arms
    • B25J18/007—Arms the end effector rotating around a fixed point
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/10—Program-controlled manipulators characterised by positioning means for manipulator elements
    • B25J9/1005—Program-controlled manipulators characterised by positioning means for manipulator elements comprising adjusting means
    • B25J9/1015—Program-controlled manipulators characterised by positioning means for manipulator elements comprising adjusting means using additional, e.g. microadjustment of the end effector
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Manipulator (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020137016483A 2011-01-05 2012-01-05 기판 조작 장치 및 방법 Withdrawn KR20140039137A (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201161430029P 2011-01-05 2011-01-05
US61/430,029 2011-01-05
US13/343,506 2012-01-04
US13/343,506 US8702142B2 (en) 2011-01-05 2012-01-04 Apparatus and method for handling a substrate
PCT/US2012/020293 WO2012094470A2 (en) 2011-01-05 2012-01-05 Apparatus and method for handling a substrate

Publications (1)

Publication Number Publication Date
KR20140039137A true KR20140039137A (ko) 2014-04-01

Family

ID=46380100

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020137016483A Withdrawn KR20140039137A (ko) 2011-01-05 2012-01-05 기판 조작 장치 및 방법

Country Status (6)

Country Link
US (1) US8702142B2 (https=)
JP (1) JP2014503121A (https=)
KR (1) KR20140039137A (https=)
CN (1) CN103380493B (https=)
TW (1) TWI546888B (https=)
WO (1) WO2012094470A2 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190030942A (ko) * 2017-09-15 2019-03-25 (주)상아프론테크 슬롯 구조체 및 이를 포함하는 웨이퍼 보관 용기
KR20210094594A (ko) * 2018-11-23 2021-07-29 아토테크더치랜드게엠베하 슬래브 형태의 기판을 위한 엔드 이펙터

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9859141B2 (en) 2010-04-15 2018-01-02 Suss Microtec Lithography Gmbh Apparatus and method for aligning and centering wafers
US9837295B2 (en) 2010-04-15 2017-12-05 Suss Microtec Lithography Gmbh Apparatus and method for semiconductor wafer leveling, force balancing and contact sensing
RU2585000C1 (ru) * 2012-04-06 2016-05-27 Фудзи Сейко Ко., Лтд. Захватывающее устройство для бортового кольца
JP6013824B2 (ja) * 2012-07-27 2016-10-25 株式会社荏原製作所 ワーク搬送装置
CN104108605B (zh) * 2014-07-08 2016-08-17 深圳市华星光电技术有限公司 一种玻璃基板的取放装置
JP6534210B2 (ja) * 2015-10-14 2019-06-26 ローツェ株式会社 テープフレーム搬送のためのエンドエフェクタ、及びこれを備える搬送ロボット
SE544090C2 (en) * 2018-04-22 2021-12-21 Zenrobotics Oy Waste Sorting Gantry Robot
CN211208421U (zh) * 2020-03-05 2020-08-07 福建北电新材料科技有限公司 一种可拆卸蚀刻多片碳化硅蚀刻工装治具

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6357190A (ja) * 1986-08-29 1988-03-11 キヤノン株式会社 物体移動用関節ア−ム装置
KR900006017B1 (ko) * 1987-12-18 1990-08-20 한국전기통신공사 가변직경형 웨이퍼운송장치
US5230599A (en) * 1991-09-27 1993-07-27 Orr Bobby J Trailer chassis handling apparatus
JP3173918B2 (ja) * 1993-05-18 2001-06-04 キヤノン株式会社 基板搬送ハンドおよびこれを備えた基板搬送装置
JPH0722502A (ja) 1993-06-30 1995-01-24 Hitachi Ltd 半導体ウエハのハンドリング装置
CH697146A5 (de) * 1996-10-09 2008-05-15 Tec Sem Ag Greifvorrichtung zur Handhabung von Wafern.
US6109677A (en) 1998-05-28 2000-08-29 Sez North America, Inc. Apparatus for handling and transporting plate like substrates
US6167322A (en) * 1998-07-10 2000-12-26 Holbrooks; Orville Ray Intelligent wafer handling system and method
EP1114440B1 (de) * 1998-09-02 2007-12-12 Tec-Sem AG Vorrichtung und verfahren zum handhaben von einzelnen wafern
JP2002170862A (ja) 2000-12-01 2002-06-14 Yaskawa Electric Corp ウェハー把持装置
JP4190161B2 (ja) * 2001-05-08 2008-12-03 株式会社新川 ウェーハリングの供給返送装置
US20040102858A1 (en) 2001-09-04 2004-05-27 Boris Kesil Soft-touch gripping mechanism for flat objects
US7140655B2 (en) 2001-09-04 2006-11-28 Multimetrixs Llc Precision soft-touch gripping mechanism for flat objects
DE10259836A1 (de) * 2002-12-19 2004-07-15 Siemens Ag Greifer und Betriebsverfahren
US7300082B2 (en) 2003-07-21 2007-11-27 Asyst Technologies, Inc. Active edge gripping and effector
JP3944485B2 (ja) * 2004-01-19 2007-07-11 島田理化工業株式会社 基板チャッキング装置
JP4230973B2 (ja) * 2004-08-23 2009-02-25 株式会社東芝 基板搬送装置
US20060157998A1 (en) 2005-01-18 2006-07-20 Elik Gershenzon Contamination-free edge gripping mechanism and method for loading/unloading and transferring flat objects
US7318612B2 (en) * 2005-05-27 2008-01-15 Delbridge Wallace K Gravity actuated retrieval device
US20070018469A1 (en) 2005-07-25 2007-01-25 Multimetrixs, Llc Contamination-free edge gripping mechanism with withdrawable pads and method for loading/unloading and transferring flat objects
JP2007157996A (ja) * 2005-12-05 2007-06-21 Tokyo Seimitsu Co Ltd ワーク搬送装置及びワーク搬送方法
US20080213076A1 (en) 2007-03-02 2008-09-04 Stephen Hanson Edge grip end effector
JP4883017B2 (ja) 2008-01-24 2012-02-22 株式会社安川電機 基板把持装置およびそれを備えた基板搬送ロボット、半導体製造装置
JP5551878B2 (ja) * 2009-01-16 2014-07-16 リンテック株式会社 半導体ウエハの搬送装置
US8485413B2 (en) 2009-02-05 2013-07-16 Ethicon Endo-Surgery, Inc. Surgical stapling instrument comprising an articulation joint

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190030942A (ko) * 2017-09-15 2019-03-25 (주)상아프론테크 슬롯 구조체 및 이를 포함하는 웨이퍼 보관 용기
KR20210094594A (ko) * 2018-11-23 2021-07-29 아토테크더치랜드게엠베하 슬래브 형태의 기판을 위한 엔드 이펙터

Also Published As

Publication number Publication date
TWI546888B (zh) 2016-08-21
TW201232697A (en) 2012-08-01
WO2012094470A2 (en) 2012-07-12
US8702142B2 (en) 2014-04-22
JP2014503121A (ja) 2014-02-06
CN103380493B (zh) 2016-04-13
US20120169079A1 (en) 2012-07-05
CN103380493A (zh) 2013-10-30
WO2012094470A3 (en) 2012-09-13

Similar Documents

Publication Publication Date Title
KR20140039137A (ko) 기판 조작 장치 및 방법
US11420337B2 (en) Transport apparatus
US10283395B2 (en) Substrate gripping hand and substrate transfer apparatus
US10109515B2 (en) Hand unit and transfer method
JP6018379B2 (ja) 基板保持装置
KR102287462B1 (ko) 통합된 얼라이너를 갖는 로봇
CN110249420B (zh) 基板把持手及基板搬运装置
KR101901028B1 (ko) 본딩 헤드 및 이를 포함하는 다이 본딩 장치
KR101068704B1 (ko) 기판 파지 장치 및 그것을 구비한 기판 반송 로봇, 반도체 제조 장치
KR20160139237A (ko) 기판을 파지하기 위한 그리퍼 및 이를 포함하는 장치
US12191187B2 (en) Dual arm with opposed dual end effectors and no vertical wafer overlap
KR20160139265A (ko) 기판을 파지하기 위한 그리퍼 및 이를 포함하는 장치
WO2009058096A1 (en) Device for supporting workpiece
KR102521081B1 (ko) 기판을 파지하기 위한 그리퍼 및 이를 포함하는 장치
KR200173017Y1 (ko) 웨이퍼 이송 장치
KR102765718B1 (ko) 기판 반송 장치
US20250316523A1 (en) Wafer holding tool
US12115654B2 (en) End effector for slab formed substrates
TWI776317B (zh) 全方位校正模組
KR100885238B1 (ko) 기판 이송 장치 및 방법
WO2025150281A1 (ja) 基板製造装置

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PC1202 Submission of document of withdrawal before decision of registration

St.27 status event code: N-1-6-B10-B11-nap-PC1202

WITB Written withdrawal of application
R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000