CN103368501B - 电路装置、振荡装置以及电子设备 - Google Patents

电路装置、振荡装置以及电子设备 Download PDF

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Publication number
CN103368501B
CN103368501B CN201310094990.5A CN201310094990A CN103368501B CN 103368501 B CN103368501 B CN 103368501B CN 201310094990 A CN201310094990 A CN 201310094990A CN 103368501 B CN103368501 B CN 103368501B
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China
Prior art keywords
circuit
oscillation
current
transistor
overdrive
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CN201310094990.5A
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English (en)
Chinese (zh)
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CN103368501A (zh
Inventor
石川匡亨
山本壮洋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
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Seiko Epson Corp
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Publication of CN103368501A publication Critical patent/CN103368501A/zh
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Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03L—AUTOMATIC CONTROL, STARTING, SYNCHRONISATION OR STABILISATION OF GENERATORS OF ELECTRONIC OSCILLATIONS OR PULSES
    • H03L5/00—Automatic control of voltage, current, or power
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03L—AUTOMATIC CONTROL, STARTING, SYNCHRONISATION OR STABILISATION OF GENERATORS OF ELECTRONIC OSCILLATIONS OR PULSES
    • H03L1/00—Stabilisation of generator output against variations of physical values, e.g. power supply
    • H03L1/02—Stabilisation of generator output against variations of physical values, e.g. power supply against variations of temperature only
    • H03L1/022—Stabilisation of generator output against variations of physical values, e.g. power supply against variations of temperature only by indirect stabilisation, i.e. by generating an electrical correction signal which is a function of the temperature
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Oscillators With Electromechanical Resonators (AREA)
CN201310094990.5A 2012-03-27 2013-03-22 电路装置、振荡装置以及电子设备 Active CN103368501B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012-071422 2012-03-27
JP2012071422A JP2013207363A (ja) 2012-03-27 2012-03-27 回路装置、発振装置及び電子機器
JPJP2012-071422 2012-03-27

Publications (2)

Publication Number Publication Date
CN103368501A CN103368501A (zh) 2013-10-23
CN103368501B true CN103368501B (zh) 2017-09-05

Family

ID=49234123

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CN201310094990.5A Active CN103368501B (zh) 2012-03-27 2013-03-22 电路装置、振荡装置以及电子设备

Country Status (3)

Country Link
US (1) US9112512B2 (https=)
JP (1) JP2013207363A (https=)
CN (1) CN103368501B (https=)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015088930A (ja) * 2013-10-30 2015-05-07 セイコーエプソン株式会社 発振回路、発振器、発振器の製造方法、電子機器及び移動体
JP2015088931A (ja) * 2013-10-30 2015-05-07 セイコーエプソン株式会社 発振回路、発振器、発振器の製造方法、電子機器及び移動体
JP6226127B2 (ja) * 2013-10-30 2017-11-08 セイコーエプソン株式会社 発振回路、発振器、発振器の製造方法、電子機器及び移動体
JP6347320B2 (ja) * 2014-03-13 2018-06-27 セイコーエプソン株式会社 発振回路、発振器、電子機器、移動体及び発振器の製造方法
JP6081404B2 (ja) * 2014-05-16 2017-02-15 株式会社東芝 発振回路
JP6385208B2 (ja) * 2014-09-03 2018-09-05 エイブリック株式会社 水晶発振回路及び電子時計
JP2016144092A (ja) * 2015-02-03 2016-08-08 セイコーエプソン株式会社 振動子の製造方法
JP2016144128A (ja) * 2015-02-04 2016-08-08 セイコーエプソン株式会社 発振器、電子機器及び移動体
JP6638340B2 (ja) * 2015-11-12 2020-01-29 セイコーエプソン株式会社 回路装置、発振器、電子機器及び移動体
JP6750314B2 (ja) * 2016-05-31 2020-09-02 セイコーエプソン株式会社 発振器、電子機器、移動体及び発振器の製造方法
KR102509586B1 (ko) * 2016-08-17 2023-03-14 매그나칩 반도체 유한회사 바이어스 전류 생성회로 및 이를 이용한 오티피 메모리 소자 읽기 방법
JP6930134B2 (ja) * 2017-02-28 2021-09-01 セイコーエプソン株式会社 発振器、電子機器及び移動体
EP3565112B1 (en) * 2018-03-09 2021-05-05 Shenzhen Goodix Technology Co., Ltd. Crystal oscillator
JP2019161450A (ja) * 2018-03-13 2019-09-19 シチズン時計株式会社 発振回路及び電子時計
JP7234656B2 (ja) 2019-01-29 2023-03-08 セイコーエプソン株式会社 発振回路、発振器、電子機器及び移動体
JP7304712B2 (ja) * 2019-02-27 2023-07-07 ローム株式会社 半導体装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101087106A (zh) * 2006-06-07 2007-12-12 罗姆股份有限公司 电源装置

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JPH0238615U (https=) * 1988-09-05 1990-03-14
JPH0677317U (ja) * 1993-04-09 1994-10-28 株式会社明電舎 水晶発振回路
JPH088650A (ja) * 1994-06-20 1996-01-12 Hitachi Ltd 水晶発振回路
JPH08204450A (ja) * 1995-01-30 1996-08-09 Nec Corp 半導体集積回路
JP2001168642A (ja) 1999-12-03 2001-06-22 Nec Corp 発振回路
JP2001217650A (ja) 2000-02-01 2001-08-10 Toyo Commun Equip Co Ltd 圧電発振器
JP3998233B2 (ja) * 2001-11-09 2007-10-24 セイコーＮｐｃ株式会社 発振回路および発振用集積回路
JP2004153433A (ja) 2002-10-29 2004-05-27 Niigata Seimitsu Kk 水晶発振器および半導体装置
JP2004350203A (ja) * 2003-05-26 2004-12-09 Matsushita Electric Ind Co Ltd 発振回路内蔵半導体集積回路
US7236062B2 (en) * 2005-03-21 2007-06-26 Broadcom Corporation Low phase noise crystal oscillator with supply noise filtering
JP4501875B2 (ja) 2006-03-01 2010-07-14 株式会社大真空 圧電振動デバイスおよびその製造方法
US7710212B2 (en) * 2007-07-23 2010-05-04 Analog Devices, Inc. Crystal oscillator with variable-gain and variable-output-impedance inverter system
JP2009105611A (ja) * 2007-10-23 2009-05-14 Panasonic Corp 発振回路及び発振器
JP5061857B2 (ja) 2007-11-12 2012-10-31 セイコーエプソン株式会社 圧電発振器
JP5183174B2 (ja) 2007-11-29 2013-04-17 日本電波工業株式会社 表面実装水晶発振器の製造方法及びこれ用の容器本体
JP5467959B2 (ja) * 2010-07-21 2014-04-09 ルネサスエレクトロニクス株式会社 半導体装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101087106A (zh) * 2006-06-07 2007-12-12 罗姆股份有限公司 电源装置

Also Published As

Publication number Publication date
US9112512B2 (en) 2015-08-18
JP2013207363A (ja) 2013-10-07
US20130257550A1 (en) 2013-10-03
CN103368501A (zh) 2013-10-23

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