CN103299177B - 锡焊检查方法和基板检查系统以及锡焊检查机 - Google Patents

锡焊检查方法和基板检查系统以及锡焊检查机 Download PDF

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Publication number
CN103299177B
CN103299177B CN201180064870.XA CN201180064870A CN103299177B CN 103299177 B CN103299177 B CN 103299177B CN 201180064870 A CN201180064870 A CN 201180064870A CN 103299177 B CN103299177 B CN 103299177B
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China
Prior art keywords
inspection
soldering
benchmark
measurement
reflow process
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CN201180064870.XA
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English (en)
Chinese (zh)
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CN103299177A (zh
Inventor
藤井心平
森弘之
中岛克起
谷上昌伸
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Omron Corp
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Omron Corp
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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0817—Monitoring of soldering processes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/083—Quality monitoring using results from monitoring devices, e.g. feedback loops
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
    • G01N2021/95661—Inspecting patterns on the surface of objects for PCB's for leads, e.g. position, curvature
    • G01N2021/95669—Inspecting patterns on the surface of objects for PCB's for leads, e.g. position, curvature for solder coating, coverage
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0465—Shape of solder, e.g. differing from spherical shape, different shapes due to different solder pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Operations Research (AREA)
  • Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Biochemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
CN201180064870.XA 2011-01-13 2011-03-17 锡焊检查方法和基板检查系统以及锡焊检查机 Active CN103299177B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011-004769 2011-01-13
JP2011004769A JP5365643B2 (ja) 2011-01-13 2011-01-13 はんだ付け検査方法、および基板検査システムならびにはんだ付け検査機
PCT/JP2011/056436 WO2012096003A1 (ja) 2011-01-13 2011-03-17 はんだ付け検査方法、および基板検査システムならびにはんだ付け検査機

Publications (2)

Publication Number Publication Date
CN103299177A CN103299177A (zh) 2013-09-11
CN103299177B true CN103299177B (zh) 2016-04-13

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CN201180064870.XA Active CN103299177B (zh) 2011-01-13 2011-03-17 锡焊检查方法和基板检查系统以及锡焊检查机

Country Status (5)

Country Link
JP (1) JP5365643B2 (ja)
CN (1) CN103299177B (ja)
DE (1) DE112011104725B9 (ja)
TW (1) TW201231960A (ja)
WO (1) WO2012096003A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI631316B (zh) * 2016-08-18 2018-08-01 斯庫林集團股份有限公司 檢查裝置及檢查方法

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103808276A (zh) * 2012-11-06 2014-05-21 株式会社高永科技 基板检查装置系统及基板检查方法
JP5884015B2 (ja) * 2012-11-19 2016-03-15 パナソニックＩｐマネジメント株式会社 電子部品装着システム
JP6118353B2 (ja) * 2013-02-03 2017-04-19 名古屋電機工業株式会社 部品実装基板検査方法及びその検査方法を採用する基板製造システム
KR20150022352A (ko) * 2013-08-23 2015-03-04 주식회사 고영테크놀러지 솔더 조인트 검사 방법
JP6349734B2 (ja) * 2014-01-14 2018-07-04 オムロン株式会社 品質管理装置、品質管理方法、およびプログラム
JP6387620B2 (ja) * 2014-02-06 2018-09-12 オムロン株式会社 品質管理システム
JP6277754B2 (ja) * 2014-02-06 2018-02-14 オムロン株式会社 品質管理システムおよび内部検査装置
JP6264072B2 (ja) * 2014-02-10 2018-01-24 オムロン株式会社 品質管理装置及びその制御方法
CN112040760B (zh) 2014-11-20 2022-04-01 株式会社高迎科技 检查装置及具有其的部件贴装系统
DE102015212690B3 (de) * 2015-07-07 2016-09-01 Robert Bosch Gmbh Anlage und Verfahren zur Lötstellenüberprüfung
CN106017322A (zh) * 2016-06-20 2016-10-12 无锡兴彦影像科技有限公司 用于电路板锡膏或贴片检测的色彩三维成像装置及方法
JP6988500B2 (ja) 2018-01-16 2022-01-05 オムロン株式会社 検査管理システム、検査管理装置、検査管理方法
CN110132960B (zh) * 2018-02-09 2021-12-14 飞旭电子(苏州)有限公司 电路板组件的检测方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1665385A (zh) * 2004-03-01 2005-09-07 欧姆龙株式会社 装配衬底的检查方法和系统与生产方法
CN1724999A (zh) * 2004-07-21 2006-01-25 欧姆龙株式会社 基板检查方法及装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04103921A (ja) 1990-08-22 1992-04-06 Sekisui Plastics Co Ltd 電子レンジ加熱用シート
JP3963959B2 (ja) * 1994-05-24 2007-08-22 松下電器産業株式会社 部品実装方法
JPH09260898A (ja) * 1996-03-27 1997-10-03 Matsushita Electric Ind Co Ltd 電子部品実装方法とその装置
JP3685035B2 (ja) * 2000-10-25 2005-08-17 松下電器産業株式会社 電子部品実装システムおよび電子部品実装方法
JP3966336B2 (ja) * 2004-03-15 2007-08-29 オムロン株式会社 部品実装基板用の検査方法および検査システム、部品実装基板の製造方法
JP2007287779A (ja) * 2006-04-13 2007-11-01 Matsushita Electric Ind Co Ltd 電子部品実装システムおよび搭載状態検査装置ならびに電子部品実装方法
JP4103921B2 (ja) * 2006-08-11 2008-06-18 オムロン株式会社 フィレット検査のための検査基準データの設定方法、およびこの方法を用いた基板外観検査装置
JP4978424B2 (ja) * 2007-10-25 2012-07-18 オムロン株式会社 部品実装検査の検査結果確認方法および検査結果確認システム
KR101251372B1 (ko) * 2008-10-13 2013-04-05 주식회사 고영테크놀러지 3차원형상 측정방법

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1665385A (zh) * 2004-03-01 2005-09-07 欧姆龙株式会社 装配衬底的检查方法和系统与生产方法
JP2005286309A (ja) * 2004-03-01 2005-10-13 Omron Corp 部品実装基板用の検査方法および検査システム、部品実装基板の製造方法
CN1724999A (zh) * 2004-07-21 2006-01-25 欧姆龙株式会社 基板检查方法及装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI631316B (zh) * 2016-08-18 2018-08-01 斯庫林集團股份有限公司 檢查裝置及檢查方法

Also Published As

Publication number Publication date
JP2012145483A (ja) 2012-08-02
DE112011104725T5 (de) 2013-10-17
JP5365643B2 (ja) 2013-12-11
DE112011104725B4 (de) 2016-07-14
DE112011104725B9 (de) 2016-09-29
WO2012096003A1 (ja) 2012-07-19
CN103299177A (zh) 2013-09-11
TW201231960A (en) 2012-08-01

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