CN1032723C - 表面安装型片状电容器 - Google Patents
表面安装型片状电容器 Download PDFInfo
- Publication number
- CN1032723C CN1032723C CN94103780A CN94103780A CN1032723C CN 1032723 C CN1032723 C CN 1032723C CN 94103780 A CN94103780 A CN 94103780A CN 94103780 A CN94103780 A CN 94103780A CN 1032723 C CN1032723 C CN 1032723C
- Authority
- CN
- China
- Prior art keywords
- capacitor
- cover
- lead
- supporter
- surface mount
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000003990 capacitor Substances 0.000 title claims abstract description 86
- 238000005476 soldering Methods 0.000 abstract 1
- 229910052782 aluminium Inorganic materials 0.000 description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 7
- 239000004411 aluminium Substances 0.000 description 7
- 238000003466 welding Methods 0.000 description 6
- 238000005452 bending Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 230000002950 deficient Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- HSFWRNGVRCDJHI-UHFFFAOYSA-N Acetylene Chemical compound C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 150000001398 aluminium Chemical class 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000010358 mechanical oscillation Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
- H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/08—Housing; Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR930005317 | 1993-03-31 | ||
| KR5317/93 | 1993-03-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1093196A CN1093196A (zh) | 1994-10-05 |
| CN1032723C true CN1032723C (zh) | 1996-09-04 |
Family
ID=19353228
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN94103780A Expired - Fee Related CN1032723C (zh) | 1993-03-31 | 1994-03-31 | 表面安装型片状电容器 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US5420748A (enExample) |
| JP (1) | JP2768897B2 (enExample) |
| KR (1) | KR970006434B1 (enExample) |
| CN (1) | CN1032723C (enExample) |
| TW (1) | TW266300B (enExample) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5865413A (en) * | 1995-08-07 | 1999-02-02 | Motorola Inc. | Surface mountable component holder |
| US6244544B1 (en) | 1999-02-19 | 2001-06-12 | Magnetek, Inc. | Method and apparatus for holding a capacitor without separable fasteners |
| JP2001085281A (ja) * | 1999-09-09 | 2001-03-30 | Honda Motor Co Ltd | 電気二重層コンデンサの配線構造 |
| DE60144181D1 (de) * | 2000-02-03 | 2011-04-21 | Panasonic Corp | Chipkondensator mit Hülle |
| USD539738S1 (en) * | 2005-02-02 | 2007-04-03 | Metra Electronics Corp. | Capacitor bracket |
| JP4889037B2 (ja) * | 2006-11-29 | 2012-02-29 | Necトーキン株式会社 | 表面実装型電解コンデンサおよびその製造方法 |
| US7532484B1 (en) * | 2008-02-11 | 2009-05-12 | Delphi Technologies, Inc. | Electronic component assembly |
| US20120081835A1 (en) * | 2010-09-30 | 2012-04-05 | Omron Corporation | Surface mounting socket for electrolytic capacitors and method for surface mounting of electrolytic capacitors |
| US9071211B1 (en) * | 2011-12-15 | 2015-06-30 | Anadigics, Inc. | Compact doherty combiner |
| KR20130112284A (ko) * | 2012-04-03 | 2013-10-14 | 현대모비스 주식회사 | 커패시터 캐리어 |
| CN102655731A (zh) * | 2012-05-10 | 2012-09-05 | 武汉正维电子技术有限公司 | 一种功率放大器的散热金属基板结构 |
| JP6052011B2 (ja) * | 2013-03-28 | 2016-12-27 | アイシン精機株式会社 | 部品支持構造 |
| US20160379760A1 (en) * | 2015-06-24 | 2016-12-29 | Kemet Electronics Corporation | Capacitor PCB Spacer |
| USD910562S1 (en) * | 2020-01-31 | 2021-02-16 | Associated Universites, Inc. | Snap-on protective cover |
| JPWO2023032831A1 (enExample) * | 2021-08-31 | 2023-03-09 | ||
| KR102736159B1 (ko) * | 2022-05-16 | 2024-12-02 | 삼화콘덴서공업 주식회사 | 표면실장형 원통형 전지 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS614421U (ja) * | 1984-06-12 | 1986-01-11 | マルコン電子株式会社 | チツプ型アルミ電解コンデンサ |
| JPS619832U (ja) * | 1984-06-23 | 1986-01-21 | エルナ−株式会社 | チツプ形電解コンデンサ |
| JPS6433914A (en) * | 1987-07-29 | 1989-02-03 | Sony Corp | Electronic part |
| US4931961A (en) * | 1988-03-07 | 1990-06-05 | Nippon Chemi-Con Corporation | Chip type capacitor and manufacture thereof |
| JPH0389510A (ja) * | 1989-08-31 | 1991-04-15 | Matsushita Electric Ind Co Ltd | アルミ電解コンデンサ |
| JP2546613Y2 (ja) * | 1990-12-28 | 1997-09-03 | 日本ケミコン株式会社 | チップ形コンデンサ |
| JPH04287306A (ja) * | 1991-03-15 | 1992-10-12 | Elna Co Ltd | チップ化用台座および同台座を有する電子部品 |
-
1994
- 1994-03-25 US US08/218,087 patent/US5420748A/en not_active Expired - Lifetime
- 1994-03-28 KR KR1019940006245A patent/KR970006434B1/ko not_active Expired - Fee Related
- 1994-03-29 JP JP6059061A patent/JP2768897B2/ja not_active Expired - Lifetime
- 1994-03-30 TW TW083102785A patent/TW266300B/zh not_active IP Right Cessation
- 1994-03-31 CN CN94103780A patent/CN1032723C/zh not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| TW266300B (enExample) | 1995-12-21 |
| US5420748A (en) | 1995-05-30 |
| JP2768897B2 (ja) | 1998-06-25 |
| KR940022607A (ko) | 1994-10-21 |
| KR970006434B1 (ko) | 1997-04-28 |
| CN1093196A (zh) | 1994-10-05 |
| JPH0774053A (ja) | 1995-03-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1032723C (zh) | 表面安装型片状电容器 | |
| US6710373B2 (en) | Means for mounting photoelectric sensing elements, light emitting diodes, or the like | |
| US20020105787A1 (en) | Casing for electronic control unit | |
| CN1115661C (zh) | 超声波传感器及其制造方法 | |
| US4431938A (en) | Grooved piezoelectric resonating element and a mounting therefore | |
| CN1148270A (zh) | 半导体封装和固定方法 | |
| CN1643624A (zh) | 自引导型表面安装元件保持装置 | |
| US7660495B2 (en) | Package elements and methods for securing a getter | |
| JPH0610669Y2 (ja) | 円筒型横置タイプ電子部品 | |
| JPH07142835A (ja) | 電子部品取り付け用スペーサ及び電子部品の取り付け構造 | |
| CN1084520C (zh) | 高压变阻器 | |
| JP4664531B2 (ja) | 光結合装置の製造方法 | |
| JPH03228415A (ja) | 水晶発振器 | |
| DE19626082A1 (de) | Bauelementgehäuse für eine Oberflächenmontage eines Halbleiter-Bauelementes | |
| JP2691412B2 (ja) | チップ形コンデンサ | |
| JPH073336Y2 (ja) | 加速度センサ | |
| US6746251B2 (en) | IC socket with a cover member and guiding members | |
| KR0185513B1 (ko) | 리브지지-바가형성된반도체패키지의포장용트레이 | |
| JPH0669085A (ja) | 電解コンデンサ用リード線端子の化成用容器 | |
| JPH0574982A (ja) | 半導体パツケージ | |
| JPH0731562Y2 (ja) | 端子付き電子部品およびその梱包材 | |
| JPS5852718Y2 (ja) | 気密封入容器 | |
| JPS5822332Y2 (ja) | 圧電素子の保持バネ | |
| JPH0718183Y2 (ja) | 水晶振動子 | |
| JPH0142355Y2 (enExample) |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C06 | Publication | ||
| PB01 | Publication | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |