CN103247603B - 半导体装置、制造半导体装置的方法以及电子设备 - Google Patents

半导体装置、制造半导体装置的方法以及电子设备 Download PDF

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Publication number
CN103247603B
CN103247603B CN201310049242.5A CN201310049242A CN103247603B CN 103247603 B CN103247603 B CN 103247603B CN 201310049242 A CN201310049242 A CN 201310049242A CN 103247603 B CN103247603 B CN 103247603B
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interlayer insulating
film
semiconductor device
bonding
semiconductor substrate
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Chinese (zh)
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CN103247603A (zh
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萩本贤哉
藤井宣年
青柳健
青柳健一
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Sony Corp
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Sony Corp
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US9716076B2 (en) 2017-07-25
US9147650B2 (en) 2015-09-29
US20170354199A1 (en) 2017-12-14
JP5994274B2 (ja) 2016-09-21
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US10485293B2 (en) 2019-11-26

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