CN103229066A - 晶片测试系统以及相关的使用和制造方法 - Google Patents

晶片测试系统以及相关的使用和制造方法 Download PDF

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Publication number
CN103229066A
CN103229066A CN201180056550XA CN201180056550A CN103229066A CN 103229066 A CN103229066 A CN 103229066A CN 201180056550X A CN201180056550X A CN 201180056550XA CN 201180056550 A CN201180056550 A CN 201180056550A CN 103229066 A CN103229066 A CN 103229066A
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CN
China
Prior art keywords
wafer
vacuum
space
interposer
changer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201180056550XA
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English (en)
Chinese (zh)
Inventor
亚伦·德宾
大卫·凯斯
摩根·T·约翰逊
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Advanced Inquiry Systems Inc
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Advanced Inquiry Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Inquiry Systems Inc filed Critical Advanced Inquiry Systems Inc
Publication of CN103229066A publication Critical patent/CN103229066A/zh
Pending legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0491—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets for testing integrated circuits on wafers, e.g. wafer-level test cartridge
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2601—Apparatus or methods therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2607—Circuits therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)
CN201180056550XA 2010-09-28 2011-09-28 晶片测试系统以及相关的使用和制造方法 Pending CN103229066A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US40423410P 2010-09-28 2010-09-28
US61/404,234 2010-09-28
PCT/US2011/053775 WO2012054201A1 (en) 2010-09-28 2011-09-28 Wafer testing systems and associated methods of use and manufacture

Publications (1)

Publication Number Publication Date
CN103229066A true CN103229066A (zh) 2013-07-31

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201180056550XA Pending CN103229066A (zh) 2010-09-28 2011-09-28 晶片测试系统以及相关的使用和制造方法

Country Status (6)

Country Link
US (4) US8405414B2 (enExample)
JP (1) JP2013540354A (enExample)
KR (1) KR20130138793A (enExample)
CN (1) CN103229066A (enExample)
SG (1) SG189154A1 (enExample)
WO (1) WO2012054201A1 (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021048650A1 (en) * 2019-09-12 2021-03-18 International Business Machines Corporation Compliant organic substrate assembly for rigid probes
CN114062718A (zh) * 2020-07-31 2022-02-18 矽创电子股份有限公司 芯片的测试垫结构
WO2023098119A1 (en) * 2021-11-30 2023-06-08 International Business Machines Corporation Compliant wafer probe assembly
CN116520123A (zh) * 2023-06-28 2023-08-01 深圳宏芯宇电子股份有限公司 一种晶圆测试设备及晶圆的测试方法

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CN108120853A (zh) * 2016-11-28 2018-06-05 联芯科技有限公司 芯片测试夹具
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Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021048650A1 (en) * 2019-09-12 2021-03-18 International Business Machines Corporation Compliant organic substrate assembly for rigid probes
CN114342054A (zh) * 2019-09-12 2022-04-12 国际商业机器公司 用于刚性探针的顺应有机基片组件
GB2602907A (en) * 2019-09-12 2022-07-20 Ibm Compliant organic substrate assembly for rigid probes
GB2602907B (en) * 2019-09-12 2023-09-20 Ibm Compliant organic substrate assembly for rigid probes
CN114062718A (zh) * 2020-07-31 2022-02-18 矽创电子股份有限公司 芯片的测试垫结构
WO2023098119A1 (en) * 2021-11-30 2023-06-08 International Business Machines Corporation Compliant wafer probe assembly
GB2628065A (en) * 2021-11-30 2024-09-11 Ibm Compliant wafer probe assembly
CN116520123A (zh) * 2023-06-28 2023-08-01 深圳宏芯宇电子股份有限公司 一种晶圆测试设备及晶圆的测试方法
CN116520123B (zh) * 2023-06-28 2023-09-19 深圳宏芯宇电子股份有限公司 一种晶圆测试设备及晶圆的测试方法

Also Published As

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US8872533B2 (en) 2014-10-28
KR20130138793A (ko) 2013-12-19
US20170219629A1 (en) 2017-08-03
US20120074976A1 (en) 2012-03-29
WO2012054201A1 (en) 2012-04-26
US20130314115A1 (en) 2013-11-28
US9612259B2 (en) 2017-04-04
US10571489B2 (en) 2020-02-25
US8405414B2 (en) 2013-03-26
JP2013540354A (ja) 2013-10-31
US20150015292A1 (en) 2015-01-15
SG189154A1 (en) 2013-05-31

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Application publication date: 20130731