CN103119739A - Led模块 - Google Patents

Led模块 Download PDF

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CN103119739A
CN103119739A CN2011800458616A CN201180045861A CN103119739A CN 103119739 A CN103119739 A CN 103119739A CN 2011800458616 A CN2011800458616 A CN 2011800458616A CN 201180045861 A CN201180045861 A CN 201180045861A CN 103119739 A CN103119739 A CN 103119739A
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packaging part
led module
mentioned
substrate
insulating barrier
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樋口佐智男
田中隆
沟口光则
乾刚司
福田敦男
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Panasonic Industrial Devices SUNX Co Ltd
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Panasonic Electric Works SUNX Co Ltd
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Abstract

本发明提供一种LED模块，具备：封装件，在相对的侧壁的外周面具有电极，搭载有与上述电极连接的发光元件；基座部件，由铜系金属构成；绝缘层，由绝缘材料构成，层叠于上述基座部件的表面；以及导电性的布线图案，形成于上述绝缘层的表面，通过焊锡与上述电极连接，上述绝缘层具有将配置有上述封装件的部位的一部分去除的贯通部，在隔着上述贯通部相对的上述封装件的背面与上述基座部件之间配置由焊锡构成的散热部。

Description

LED模块
技术领域
本发明涉及在封装件内搭载有LED芯片的LED模块。
背景技术
以往，提供一种将放电灯、激光振荡器等用作光源的光源装置，但是近年来，以低功耗化、长寿命化等为目的，提出各种将LED（发光二极管）模块作为光源的光源装置。作为对例如涂料、粘接剂、颜料等紫外线固化树脂照射紫外线而使树脂固化并干燥的紫外线照射装置的紫外线照射源，使用将发光波长设定在紫外线区域的LED模块。
在用于这种光源装置的LED模块中，在封装件内搭载LED芯片，以可得到期望光量的方式排列多个该封装件而构成LED模块。另外，作为各LED芯片，使用输出大的LED芯片，设定为可得到期望光量。
当对该LED模块通电而使LED芯片发光时，LED芯片发热。如上所述，在这种LED模块中，使用多个输出大的LED芯片，LED模块发出的热也大。另外，LED芯片的发光效率具有负的温度系数，所以具有如下问题：当基于LED芯片的发光量增大时，LED模块的发光效率降低。
因此，提出一种如例如专利文献1所记载的发光二极管的安装结构那样提高了散热效果的LED模块及其安装结构。在该专利文献1所记载的发光二极管的安装结构中，在导热率高的金属制的基座部件的上表面分别层叠绝缘层、布线图案、抗蚀剂而形成基板，将配置LED芯片的封装件安装于该基板的表面。此时，将位于封装件的背面侧的基板的绝缘层、抗蚀剂除去，在封装件与基座部件之间配置硅橡胶等导热部件。由此，从LED芯片发出的热通过导热部件和基座部件被释放，提高散热效果。
专利文献1：日本特开2006-100687号公报
但是，为了制造所述专利文献1所记载的LED模块，首先，在基座部件上分别层叠绝缘层、布线图案、抗蚀剂，然后，将安装有封装件的部位的绝缘层、布线图案、抗蚀剂分别除去。在该除去的部位配置导热部件，从其上配置封装件，该封装件配置有LED芯片，对设于封装件中的电极和布线图案进行锡焊。这样制造出所述专利文献1所记载的LED模块，但是制造工序大多复杂。
本发明是鉴于所述情况而完成的，其提供如下LED模块：能可靠地进行来自LED芯片的散热，并且能减少其制造工序。
发明内容
根据本发明的一实施方式的LED模块具备：封装件，在相对的侧壁的外周面具有电极，搭载有与电极连接的发光元件；基座部件，由铜系金属构成；绝缘层，由绝缘材料构成，层叠于基座部件的表面；以及导电性的布线图案，形成于绝缘层的表面，通过焊锡与电极连接，绝缘层具有将配置有封装件的部位的一部分去除的贯通部，在隔着贯通部相对的封装件的背面与基座部件之间配置由焊锡构成的散热部。
在该LED模块中，优选在封装件的背面设置金属制的散热层。
发明效果
根据本发明的一实施方式的LED模块，不需要在除去绝缘层等的部位配置导热部件的工序，可靠地释放来自发光元件的热，并且能减少制造所涉及的工序。
附图说明
本发明的目的和特征通过如下的附图和优选的实施例的说明而变得清楚。
图1是示出本实施方式所涉及的LED模块的主要部分的示意剖视图。
图2示出构成根据本发明的一实施方式的LED模块的基板，（a）是用于说明整个基板的俯视图，（b）是用于说明布线图案的俯视图，（c）是用于说明抗蚀剂层的俯视图，（d）是用于说明贯通孔的俯视图。
图3示出构成根据本发明的一实施方式的LED模块的封装件，（a）是俯视图，（b）是底视图，（c）是侧视图，（d）是（a）中的3D-3D剖视图。
具体实施方式
以下参照构成本说明书的一部分的附图更详细地说明本发明的实施方式。在整个附图中对相同或相似的部分标注相同附图标记并省略说明。
以下基于附图说明本发明的实施方式。
本实施方式的LED模块1作为紫外线的照射源，使用于对例如涂料、粘接剂、颜料等紫外线固化树脂照射紫外线而使树脂固化并干燥的紫外线照射装置。此外，在以下的说明中，只有没有特别限定，以图2（a）中的上下为LED模块1的前后、以图2（a）中的左右为LED模块1的左右、以图1中的上下为LED模块1的上下进行说明。
如图1和图2（a）所示，该LED模块1在形成为以左右方向为长度方向的矩形平板状的基板10的上表面沿左右方向排列多个封装件2而构成。在该紫外线照射装置中，在左右方向排列多个该LED模块1，而且在前后方向排列配置多列，由此设定为相对于规定的区域可得到期望光量。
如图3（a）～（b）所示，封装件2通过将LED芯片3、对施加于该LED芯片3的电压进行限制的过电压保护用的齐纳二极管芯片6收纳在设于封装件主体20的表面的凹部21内而构成。
封装件主体20利用例如氧化铝、氮化铝等高散热性陶瓷材料由注射成型件构成，注射成型件形成为以前后方向为长度方向的大致长方体状。在该封装件主体20的表面，使用例如MID（三维注射成型电路部件）技术使导电图案26、27、电极焊盘4a、4b图案化。
另外，在封装件主体20的表面（图3（d）的上表面）设有凹部21，凹部21从上侧看的形状形成为以前后方向为长边方向的长孔状。在该凹部21的底部，在封装件主体20的左右方向和前后方向的中央位置配置有LED芯片3。另外，在凹部21的底部，相对于LED芯片3在前后方向的一端侧（例如前侧）配置有齐纳二极管芯片6，在前后方向的另一端侧（后侧）设有后述的通孔22。
在此，在凹部21的底部，从LED芯片3与齐纳二极管芯片6之间的部位、以及LED芯片3与通孔22之间的部位分别设有朝向凹部21的开口侧（上侧）突出的肋23a、23b。即，在封装件主体20的凹部21内部，LED芯片3、齐纳二极管芯片6以及通孔22在被肋23a、23b分离的状态下在前后方向排列设置。此外，肋23a、23b的上表面位于比安装于凹部21a的LED芯片3的上表面更靠上侧。
另外，在封装件主体20的表面，在凹部21的周缘遍及全周形成有框状的导电图案26。该导电图案26与形成于凹部21a、21c的芯片焊盘部50、52连续设置，与LED芯片3和齐纳二极管芯片6的下表面侧的电极（未图示）电连接。另外，在封装件主体20的长度方向的一侧的端面（例如，前方侧的端面）形成有电极焊盘4b，电极焊盘4b从导电图案26向封装件主体20的背面延长。
另外，在封装件主体20的背面（图2（d）中的下表面），从封装件主体20的后端直至越过通孔22的附近设有凹部24。在封装件主体20的背面，在凹部24与其他部位之间设有台阶，凹部24的底面位于比除了凹部24之外的封装件主体20的背面更靠上侧。在该凹部24开设的通孔22的内周面被实施了电镀加工，与电极焊盘4a电连接，电极焊盘4a形成于与形成有电极焊盘4b的一侧相反侧的端面（例如，后方侧的端面）。
另外，在封装件主体20的凹部21b的大致整体形成有与通孔22电连接的导电图案27。在该导电图案27上连续设有焊盘28a、28b，焊盘28a、28b形成于肋23a、23b。焊盘28a分别通过焊丝（金属细线）25a、25b连接到LED芯片3的上表面侧的电极（例如，阴极电极）和齐纳二极管芯片6的上表面侧的电极。同样，焊盘28b、LED芯片3的上表面侧的电极通过焊丝（金属细线）25c连接。
另外，在封装件主体20的背面，在左右方向的中央部设有电镀加工为矩形形状的接合用焊盘5。
如上所述，封装件2的设于封装件主体20前后的侧壁的电极焊盘4a、4b与LED芯片3以及齐纳二极管芯片6电连接。由此，在电极焊盘4a、4b间提供电力，由此LED芯片3发光，照射紫外线。
基板10在由导热性高的铜系金属构成的基座部件11的上方侧的表面层叠绝缘层12、布线图案13、抗蚀剂层14而构成。另外，在基板10的四角设有螺纹孔10a，螺纹孔10a用于将基板10装配到紫外线照射装置。
而且，在基板10的表面的前后方向的两边缘，在基板10的上表面侧装配有电流加强筋18、18，电流加强筋18、18形成为以左右方向为长度方向的矩形形状，由铜等导电性高的金属构成。电流加强筋18、18利用后述的重熔处理与封装件2一起装配于基板10。该电流加强筋18与基板10的布线图案13电连接，经由布线图案13对各封装件2提供从紫外线照射装置提供的电力。在此，从紫外线照射装置提供电流值大的电力，但是通过将该电流加强筋18装配于基板10，能降低相对于所提供的电流的电阻值。能以少的损失对各封装件2提供电流值大的电力。
基板10的绝缘层12是将具有耐热性和绝缘性的聚酰亚胺成型为薄膜状（例如，约14μm程度的厚度）的层，以利用粘接剂等覆盖基座部件11的整个表面的方式形成于基座部件11的表面。
另外，基板10的布线图案13由将导电性能高的金属形成为薄膜状（例如，约18μm程度的厚度）的铜箔等构成。如图2（b）的斜线部所示，该布线图案13设于绝缘层12的上表面之中除了前后方向的中央部和螺纹孔10a的周围之外的部位。另外，布线图案13和配置于基板10的上表面侧的封装件2的电极焊盘4a、4b通过焊锡17连接（参照图1）。
另外，基板10的抗蚀剂层14是抑制焊锡粘附的阻焊层，如图2（c）的斜线部所示，形成于基板10的前后方向的中央部和周缘部的必要位置。另外，抗蚀剂层14沿着作为封装件2的排列方向的左右方向，以与配置封装件2的间隔相应的规定间隔形成有向前后方向的中央侧凹陷的槽部14a、14b。在此，各槽部14a、14b的宽度在配置封装件2时基于设于封装件2的电极焊盘4a、4b的配置位置、大小而设定。在本实施方式中，配置有电极焊盘4b的一侧的槽部14a在封装件2的左右方向的中央位置设定为比槽部14b窄的宽度。另外，配置有电极焊盘4a的一侧的槽部14b设定为与封装件2的左右方向的尺寸大致相等的尺寸。由此，防止在相邻的封装件2的电极焊盘4a、4b各自之间粘附焊锡。
另外，如图2（d）所示，基板10的绝缘层12和抗蚀剂层14各层的配置有封装件2的部位（基板10的前后方向的大致中央）被除去而形成有贯通部15。该贯通部15至少前后方向的大小设定为比封装件2的外周小的形状（参照图1）。
另外，在基板10的贯通部15的中央部设有用于释放由封装件2产生的热的焊锡（散热部）16，将配置于封装件2的背面的接合用焊盘（散热层）5和基座部件11热连接（参照图1）。
在此，说明本实施例的LED封装件1的制造方法。首先，在由铜系金属构成的基座部件11的整个上表面形成绝缘层12，挖穿绝缘层12而设置贯通部15。接着，在该绝缘层12的上表面形成布线图案13，以覆盖绝缘层12和布线图案13的方式形成抗蚀剂层14。接着，在布线图案13表面的基板10中的前后方向的中央侧的边缘部、与布线图案13表面的电流加强筋18接触的部位、以及基座部件11表面的贯通部15的大致中央部的各部位利用丝网印刷等形成膏状焊料。然后，将电流加强筋18、18和多个封装件2配置于基板10，利用重熔处理使所述的膏状焊料熔融。由此，封装件2安装于基板10，封装件2的电极焊盘4a、4b和基板10的布线图案13电连接，封装件2的接合用焊盘5和基板10的基座部件11热连接。另外，同时，电流加强筋18、18安装于基板10，电流加强筋18、18和布线图案13电连接。
这样，由封装件2的LED芯片3产生的热通过焊锡16和基座部件11被释放，能可靠地释放来自LED芯片3的热。另外，在使封装件2的电极焊盘4a、4b与布线图案13电连接时，能同时形成使接合用焊盘5和基座部件11热接合的焊锡16，所以不需要配置导热部件的工序，能减少制造工序。
另外，因为在封装件2的背面设置接合用焊盘5，所以能更可靠地释放由封装件2的LED芯片3产生的热。
另外，在抗蚀剂层14设有槽部14a、14b，槽部14a、14b的宽度根据封装件2的电极焊盘4b、4a的配置位置而设定，能防止在相邻的封装件2的电极焊盘4a、4b之间焊锡粘附。
以上说明了本发明的优选的实施方式，但是本发明不限定于这些特定实施方式，能在前面的权利要求的范围内进行各种变更和修正，可以说其也属于本发明的范畴。

Claims (2)

1.一种LED模块，其特征在于，具备：
封装件，在相对的侧壁的外周面具有电极，搭载有与上述电极连接的发光元件；基座部件，由铜系金属构成；绝缘层，由绝缘材料构成，层叠于上述基座部件的表面；以及导电性的布线图案，形成于上述绝缘层的表面，通过焊锡与上述电极连接，
上述绝缘层具有将配置有上述封装件的部位的一部分去除的贯通部，
在隔着上述贯通部相对的上述封装件的背面与上述基座部件之间配置有由焊锡构成的散热部。
2.如权利要求1所述的LED模块，其特征在于，在上述封装件的背面设有金属制的散热层。
CN2011800458616A 2010-09-27 2011-09-26 Led模块 Pending CN103119739A (zh)

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