CN103105127A - 检测器、压印装置以及物品制造方法 - Google Patents

检测器、压印装置以及物品制造方法 Download PDF

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Publication number
CN103105127A
CN103105127A CN2012103925325A CN201210392532A CN103105127A CN 103105127 A CN103105127 A CN 103105127A CN 2012103925325 A CN2012103925325 A CN 2012103925325A CN 201210392532 A CN201210392532 A CN 201210392532A CN 103105127 A CN103105127 A CN 103105127A
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China
Prior art keywords
mark
light
optical system
utmost point
detecting device
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Pending
Application number
CN2012103925325A
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English (en)
Chinese (zh)
Inventor
岩井俊树
三岛和彦
前田普教
箕田贤
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Canon Inc
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Canon Inc
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Application filed by Canon Inc filed Critical Canon Inc
Priority to CN201510210155.2A priority Critical patent/CN104792344B/zh
Publication of CN103105127A publication Critical patent/CN103105127A/zh
Pending legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
    • G01D5/26—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light
    • G01D5/32—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light with attenuation or whole or partial obturation of beams of light
    • G01D5/34—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light with attenuation or whole or partial obturation of beams of light the beams of light being detected by photocells
    • G01D5/36—Forming the light into pulses
    • G01D5/38—Forming the light into pulses by diffraction gratings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00—Measuring instruments characterised by the use of optical techniques
    • G01B9/02—Interferometers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7038—Alignment for proximity or contact printer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
    • G01D5/26—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light
    • G01D5/32—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light with attenuation or whole or partial obturation of beams of light
    • G01D5/34—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light with attenuation or whole or partial obturation of beams of light the beams of light being detected by photocells
    • G01D5/347—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light with attenuation or whole or partial obturation of beams of light the beams of light being detected by photocells using displacement encoding scales
    • G01D5/34707—Scales; Discs, e.g. fixation, fabrication, compensation
    • G01D5/34715—Scale reading or illumination devices

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Nanotechnology (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Length Measuring Devices By Optical Means (AREA)
CN2012103925325A 2011-10-21 2012-10-16 检测器、压印装置以及物品制造方法 Pending CN103105127A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510210155.2A CN104792344B (zh) 2011-10-21 2012-10-16 检测器、压印装置以及物品制造方法

Applications Claiming Priority (4)

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JP2011232121 2011-10-21
JP2011-232121 2011-10-21
JP2012220718A JP5706861B2 (ja) 2011-10-21 2012-10-02 検出器、検出方法、インプリント装置及び物品製造方法
JP2012-220718 2012-10-02

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106415193A (zh) * 2014-03-21 2017-02-15 卡尔佩迪姆技术有限公司 用于在柔性基板上制造微型结构的系统和方法
CN107924817A (zh) * 2015-08-21 2018-04-17 佳能株式会社 检测设备、压印装置、制造物品的方法、照明光学系统以及检测方法
CN108180836A (zh) * 2014-06-27 2018-06-19 佳能株式会社 位置检测装置
CN110088878A (zh) * 2016-12-16 2019-08-02 佳能株式会社 对准装置、对准方法、光刻装置和制造物品的方法
CN110553583A (zh) * 2018-05-31 2019-12-10 佳能株式会社 检测设备、方法、压印装置、平坦化设备和物品制造方法
CN112166384A (zh) * 2018-05-24 2021-01-01 Asml荷兰有限公司 用于确定标记检测系统中的测量束的期望波长带宽的带宽计算系统和方法
CN113192930A (zh) * 2021-04-27 2021-07-30 上海华虹宏力半导体制造有限公司 偏移检测结构及基板偏移的检测方法

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5713961B2 (ja) * 2011-06-21 2015-05-07 キヤノン株式会社 位置検出装置、インプリント装置及び位置検出方法
JP6285666B2 (ja) * 2013-09-03 2018-02-28 キヤノン株式会社 検出装置、リソグラフィ装置、物品の製造方法及び検出方法
JP6541328B2 (ja) 2013-11-26 2019-07-10 キヤノン株式会社 検出装置、インプリント装置、および物品の製造方法
JP6552521B2 (ja) * 2014-12-12 2019-07-31 キヤノン株式会社 インプリント装置、インプリント方法及び物品の製造方法
JP6669432B2 (ja) * 2015-02-05 2020-03-18 旭化成株式会社 位置合わせ方法、インプリント方法、及びインプリント装置
JP6525628B2 (ja) * 2015-02-13 2019-06-05 キヤノン株式会社 インプリント装置及び物品の製造方法
WO2016187453A1 (en) * 2015-05-19 2016-11-24 Kla-Tencor Corporation Self-moiré target design principles for measuring unresolved device-like pitches
JP6604793B2 (ja) * 2015-09-17 2019-11-13 キヤノン株式会社 インプリント装置および物品製造方法
DE102016202198A1 (de) * 2016-02-12 2017-08-17 Carl Zeiss Smt Gmbh Vorrichtung zur Moiré-Vermessung eines optischen Prüflings
JP6685821B2 (ja) * 2016-04-25 2020-04-22 キヤノン株式会社 計測装置、インプリント装置、物品の製造方法、光量決定方法、及び、光量調整方法
JP6884515B2 (ja) * 2016-05-10 2021-06-09 キヤノン株式会社 位置検出方法、インプリント装置及び物品の製造方法
JP7257853B2 (ja) * 2019-04-02 2023-04-14 キヤノン株式会社 位置検出装置、露光装置および物品製造方法
JP7328806B2 (ja) 2019-06-25 2023-08-17 キヤノン株式会社 計測装置、リソグラフィ装置、および物品の製造方法
JP7510280B2 (ja) * 2020-06-02 2024-07-03 キヤノン株式会社 検出器、インプリント装置および物品製造方法
JP2024014030A (ja) * 2022-07-21 2024-02-01 キヤノン株式会社 検出装置、リソグラフィー装置および物品製造方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200538704A (en) * 2004-05-21 2005-12-01 Zetetic Inst Apparatus and methods for overlay, alignment mark, and critical dimension metrologies based on optical interferometry
JP2005337953A (ja) * 2004-05-28 2005-12-08 Nikon Corp 位置検出方法および位置検出装置
TW200609483A (en) * 2004-05-28 2006-03-16 Nikon Corp Method of adjusting optical imaging system, imaging device, positional deviation detecting device, mark identifying device and edge position detecting device
CN1977144A (zh) * 2004-04-27 2007-06-06 住友重机械工业株式会社 检测装置及台装置
US20080073604A1 (en) * 2006-09-22 2008-03-27 Canon Kabushiki Kaisha Imprint apparatus and imprint method
CN101941353A (zh) * 2009-07-10 2011-01-12 颖台科技股份有限公司 光固化复合树脂的膜片制作方法

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62172203A (ja) * 1986-01-27 1987-07-29 Agency Of Ind Science & Technol 相対変位測定方法
EP0498006A1 (en) 1991-02-06 1992-08-12 International Business Machines Corporation Superheterodyning technique in the spatial frequency domain and structure for pattern registration measurement
JPH07130614A (ja) 1993-06-30 1995-05-19 Toshiba Corp 位置合せ装置
JP3327781B2 (ja) 1995-10-13 2002-09-24 キヤノン株式会社 位置検出装置及びその検定方法と調整方法
JPH09189520A (ja) * 1996-01-12 1997-07-22 Nikon Corp 位置検出装置
US6654128B2 (en) * 1997-06-30 2003-11-25 Canon Kabushiki Kaisha Displacement information detecting apparatus
JPH11211415A (ja) 1998-01-29 1999-08-06 Canon Inc 位置検出装置及びそれを用いたデバイスの製造方法
JP4616983B2 (ja) 2000-11-22 2011-01-19 キヤノン株式会社 位置検出装置、該検出装置を用いた投影露光装置及びデバイス製造方法
JP2003068613A (ja) * 2001-08-27 2003-03-07 Nikon Corp 位置合わせ装置
JP4046961B2 (ja) 2001-09-03 2008-02-13 キヤノン株式会社 位置検出方法、位置検出装置、露光装置及び露光方法
JP4366031B2 (ja) 2001-09-17 2009-11-18 キヤノン株式会社 位置検出装置及び方法並びに露光装置、デバイスの製造方法
JP2003092248A (ja) 2001-09-17 2003-03-28 Canon Inc 位置検出装置、位置決め装置及びそれらの方法並びに露光装置及びデバイスの製造方法
JP2005166785A (ja) 2003-12-01 2005-06-23 Canon Inc 位置検出装置及び方法、並びに、露光装置
JP2006010645A (ja) * 2004-06-29 2006-01-12 Tohoku Univ 検出装置及びステージ装置
JP4691922B2 (ja) * 2004-07-29 2011-06-01 株式会社ニコン 結像光学系の調整方法
US7630067B2 (en) 2004-11-30 2009-12-08 Molecular Imprints, Inc. Interferometric analysis method for the manufacture of nano-scale devices
US20070231421A1 (en) 2006-04-03 2007-10-04 Molecular Imprints, Inc. Enhanced Multi Channel Alignment
US7292326B2 (en) 2004-11-30 2007-11-06 Molecular Imprints, Inc. Interferometric analysis for the manufacture of nano-scale devices
DE102007025306B9 (de) * 2007-05-30 2012-10-31 Vistec Semiconductor Systems Gmbh Koordinatenmess-Maschine und Verfahren zur Vermessung von Strukturen auf einem Substrat mittels einer Koordinaten-Messmaschine
US20090147237A1 (en) 2007-12-05 2009-06-11 Molecular Imprints, Inc. Spatial Phase Feature Location
JP5713961B2 (ja) * 2011-06-21 2015-05-07 キヤノン株式会社 位置検出装置、インプリント装置及び位置検出方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1977144A (zh) * 2004-04-27 2007-06-06 住友重机械工业株式会社 检测装置及台装置
TW200538704A (en) * 2004-05-21 2005-12-01 Zetetic Inst Apparatus and methods for overlay, alignment mark, and critical dimension metrologies based on optical interferometry
JP2005337953A (ja) * 2004-05-28 2005-12-08 Nikon Corp 位置検出方法および位置検出装置
TW200609483A (en) * 2004-05-28 2006-03-16 Nikon Corp Method of adjusting optical imaging system, imaging device, positional deviation detecting device, mark identifying device and edge position detecting device
US20080073604A1 (en) * 2006-09-22 2008-03-27 Canon Kabushiki Kaisha Imprint apparatus and imprint method
CN101941353A (zh) * 2009-07-10 2011-01-12 颖台科技股份有限公司 光固化复合树脂的膜片制作方法

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106415193B (zh) * 2014-03-21 2019-08-09 卡尔佩迪姆技术有限公司 用于在柔性基板上制造微型结构的系统和方法
CN106415193A (zh) * 2014-03-21 2017-02-15 卡尔佩迪姆技术有限公司 用于在柔性基板上制造微型结构的系统和方法
US10989527B2 (en) 2014-06-27 2021-04-27 Canon Kabushiki Kaisha Position detection apparatus, position detection method, imprint apparatus, and method of manufacturing article
CN108180836A (zh) * 2014-06-27 2018-06-19 佳能株式会社 位置检测装置
CN105222705B (zh) * 2014-06-27 2018-08-31 佳能株式会社 位置检测装置、位置检测方法、压印装置及物品的制造方法
CN109059765A (zh) * 2014-06-27 2018-12-21 佳能株式会社 位置检测装置
US10337856B2 (en) 2014-06-27 2019-07-02 Canon Kabushiki Kaisha Position detection apparatus, position detection method, imprint apparatus, and method of manufacturing article
CN109059765B (zh) * 2014-06-27 2021-06-11 佳能株式会社 位置检测装置
CN107924817A (zh) * 2015-08-21 2018-04-17 佳能株式会社 检测设备、压印装置、制造物品的方法、照明光学系统以及检测方法
CN107924817B (zh) * 2015-08-21 2021-09-10 佳能株式会社 检测设备、压印装置、制造物品的方法、照明光学系统以及检测方法
CN110088878A (zh) * 2016-12-16 2019-08-02 佳能株式会社 对准装置、对准方法、光刻装置和制造物品的方法
CN110088878B (zh) * 2016-12-16 2023-05-02 佳能株式会社 对准装置、对准方法、光刻装置和制造物品的方法
CN112166384A (zh) * 2018-05-24 2021-01-01 Asml荷兰有限公司 用于确定标记检测系统中的测量束的期望波长带宽的带宽计算系统和方法
CN110553583A (zh) * 2018-05-31 2019-12-10 佳能株式会社 检测设备、方法、压印装置、平坦化设备和物品制造方法
CN110553583B (zh) * 2018-05-31 2021-11-16 佳能株式会社 检测设备、方法、压印装置、平坦化设备和物品制造方法
CN113192930A (zh) * 2021-04-27 2021-07-30 上海华虹宏力半导体制造有限公司 偏移检测结构及基板偏移的检测方法
CN113192930B (zh) * 2021-04-27 2024-03-29 上海华虹宏力半导体制造有限公司 偏移检测结构及基板偏移的检测方法

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Publication number Publication date
CN104792344B (zh) 2017-06-20
JP2013102139A (ja) 2013-05-23
US8922786B2 (en) 2014-12-30
KR101597387B1 (ko) 2016-02-24
CN104792344A (zh) 2015-07-22
KR20130044149A (ko) 2013-05-02
US20130100459A1 (en) 2013-04-25
JP5706861B2 (ja) 2015-04-22

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Application publication date: 20130515