CN103081142B - 发光装置的制造方法 - Google Patents

发光装置的制造方法 Download PDF

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Publication number
CN103081142B
CN103081142B CN201180040060.0A CN201180040060A CN103081142B CN 103081142 B CN103081142 B CN 103081142B CN 201180040060 A CN201180040060 A CN 201180040060A CN 103081142 B CN103081142 B CN 103081142B
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CN
China
Prior art keywords
light
mentioned
dispersion liquid
phosphor
phosphor dispersion
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Expired - Fee Related
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CN201180040060.0A
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English (en)
Chinese (zh)
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CN103081142A (zh
Inventor
小岛健
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Konica Minolta Inc
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Konica Minolta Opto Inc
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Publication of CN103081142A publication Critical patent/CN103081142A/zh
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Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512—Wavelength conversion materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
    • H10H20/013—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials
    • H10H20/0137—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials the light-emitting regions comprising nitride materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0361—Manufacture or treatment of packages of wavelength conversion means

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
CN201180040060.0A 2010-08-17 2011-08-02 发光装置的制造方法 Expired - Fee Related CN103081142B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010182211 2010-08-17
JP2010-182211 2010-08-17
PCT/JP2011/067635 WO2012023425A1 (ja) 2010-08-17 2011-08-02 発光装置の製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN201410769338.3A Division CN104576899A (zh) 2010-08-17 2011-08-02 发光装置的制造方法

Publications (2)

Publication Number Publication Date
CN103081142A CN103081142A (zh) 2013-05-01
CN103081142B true CN103081142B (zh) 2015-01-14

Family

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Family Applications (2)

Application Number Title Priority Date Filing Date
CN201180040060.0A Expired - Fee Related CN103081142B (zh) 2010-08-17 2011-08-02 发光装置的制造方法
CN201410769338.3A Pending CN104576899A (zh) 2010-08-17 2011-08-02 发光装置的制造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201410769338.3A Pending CN104576899A (zh) 2010-08-17 2011-08-02 发光装置的制造方法

Country Status (6)

Country Link
US (3) US8835192B2 (enExample)
EP (1) EP2608284A1 (enExample)
JP (3) JP5299577B2 (enExample)
KR (1) KR101478472B1 (enExample)
CN (2) CN103081142B (enExample)
WO (2) WO2012023425A1 (enExample)

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JP5310700B2 (ja) * 2010-10-27 2013-10-09 パナソニック株式会社 Ｌｅｄパッケージ製造システムおよびｌｅｄパッケージ製造システムにおける樹脂塗布方法
JP5310699B2 (ja) * 2010-10-27 2013-10-09 パナソニック株式会社 樹脂塗布装置および樹脂塗布方法
US9260654B2 (en) * 2011-03-11 2016-02-16 Konica Minolta, Inc. Manufacturing method for light emitting device and phosphor mixture
JP5413404B2 (ja) 2011-05-30 2014-02-12 パナソニック株式会社 Ｌｅｄパッケージ製造システムおよびｌｅｄパッケージ製造システムにおける樹脂塗布方法
JP5413405B2 (ja) * 2011-05-30 2014-02-12 パナソニック株式会社 樹脂塗布装置および樹脂塗布方法
EP2752897A4 (en) * 2011-10-07 2015-04-29 Konica Minolta Inc MANUFACTURING METHOD FÜRLED DEVICE AND FLUORESCENT FABRICED DISPERSED SOLUTION USING THEREOF
WO2013121646A1 (ja) * 2012-02-16 2013-08-22 コニカミノルタ株式会社 発光装置の製造方法及び蛍光体塗布装置
JP2013258339A (ja) * 2012-06-13 2013-12-26 Konica Minolta Inc 発光装置及びその製造方法
EP2853577A4 (en) 2012-08-13 2016-01-06 Konica Minolta Inc METHOD FOR PRODUCING A PHOSPHORDISPERSION LIQUID AND METHOD FOR PRODUCING AN LED DEVICE
DE102012112316A1 (de) * 2012-12-14 2014-06-18 Osram Opto Semiconductors Gmbh Verfahren und Vorrichtung zur Herstellung eines Strahlung emittierenden Halbleiterbauelements und Strahlung emittierendes Halbleiterbauelement
JP5994628B2 (ja) * 2012-12-26 2016-09-21 日亜化学工業株式会社 発光装置の製造方法およびスプレーコーティング装置
EP2940744A4 (en) * 2012-12-27 2016-06-29 Konica Minolta Inc PHOSPHORDISPERSION, LED DEVICE AND METHOD FOR THE PRODUCTION THEREOF
WO2014199926A1 (ja) * 2013-06-13 2014-12-18 旭硝子株式会社 蛍光体分散シートの色度座標検査方法、蛍光体分散シートの製造方法、光変換部材の製造方法およびｌｅｄパッケージの製造方法
KR101474376B1 (ko) * 2013-11-28 2014-12-18 주식회사 말콤 온도표시기능을 구비하는 led패키지용 시린지 및 이를 이용하는 led패키지 제조방법
CN103840068B (zh) * 2013-12-31 2017-09-19 杨毅 波长转换装置和发光装置
TWI575778B (zh) * 2014-05-07 2017-03-21 新世紀光電股份有限公司 發光二極體封裝結構
KR102237112B1 (ko) 2014-07-30 2021-04-08 엘지이노텍 주식회사 발광 소자 및 이를 구비한 광원 모듈
KR20180011398A (ko) 2016-07-21 2018-02-01 삼성디스플레이 주식회사 표시 장치 및 이의 제조 방법
CN107611241A (zh) * 2017-10-23 2018-01-19 苏州创思得新材料有限公司 一种多相复合的Re,Ce:YAG陶瓷荧光片及其制备方法
KR102053614B1 (ko) * 2018-06-19 2019-12-09 주식회사 네모엘텍 퀀텀닷 led 조명 및 제조 장치
CN108962798B (zh) * 2018-08-03 2024-07-05 华南理工大学 三基色rgb-led全自动荧光粉胶高速智能涂覆设备及方法

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JP2001181614A (ja) * 1999-12-24 2001-07-03 Teikoku Tsushin Kogyo Co Ltd Ｅｌ素子用蛍光体ペースト及びその製造方法
JP2004153109A (ja) * 2002-10-31 2004-05-27 Matsushita Electric Works Ltd 発光装置及びその製造方法
US7390684B2 (en) * 2001-10-12 2008-06-24 Nichia Corporation Light emitting apparatus and method of manufacturing the same
JP2008227458A (ja) * 2007-03-13 2008-09-25 Samsung Electro-Mechanics Co Ltd 発光ダイオードパッケージの製造方法。
CN101296982A (zh) * 2005-10-28 2008-10-29 住友大阪水泥股份有限公司 无机氧化物透明分散液和无机氧化物粒子含有树脂组合物、发光元件密封用组合物及发光元件、硬涂膜和光学功能膜及光学部件、以及无机氧化物粒子含有树脂组合物的制备方法
JP2009256670A (ja) * 2008-03-28 2009-11-05 Mitsubishi Chemicals Corp 硬化性ポリシロキサン組成物、並びに、それを用いたポリシロキサン硬化物、光学部材、航空宇宙産業用部材、半導体発光装置、照明装置、及び画像表示装置
CN101679861A (zh) * 2007-03-28 2010-03-24 国立大学法人广岛大学 M-c-n-o系荧光体
JP2010080588A (ja) * 2008-09-25 2010-04-08 Fujikura Ltd 発光装置の製造方法および製造装置

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Publication number Priority date Publication date Assignee Title
JP2001181614A (ja) * 1999-12-24 2001-07-03 Teikoku Tsushin Kogyo Co Ltd Ｅｌ素子用蛍光体ペースト及びその製造方法
US7390684B2 (en) * 2001-10-12 2008-06-24 Nichia Corporation Light emitting apparatus and method of manufacturing the same
JP2004153109A (ja) * 2002-10-31 2004-05-27 Matsushita Electric Works Ltd 発光装置及びその製造方法
CN101296982A (zh) * 2005-10-28 2008-10-29 住友大阪水泥股份有限公司 无机氧化物透明分散液和无机氧化物粒子含有树脂组合物、发光元件密封用组合物及发光元件、硬涂膜和光学功能膜及光学部件、以及无机氧化物粒子含有树脂组合物的制备方法
JP2008227458A (ja) * 2007-03-13 2008-09-25 Samsung Electro-Mechanics Co Ltd 発光ダイオードパッケージの製造方法。
CN101679861A (zh) * 2007-03-28 2010-03-24 国立大学法人广岛大学 M-c-n-o系荧光体
JP2009256670A (ja) * 2008-03-28 2009-11-05 Mitsubishi Chemicals Corp 硬化性ポリシロキサン組成物、並びに、それを用いたポリシロキサン硬化物、光学部材、航空宇宙産業用部材、半導体発光装置、照明装置、及び画像表示装置
JP2010080588A (ja) * 2008-09-25 2010-04-08 Fujikura Ltd 発光装置の製造方法および製造装置

Also Published As

Publication number Publication date
JP5870923B2 (ja) 2016-03-01
CN103081142A (zh) 2013-05-01
JP2013229621A (ja) 2013-11-07
KR101478472B1 (ko) 2014-12-31
WO2012023424A1 (ja) 2012-02-23
JPWO2012023425A1 (ja) 2013-10-28
KR20130028148A (ko) 2013-03-18
US8835192B2 (en) 2014-09-16
US20130149801A1 (en) 2013-06-13
US9153752B2 (en) 2015-10-06
US20130143343A1 (en) 2013-06-06
WO2012023425A1 (ja) 2012-02-23
JPWO2012023424A1 (ja) 2013-10-28
US9306130B2 (en) 2016-04-05
JP5900425B2 (ja) 2016-04-06
EP2608284A1 (en) 2013-06-26
CN104576899A (zh) 2015-04-29
JP5299577B2 (ja) 2013-09-25
US20140349419A1 (en) 2014-11-27

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Address after: Tokyo, Japan

Patentee after: KONICA MINOLTA,Inc.

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Patentee before: Konica Minolta Holdings, Inc.

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Patentee after: Konica Minolta Holdings, Inc.

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Patentee before: Konica Minolta Opto, Inc.

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