CN103076467B - 测试座 - Google Patents

测试座 Download PDF

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Publication number
CN103076467B
CN103076467B CN201210563771.2A CN201210563771A CN103076467B CN 103076467 B CN103076467 B CN 103076467B CN 201210563771 A CN201210563771 A CN 201210563771A CN 103076467 B CN103076467 B CN 103076467B
Authority
CN
China
Prior art keywords
contact element
housing
test bench
load board
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201210563771.2A
Other languages
English (en)
Chinese (zh)
Other versions
CN103076467A (zh
Inventor
J·E·洛佩兹
D·B·谢尔
M·L·吉尔克
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Johnstech International Corp
Original Assignee
Johnstech International Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=37309472&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=CN103076467(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Johnstech International Corp filed Critical Johnstech International Corp
Priority claimed from CN 200610121259 external-priority patent/CN1940574A/zh
Publication of CN103076467A publication Critical patent/CN103076467A/zh
Application granted granted Critical
Publication of CN103076467B publication Critical patent/CN103076467B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26Testing of individual semiconductor devices
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/04Housings; Supporting members; Arrangements of terminals
    • G01R1/0408Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433Sockets for IC's or transistors
    • G01R1/0441Details
    • G01R1/0466Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Connecting Device With Holders (AREA)
CN201210563771.2A 2005-07-08 2006-07-10 测试座 Active CN103076467B (zh)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
US69769305P 2005-07-08 2005-07-08
US69772105P 2005-07-08 2005-07-08
US60/697,721 2005-07-08
US60/697,693 2005-07-08
US77665406P 2006-02-24 2006-02-24
US60/776,654 2006-02-24
US11/482,644 2006-07-07
US11/482,644 US7445465B2 (en) 2005-07-08 2006-07-07 Test socket
CN 200610121259 CN1940574A (zh) 2005-07-08 2006-07-10 测试座

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN 200610121259 Division CN1940574A (zh) 2005-07-08 2006-07-10 测试座

Publications (2)

Publication Number Publication Date
CN103076467A CN103076467A (zh) 2013-05-01
CN103076467B true CN103076467B (zh) 2016-01-20

Family

ID=37309472

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201210563771.2A Active CN103076467B (zh) 2005-07-08 2006-07-10 测试座

Country Status (6)

Country Link
US (2) US7445465B2 (enExample)
EP (1) EP1742072B1 (enExample)
JP (1) JP5180445B2 (enExample)
KR (1) KR101292845B1 (enExample)
CN (1) CN103076467B (enExample)
TW (1) TWI397688B (enExample)

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7639026B2 (en) * 2006-02-24 2009-12-29 Johnstech International Corporation Electronic device test set and contact used therein
JP5134803B2 (ja) * 2006-10-05 2013-01-30 株式会社日本マイクロニクス 電気的接続装置
JP5134805B2 (ja) * 2006-10-12 2013-01-30 株式会社日本マイクロニクス 電気的接続装置
JP2009043591A (ja) 2007-08-09 2009-02-26 Yamaichi Electronics Co Ltd Icソケット
US7686621B2 (en) * 2008-03-12 2010-03-30 Sigmatel, Inc. Integrated circuit test socket having elastic contact support and methods for use therewith
US8278955B2 (en) 2008-03-24 2012-10-02 Interconnect Devices, Inc. Test interconnect
US20090267629A1 (en) * 2008-04-23 2009-10-29 J. Foong Technologies Sdn. Bhd. Contact for interconnect system in a test socket
US20090289647A1 (en) 2008-05-01 2009-11-26 Interconnect Devices, Inc. Interconnect system
JP5029969B2 (ja) * 2008-11-12 2012-09-19 山一電機株式会社 電気接続装置
TW201027849A (en) 2009-01-13 2010-07-16 Yi-Zhi Yang Connector
USD668625S1 (en) * 2010-07-22 2012-10-09 Titan Semiconductor Tool, LLC Integrated circuit socket connector
KR200455379Y1 (ko) * 2011-06-13 2011-09-01 나경화 반도체 칩 테스트용 핀 및 그를 포함한 반도체 칩 테스트용 소켓
MY175570A (en) * 2012-03-20 2020-07-01 Jf Microtechnology Sdn Bhd Multiple rigid contact solution for ic testing
US9274141B1 (en) 2013-01-22 2016-03-01 Johnstech International Corporation Low resistance low wear test pin for test contactor
TWI500222B (zh) * 2013-07-12 2015-09-11 Ccp Contact Probes Co Ltd 連接器組合
US9425529B2 (en) * 2014-06-20 2016-08-23 Xcerra Corporation Integrated circuit chip tester with an anti-rotation link
KR101594993B1 (ko) * 2014-10-10 2016-02-17 정요채 반도체 패키지용 테스트 소켓
US9343830B1 (en) * 2015-06-08 2016-05-17 Xcerra Corporation Integrated circuit chip tester with embedded micro link
US9958499B1 (en) 2015-07-07 2018-05-01 Johnstech International Corporation Constant stress pin tip for testing integrated circuit chips
US10436819B1 (en) 2015-07-07 2019-10-08 Johnstech International Corporation Constant pressure pin tip for testing integrated circuit chips
TWI567846B (zh) * 2015-08-19 2017-01-21 創意電子股份有限公司 測試單元與使用其的測試裝置
US10101360B2 (en) 2016-11-02 2018-10-16 Xcerra Corporation Link socket sliding mount with preload
PH12018050194A1 (en) * 2017-05-18 2019-02-04 Jf Microtechnology Sdn Bhd Manufacturing process for kelvin contact assembly housing
JP7046527B2 (ja) * 2017-08-15 2022-04-04 株式会社日本マイクロニクス 電気的接続装置
MX2020007325A (es) * 2017-09-25 2021-01-29 Johnstech Int Corp Contactor de alto grado de aislamiento con clavija de prueba y carcasa para probar circuitos integrados.
US10985480B2 (en) 2018-04-30 2021-04-20 GITech Inc. Transformation connector
US11047878B2 (en) 2018-04-30 2021-06-29 GITech Inc. Electrical connector
US11067603B2 (en) 2018-04-30 2021-07-20 GITech Inc. Connector having contact members
USD942290S1 (en) * 2019-07-12 2022-02-01 Johnstech International Corporation Tip for integrated circuit test pin
CN110320390B (zh) * 2019-08-08 2021-12-10 深圳市研测科技有限公司 一种引脚保护型二极管测试用夹持工装
US11289836B2 (en) * 2020-07-23 2022-03-29 International Business Machines Corporation Land grid array electrical contact coating
EP4222509A4 (en) * 2020-10-02 2024-09-11 JohnsTech International Corporation HOUSING WITH ANTI-SMUDGE CAPABILITY
US11906576B1 (en) 2021-05-04 2024-02-20 Johnstech International Corporation Contact assembly array and testing system having contact assembly array
US11867752B1 (en) 2021-05-13 2024-01-09 Johnstech International Corporation Contact assembly and kelvin testing system having contact assembly
KR20240104127A (ko) * 2021-11-03 2024-07-04 존스테크 인터내셔널 코포레이션 수직 백스톱을 갖는 하우징
USD1042345S1 (en) 2022-04-05 2024-09-17 Johnstech International Corporation Test pin
USD1075695S1 (en) 2022-04-05 2025-05-20 Johnstech International Corporation Contact pin for integrated circuit testing
USD1042346S1 (en) 2022-04-05 2024-09-17 Johnstech International Corporation Contact pin for integrated circuit testing
KR102784779B1 (ko) * 2024-10-02 2025-03-19 서기복 반도체 소자 검사 장치

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5069629A (en) * 1991-01-09 1991-12-03 Johnson David A Electrical interconnect contact system
US5207584A (en) * 1991-01-09 1993-05-04 Johnson David A Electrical interconnect contact system
US5437556A (en) * 1993-04-09 1995-08-01 Framatome Connectors International Intermediate connector for use between a printed circuit card and a substrate for electronic circuits
US5609489A (en) * 1994-12-21 1997-03-11 Hewlett-Packard Company Socket for contacting an electronic circuit during testing
US5634801A (en) * 1991-01-09 1997-06-03 Johnstech International Corporation Electrical interconnect contact system
CN1458714A (zh) * 2001-08-31 2003-11-26 约翰国际有限公司 用于改进刮擦作用的电接触件

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4980245A (en) * 1989-09-08 1990-12-25 Precision Concepts, Inc. Multi-element metallic composite article
US5189363A (en) * 1990-09-14 1993-02-23 Ibm Corporation Integrated circuit testing system having a cantilevered contact lead probe pattern mounted on a flexible tape for interconnecting an integrated circuit to a tester
US5594355A (en) * 1994-07-19 1997-01-14 Delta Design, Inc. Electrical contactor apparatus for testing integrated circuit devices
US5938451A (en) * 1997-05-06 1999-08-17 Gryphics, Inc. Electrical connector with multiple modes of compliance
MY128129A (en) * 1997-09-16 2007-01-31 Tan Yin Leong Electrical contactor for testing integrated circuit devices
JP3577416B2 (ja) * 1997-11-25 2004-10-13 株式会社日本マイクロニクス 電気的接続装置
JP2000156268A (ja) * 1998-11-18 2000-06-06 Kasasaku Electronics:Kk Icソケット及びicソケット用コンタクトピン
US6794890B1 (en) 1999-07-27 2004-09-21 Mitsubishi Denki Kabushiki Kaisha Test socket, method of manufacturing the test socket, test method using the test socket, and member to be tested
JP2002093541A (ja) 2000-09-19 2002-03-29 Miyazaki Oki Electric Co Ltd Icソケット
KR100351676B1 (ko) * 2000-10-12 2002-09-05 주식회사 우영 콘택핀 및 이것을 구비한 집적회로 패키지 테스트용 소켓
US20040067665A1 (en) * 2001-05-31 2004-04-08 Tomohiro Nakano Socket connector and contact for use in a socket connector
US6854981B2 (en) * 2002-06-03 2005-02-15 Johnstech International Corporation Small pin connecters
US7059866B2 (en) * 2003-04-23 2006-06-13 Johnstech International Corporation integrated circuit contact to test apparatus
SG129245A1 (en) * 2003-04-29 2007-02-26 Tan Yin Leong Improved probe for integrated circuit test socket
WO2006114895A1 (ja) * 2005-04-21 2006-11-02 Kabushiki Kaisha Nihon Micronics 電気的接続装置
JP2009043591A (ja) * 2007-08-09 2009-02-26 Yamaichi Electronics Co Ltd Icソケット

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5069629A (en) * 1991-01-09 1991-12-03 Johnson David A Electrical interconnect contact system
US5207584A (en) * 1991-01-09 1993-05-04 Johnson David A Electrical interconnect contact system
US5634801A (en) * 1991-01-09 1997-06-03 Johnstech International Corporation Electrical interconnect contact system
US5437556A (en) * 1993-04-09 1995-08-01 Framatome Connectors International Intermediate connector for use between a printed circuit card and a substrate for electronic circuits
US5609489A (en) * 1994-12-21 1997-03-11 Hewlett-Packard Company Socket for contacting an electronic circuit during testing
CN1458714A (zh) * 2001-08-31 2003-11-26 约翰国际有限公司 用于改进刮擦作用的电接触件

Also Published As

Publication number Publication date
US20070032128A1 (en) 2007-02-08
TWI397688B (zh) 2013-06-01
US20090053912A1 (en) 2009-02-26
US7722361B2 (en) 2010-05-25
US7445465B2 (en) 2008-11-04
CN103076467A (zh) 2013-05-01
KR20070006627A (ko) 2007-01-11
EP1742072A3 (en) 2009-05-20
EP1742072A2 (en) 2007-01-10
EP1742072B1 (en) 2012-05-30
JP2007017444A (ja) 2007-01-25
JP5180445B2 (ja) 2013-04-10
KR101292845B1 (ko) 2013-08-02
TW200710396A (en) 2007-03-16

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