JP5180445B2 - テストソケット - Google Patents
テストソケット Download PDFInfo
- Publication number
- JP5180445B2 JP5180445B2 JP2006189459A JP2006189459A JP5180445B2 JP 5180445 B2 JP5180445 B2 JP 5180445B2 JP 2006189459 A JP2006189459 A JP 2006189459A JP 2006189459 A JP2006189459 A JP 2006189459A JP 5180445 B2 JP5180445 B2 JP 5180445B2
- Authority
- JP
- Japan
- Prior art keywords
- contact
- housing
- slot
- test socket
- rear end
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000012360 testing method Methods 0.000 title claims description 57
- 229920001971 elastomer Polymers 0.000 claims description 16
- 239000000806 elastomer Substances 0.000 claims description 16
- 230000001154 acute effect Effects 0.000 claims description 3
- 230000033001 locomotion Effects 0.000 description 8
- 230000006870 function Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000005096 rolling process Methods 0.000 description 4
- 229910001020 Au alloy Inorganic materials 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000003353 gold alloy Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910000510 noble metal Inorganic materials 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 230000003466 anti-cipated effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000003339 best practice Methods 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000036316 preload Effects 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Connecting Device With Holders (AREA)
Description
本発明は貴金属製接点として用いることができる。このような接点はロードボード寿命を延ばす。NeyoroG(登録商標)製の接点は、めっきのない固体金合金製接点である。このような材料により接点の寿命が延びることが見出された一方、同様にロードボードの寿命も延びる。接点に対してNeyoroG(登録商標)製材料を用いることで、ロードボードの寿命が、従来技術により公知のメカニズムでのロードボードの寿命より少なくとも2倍にできることがわかった。
また、テスト対象装置18による力の作用点は、接点24の後端30とロードボード12上のトレース14との係合点から比較的大きな距離で離間している点が指摘される。これにより、転がり運動により達成される利点(すなわち、ロードボードへの損傷等の最小化)が大きくなる。
Claims (6)
- テスタロードボード面に係合する第1面、同第1面に対して離間して平行に延びるとともに同第1面と反対を向く第2面、及びハウジング内に形成されるとともに前記第1面と第2面との間においてハウジング内を延びる少なくとも1つのスロットを有するハウジングと、
対応するスロットで受け入れられ、テスト対象装置の対応リードまたはパッドに係合するように前記第2面を越えて延びる前端を有するとともに、テスタロードボード面上の対応トレースに係合する第1の弓状面を形成する後端を備えた接点と、
前記対応するスロット内に前記接点を弾性的に保持するための手段と、を備え、
前記接点の後端が、前記第1の弓状面から角度をなして離間する第2の弓状面を形成し、
前記ハウジングが、スロット内において、前記接点の後端の第2の弓状面と係合するとともに前記第1面に対して鋭角をなして同第1面から離間する壁を形成し、
前記接点の前端がテスト対象装置のリードまたはパッドに係合して対応するスロットに押し込まれる際に、前記接点の第2の弓状面が前記壁に沿って動くことにより、並進摺動及び回転摺動のいずれも発生することなく前記対応トレース上を前記第1の弓状面が転がるテストソケット。 - 請求項1によるテストソケットであって、前記接点を弾性的に設けるための手段が、接点によりあらかじめ圧縮され、さらに、前記接点の前記前端がテスト対象装置のリードまたはパッドに係合してスロット内に押し込まれると、接点によりさらに圧縮される前エラストマを備えるテストソケット。
- 請求項2によるテストソケットであって、前記接点を弾性的に設けるための手段がさらに、テスタロードボード面上の対応トレースに対して接点の後端に予圧をかける後エラストマを備えるところのテストソケット。
- 請求項3によるテストソケットであって、さらに、接点に係合し、前記ハウジングの前記第2面を越えて延びる接点の距離を制限するため、前記ハウジングに形成される肩部を備えるテストソケット。
- 互いに反対を向く第1面及び第2面と、これらの面の間に延びる複数のスロットとを備えたハウジングであって、
各対応スロットで受け入れられ、テスト対象装置のリードまたはパッドにより係合される前記第2面を超えて延びる前端と、さらにロードボード面上の対応トレースに係合する第1の弓状面を形成する後端とを含む複数の接点を備え、
前記接点の後端が、前記第1の弓状面から角度をなして離間する第2の弓状面を形成し、
前記ハウジングが、スロット内において、前記接点の後端の第2の弓状面と係合するとともに前記第1面に対して鋭角をなして同第1面から離間する壁を形成し、
テスト対象でありスロット内に押し込まれる装置のリードまたはパッドとの係合に応じて接点が動くと、前記接点の第2の弓状面が前記壁に沿って動くことにより、接点の後端にある第1の弓状面が並進摺動及び回転摺動のいずれも発生することなく対応トレース上を転がるテストソケット。 - 請求項5によるテストソケットであって、前記接点がNeyoroG(登録商標)を用いて製造されたものであるところのテストソケット。
Applications Claiming Priority (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US69769305P | 2005-07-08 | 2005-07-08 | |
US69772105P | 2005-07-08 | 2005-07-08 | |
US60/697,693 | 2005-07-08 | ||
US60/697,721 | 2005-07-08 | ||
US77665406P | 2006-02-24 | 2006-02-24 | |
US60/776,654 | 2006-02-24 | ||
US11/482,644 | 2006-07-07 | ||
US11/482,644 US7445465B2 (en) | 2005-07-08 | 2006-07-07 | Test socket |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2007017444A JP2007017444A (ja) | 2007-01-25 |
JP2007017444A5 JP2007017444A5 (ja) | 2012-03-01 |
JP5180445B2 true JP5180445B2 (ja) | 2013-04-10 |
Family
ID=37309472
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006189459A Active JP5180445B2 (ja) | 2005-07-08 | 2006-07-10 | テストソケット |
Country Status (6)
Country | Link |
---|---|
US (2) | US7445465B2 (ja) |
EP (1) | EP1742072B1 (ja) |
JP (1) | JP5180445B2 (ja) |
KR (1) | KR101292845B1 (ja) |
CN (1) | CN103076467B (ja) |
TW (1) | TWI397688B (ja) |
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US7639026B2 (en) * | 2006-02-24 | 2009-12-29 | Johnstech International Corporation | Electronic device test set and contact used therein |
JP5134803B2 (ja) * | 2006-10-05 | 2013-01-30 | 株式会社日本マイクロニクス | 電気的接続装置 |
JP5134805B2 (ja) * | 2006-10-12 | 2013-01-30 | 株式会社日本マイクロニクス | 電気的接続装置 |
JP2009043591A (ja) | 2007-08-09 | 2009-02-26 | Yamaichi Electronics Co Ltd | Icソケット |
US7686621B2 (en) * | 2008-03-12 | 2010-03-30 | Sigmatel, Inc. | Integrated circuit test socket having elastic contact support and methods for use therewith |
US8278955B2 (en) | 2008-03-24 | 2012-10-02 | Interconnect Devices, Inc. | Test interconnect |
US20090267629A1 (en) * | 2008-04-23 | 2009-10-29 | J. Foong Technologies Sdn. Bhd. | Contact for interconnect system in a test socket |
US20090289647A1 (en) | 2008-05-01 | 2009-11-26 | Interconnect Devices, Inc. | Interconnect system |
JP5029969B2 (ja) * | 2008-11-12 | 2012-09-19 | 山一電機株式会社 | 電気接続装置 |
TW201027849A (en) | 2009-01-13 | 2010-07-16 | Yi-Zhi Yang | Connector |
USD668625S1 (en) * | 2010-07-22 | 2012-10-09 | Titan Semiconductor Tool, LLC | Integrated circuit socket connector |
KR200455379Y1 (ko) * | 2011-06-13 | 2011-09-01 | 나경화 | 반도체 칩 테스트용 핀 및 그를 포함한 반도체 칩 테스트용 소켓 |
MY175570A (en) * | 2012-03-20 | 2020-07-01 | Jf Microtechnology Sdn Bhd | Multiple rigid contact solution for ic testing |
US9274141B1 (en) * | 2013-01-22 | 2016-03-01 | Johnstech International Corporation | Low resistance low wear test pin for test contactor |
TWI500222B (zh) * | 2013-07-12 | 2015-09-11 | Ccp Contact Probes Co Ltd | 連接器組合 |
US9425529B2 (en) * | 2014-06-20 | 2016-08-23 | Xcerra Corporation | Integrated circuit chip tester with an anti-rotation link |
KR101594993B1 (ko) * | 2014-10-10 | 2016-02-17 | 정요채 | 반도체 패키지용 테스트 소켓 |
US9343830B1 (en) * | 2015-06-08 | 2016-05-17 | Xcerra Corporation | Integrated circuit chip tester with embedded micro link |
US10436819B1 (en) | 2015-07-07 | 2019-10-08 | Johnstech International Corporation | Constant pressure pin tip for testing integrated circuit chips |
US9958499B1 (en) | 2015-07-07 | 2018-05-01 | Johnstech International Corporation | Constant stress pin tip for testing integrated circuit chips |
TWI567846B (zh) * | 2015-08-19 | 2017-01-21 | 創意電子股份有限公司 | 測試單元與使用其的測試裝置 |
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PH12018050194A1 (en) * | 2017-05-18 | 2019-02-04 | Jf Microtechnology Sdn Bhd | Manufacturing process for kelvin contact assembly housing |
JP7046527B2 (ja) * | 2017-08-15 | 2022-04-04 | 株式会社日本マイクロニクス | 電気的接続装置 |
TWI805621B (zh) * | 2017-09-25 | 2023-06-21 | 美商瓊斯科技國際公司 | 用於積體電路測試之具有測試接腳及殼體的高隔離接觸器 |
US11067603B2 (en) | 2018-04-30 | 2021-07-20 | GITech Inc. | Connector having contact members |
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CN110320390B (zh) * | 2019-08-08 | 2021-12-10 | 深圳市研测科技有限公司 | 一种引脚保护型二极管测试用夹持工装 |
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JP4472002B2 (ja) * | 2005-04-21 | 2010-06-02 | 株式会社日本マイクロニクス | 電気的接続装置 |
JP2009043591A (ja) * | 2007-08-09 | 2009-02-26 | Yamaichi Electronics Co Ltd | Icソケット |
-
2006
- 2006-07-07 US US11/482,644 patent/US7445465B2/en active Active
- 2006-07-10 JP JP2006189459A patent/JP5180445B2/ja active Active
- 2006-07-10 KR KR1020060064647A patent/KR101292845B1/ko active IP Right Grant
- 2006-07-10 CN CN201210563771.2A patent/CN103076467B/zh active Active
- 2006-07-10 TW TW095125115A patent/TWI397688B/zh active
- 2006-07-10 EP EP06014291A patent/EP1742072B1/en not_active Not-in-force
-
2008
- 2008-11-03 US US12/264,008 patent/US7722361B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
CN103076467A (zh) | 2013-05-01 |
EP1742072A2 (en) | 2007-01-10 |
TW200710396A (en) | 2007-03-16 |
TWI397688B (zh) | 2013-06-01 |
US20090053912A1 (en) | 2009-02-26 |
KR20070006627A (ko) | 2007-01-11 |
CN103076467B (zh) | 2016-01-20 |
EP1742072A3 (en) | 2009-05-20 |
KR101292845B1 (ko) | 2013-08-02 |
US7445465B2 (en) | 2008-11-04 |
EP1742072B1 (en) | 2012-05-30 |
US7722361B2 (en) | 2010-05-25 |
US20070032128A1 (en) | 2007-02-08 |
JP2007017444A (ja) | 2007-01-25 |
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R250 | Receipt of annual fees |
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R250 | Receipt of annual fees |
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R250 | Receipt of annual fees |
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