JP4472002B2 - 電気的接続装置 - Google Patents
電気的接続装置 Download PDFInfo
- Publication number
- JP4472002B2 JP4472002B2 JP2007514428A JP2007514428A JP4472002B2 JP 4472002 B2 JP4472002 B2 JP 4472002B2 JP 2007514428 A JP2007514428 A JP 2007514428A JP 2007514428 A JP2007514428 A JP 2007514428A JP 4472002 B2 JP4472002 B2 JP 4472002B2
- Authority
- JP
- Japan
- Prior art keywords
- contact
- recess
- electrical connection
- elastic body
- frame member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2435—Contacts for co-operating by abutting resilient; resiliently-mounted with opposite contact points, e.g. C beam
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/82—Coupling devices connected with low or zero insertion force
- H01R12/85—Coupling devices connected with low or zero insertion force contact pressure producing means, contacts activated after insertion of printed circuits or like structures
- H01R12/88—Coupling devices connected with low or zero insertion force contact pressure producing means, contacts activated after insertion of printed circuits or like structures acting manually by rotating or pivoting connector housing parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2201/00—Connectors or connections adapted for particular applications
- H01R2201/20—Connectors or connections adapted for particular applications for testing or measuring purposes
Landscapes
- Measuring Leads Or Probes (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Connecting Device With Holders (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Description
12 フレーム部材
14 接触子
16 弾性部材
20 キャップ部材
22 凹所
26 スロット
28 (段部)端縁
30 浅溝
32 嵌合凹部
36 半導体装置
38 配線基板
38a 配線部
Claims (8)
- 複数の電極が設けられた被検査体を受け入れる凹所を有するフレーム部材と、前記電極に対応して設けられる複数の接触子と、前記フレーム部材の前記凹所の底部に形成され、前記各接触子の先端を対応する前記電極に当接可能に前記接触子を受け入れるべく、相互に並列的に配列された複数のスロットと、前記凹所内の前記底部上で前記スロットを横切って配置され前記接触子を弾性的に保持する弾性部材と、前記フレーム部材上に装着され、前記フレーム部材との間で前記弾性体を挟持するキャップ部材とを含み、対応する前記接触子に結合される前記弾性部材は、その両端が前記凹所の底部に形成された浅溝上に乗ることに加えて、該両端間が前記底部の前記スロット間に位置する梁部分上に乗る、電気的接続装置。
- さらに、前記フレーム部材の下面に固定される配線基板であって前記接触子の先端が前記電極により押下されたとき前記接触子により押圧される配線部が形成された配線基板を含む、請求項1に記載の電気的接続装置。
- 前記各接触子の後端には、前記スロットの対応する端縁に係止可能の脱落防止部が形成されている、請求項1または2に記載の電気的接続装置。
- 前記各接触子は、前記弾性体の圧入を許す嵌合凹部を有し、該嵌合凹部への前記弾性体の圧入により該弾性体と前記各接触子とが弾性的に結合されている、請求項1または2に記載の電気的接続装置。
- 前記接触子は、前記被検査体の前記電極から押圧力を受けないとき、前記弾性体の弾性力により、前記先端を前記スロットから前記凹所内に突出させて保持されている、請求項4に記載の電気的接続装置。
- 前記接触子の前記配線部に当接する当接部分は曲面である、請求項5に記載の電気的接続装置。
- 前記凹所は矩形平面形状を有する凹所であり、前記キャップ部材は前記凹所に嵌合する矩形の平面形状を有する環状部材であり、該環状部材の前記弾性部材が当接する面には、前記電極からの押圧力による前記弾性体の剪断変形を伴う前記接触子の前記当接部分の前記配線部上での過度の移動を抑制すべく、前記弾性体の剪断変形を抑制するための段部が形成されている、請求項5に記載の電気的接続装置。
- 前記キャップ部材の上方内縁部には、前記被検査体の前記電極と該電極に対応する前記接触子の前記先端とが対応する検査位置へ前記被検査体を案内するためのガイド面が形成されている、請求項6に記載の電気的接続装置。
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2005/008097 WO2006114895A1 (ja) | 2005-04-21 | 2005-04-21 | 電気的接続装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2006114895A1 JPWO2006114895A1 (ja) | 2008-12-11 |
| JP4472002B2 true JP4472002B2 (ja) | 2010-06-02 |
Family
ID=37214532
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007514428A Expired - Lifetime JP4472002B2 (ja) | 2005-04-21 | 2005-04-21 | 電気的接続装置 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US7625219B2 (ja) |
| JP (1) | JP4472002B2 (ja) |
| TW (1) | TWI276266B (ja) |
| WO (1) | WO2006114895A1 (ja) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9695390B2 (en) | 2010-08-23 | 2017-07-04 | President And Fellows Of Harvard College | Acoustic waves in microfluidics |
| US10258987B2 (en) | 2014-06-26 | 2019-04-16 | President And Fellows Of Harvard College | Fluid infection using acoustic waves |
| US11559806B2 (en) | 2015-08-27 | 2023-01-24 | President And Fellows Of Harvard College | Acoustic wave sorting |
| US11701658B2 (en) | 2019-08-09 | 2023-07-18 | President And Fellows Of Harvard College | Systems and methods for microfluidic particle selection, encapsulation, and injection using surface acoustic waves |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7445465B2 (en) * | 2005-07-08 | 2008-11-04 | Johnstech International Corporation | Test socket |
| JP5113481B2 (ja) * | 2007-10-23 | 2013-01-09 | 株式会社日本マイクロニクス | 接触子及びこれを用いる電気的接続装置 |
| US8278955B2 (en) * | 2008-03-24 | 2012-10-02 | Interconnect Devices, Inc. | Test interconnect |
| US20090289647A1 (en) | 2008-05-01 | 2009-11-26 | Interconnect Devices, Inc. | Interconnect system |
| TWM360464U (en) * | 2008-11-10 | 2009-07-01 | Hon Hai Prec Ind Co Ltd | Electrical connector |
| TWM425277U (en) * | 2011-05-27 | 2012-03-21 | Tek Crown Technology Co Ltd | Testing connector for fast detaching and assembling electrical connection module |
| US9797926B2 (en) | 2012-11-07 | 2017-10-24 | Omron Corporation | Contact and electrical connection testing apparatus using the same |
| US10794933B1 (en) | 2013-03-15 | 2020-10-06 | Johnstech International Corporation | Integrated circuit contact test apparatus with and method of construction |
| US9425529B2 (en) * | 2014-06-20 | 2016-08-23 | Xcerra Corporation | Integrated circuit chip tester with an anti-rotation link |
| MY175337A (en) * | 2014-09-17 | 2020-06-19 | Jf Microtechnology Sdn Bhd | Short contact in a testing apparatus for wireless integrated circuits |
| TWI805621B (zh) * | 2017-09-25 | 2023-06-21 | 美商瓊斯科技國際公司 | 用於積體電路測試之具有測試接腳及殼體的高隔離接觸器 |
| CN112986790A (zh) * | 2019-12-13 | 2021-06-18 | 杰冯科技有限公司 | Ic测试装置中的具有双固定式弹性体的电触点 |
| US12210036B2 (en) * | 2020-04-07 | 2025-01-28 | Smiths Interconnect Americas, Inc. | Test socket for semiconductor integrated circuits |
| US11802909B2 (en) | 2020-10-06 | 2023-10-31 | Johnstech International Corporation | Compliant ground block and testing system having compliant ground block |
| CN116547544A (zh) * | 2020-10-06 | 2023-08-04 | 琼斯科技国际公司 | 柔性接地块以及具有柔性接地块的测试系统 |
| CN112462206B (zh) * | 2020-11-05 | 2025-01-24 | 国网河南省电力公司济源供电公司 | 安全工器具绝缘棒测试工具 |
| US12355167B2 (en) * | 2022-07-28 | 2025-07-08 | Micron Technology, Inc. | Connection designs for memory systems |
| TWI835274B (zh) * | 2022-08-31 | 2024-03-11 | 穎崴科技股份有限公司 | 導電片以及具有該導電片之檢測裝置 |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2495846A1 (fr) * | 1980-12-05 | 1982-06-11 | Cii Honeywell Bull | Dispositif de connexion electrique a haute densite de contacts |
| US4395084A (en) * | 1981-07-06 | 1983-07-26 | Teledyne Industries, Inc. | Electrical socket for leadless integrated circuit packages |
| US4437718A (en) * | 1981-12-17 | 1984-03-20 | Motorola Inc. | Non-hermetically sealed stackable chip carrier package |
| US4593961A (en) * | 1984-12-20 | 1986-06-10 | Amp Incorporated | Electrical compression connector |
| US5074798A (en) * | 1989-10-24 | 1991-12-24 | Wells Electronics, Inc. | Modular socket for an integrated circuit |
| US4993955A (en) * | 1990-03-08 | 1991-02-19 | Minnesota Mining And Manufacturing Company | Top-load socket for integrated circuit device |
| US5207584A (en) * | 1991-01-09 | 1993-05-04 | Johnson David A | Electrical interconnect contact system |
| US5236367A (en) * | 1992-02-28 | 1993-08-17 | Foxconn International, Inc. | Electrical socket connector with manual retainer and enhanced contact coupling |
| US5328383A (en) * | 1992-12-16 | 1994-07-12 | Minnesota Mining And Manufacturing Company | Top-loaded socket for integrated circuit device |
| US5273442A (en) * | 1992-12-24 | 1993-12-28 | The Whitaker Corporation | Modular chip carrier socket |
| US5594355A (en) * | 1994-07-19 | 1997-01-14 | Delta Design, Inc. | Electrical contactor apparatus for testing integrated circuit devices |
| US5947749A (en) | 1996-07-02 | 1999-09-07 | Johnstech International Corporation | Electrical interconnect contact system |
| US5888075A (en) * | 1997-02-10 | 1999-03-30 | Kabushiki Kaisha Nihon Micronics | Auxiliary apparatus for testing device |
| JP3379897B2 (ja) * | 1997-02-10 | 2003-02-24 | 株式会社日本マイクロニクス | 被検査体試験用補助装置 |
| JP3664658B2 (ja) | 2001-03-02 | 2005-06-29 | 山一電機株式会社 | Icソケットのコンタクトピンの交換方法およびicソケット |
| JP2003123874A (ja) | 2001-10-16 | 2003-04-25 | Micronics Japan Co Ltd | 接触子及びその製造方法並びに電気的接続装置 |
| JP2003297506A (ja) | 2002-04-05 | 2003-10-17 | Sanyu Kogyo Kk | 検査用電気的接続装置 |
| US7059866B2 (en) * | 2003-04-23 | 2006-06-13 | Johnstech International Corporation | integrated circuit contact to test apparatus |
| JP4388932B2 (ja) * | 2004-01-13 | 2009-12-24 | 株式会社日本マイクロニクス | 電気的接続装置 |
| JP4395165B2 (ja) * | 2004-06-03 | 2010-01-06 | 株式会社日本マイクロニクス | 接触子及び電気的接続装置 |
-
2005
- 2005-04-21 JP JP2007514428A patent/JP4472002B2/ja not_active Expired - Lifetime
- 2005-04-21 WO PCT/JP2005/008097 patent/WO2006114895A1/ja not_active Ceased
- 2005-04-21 US US11/817,492 patent/US7625219B2/en not_active Expired - Lifetime
- 2005-09-22 TW TW094132775A patent/TWI276266B/zh not_active IP Right Cessation
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9695390B2 (en) | 2010-08-23 | 2017-07-04 | President And Fellows Of Harvard College | Acoustic waves in microfluidics |
| US10570361B2 (en) | 2010-08-23 | 2020-02-25 | President And Fellows Of Harvard College | Acoustic waves in microfluidics |
| US11229911B2 (en) | 2010-08-23 | 2022-01-25 | President And Fellows Of Harvard College | Acoustic waves in microfluidics |
| US10258987B2 (en) | 2014-06-26 | 2019-04-16 | President And Fellows Of Harvard College | Fluid infection using acoustic waves |
| US11559806B2 (en) | 2015-08-27 | 2023-01-24 | President And Fellows Of Harvard College | Acoustic wave sorting |
| US11701658B2 (en) | 2019-08-09 | 2023-07-18 | President And Fellows Of Harvard College | Systems and methods for microfluidic particle selection, encapsulation, and injection using surface acoustic waves |
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2006114895A1 (ja) | 2008-12-11 |
| US7625219B2 (en) | 2009-12-01 |
| WO2006114895A1 (ja) | 2006-11-02 |
| TW200638641A (en) | 2006-11-01 |
| TWI276266B (en) | 2007-03-11 |
| US20090035960A1 (en) | 2009-02-05 |
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