CN103035541B - 半导体元件的安装方法 - Google Patents

半导体元件的安装方法 Download PDF

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Publication number
CN103035541B
CN103035541B CN201210364433.6A CN201210364433A CN103035541B CN 103035541 B CN103035541 B CN 103035541B CN 201210364433 A CN201210364433 A CN 201210364433A CN 103035541 B CN103035541 B CN 103035541B
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China
Prior art keywords
semiconductor element
installation method
projection
substrate
semiconductor
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CN201210364433.6A
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English (en)
Chinese (zh)
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CN103035541A (zh
Inventor
樱井大辅
后川和也
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
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Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of CN103035541A publication Critical patent/CN103035541A/zh
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
CN201210364433.6A 2011-10-03 2012-09-26 半导体元件的安装方法 Active CN103035541B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011-218825 2011-10-03
JP2011218825A JP5870261B2 (ja) 2011-10-03 2011-10-03 半導体素子の実装方法

Publications (2)

Publication Number Publication Date
CN103035541A CN103035541A (zh) 2013-04-10
CN103035541B true CN103035541B (zh) 2015-09-09

Family

ID=48022319

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201210364433.6A Active CN103035541B (zh) 2011-10-03 2012-09-26 半导体元件的安装方法

Country Status (4)

Country Link
JP (1) JP5870261B2 (ko)
KR (1) KR101934595B1 (ko)
CN (1) CN103035541B (ko)
TW (1) TWI502660B (ko)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6102452B2 (ja) * 2013-04-17 2017-03-29 富士電機株式会社 半導体装置の製造方法及びハンダ付け用錘
JP6140531B2 (ja) * 2013-05-30 2017-05-31 三星電子株式会社Ｓａｍｓｕｎｇ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． 半導体チップ接合装置および半導体チップ接合方法
KR101565535B1 (ko) * 2013-12-06 2015-11-06 피에스케이 주식회사 기판 처리 장치 및 기판 처리 방법
JP6212011B2 (ja) * 2014-09-17 2017-10-11 東芝メモリ株式会社 半導体製造装置
US9818736B1 (en) * 2017-03-03 2017-11-14 Tdk Corporation Method for producing semiconductor package
US10163847B2 (en) * 2017-03-03 2018-12-25 Tdk Corporation Method for producing semiconductor package
CN109534842B (zh) * 2018-11-26 2021-08-10 北京卫星制造厂有限公司 功率半导体模块用焊接工艺
CN115339220A (zh) * 2021-05-12 2022-11-15 国巨电子（中国）有限公司 温控式张网机及其张网方法
WO2024039512A1 (en) * 2022-08-16 2024-02-22 Kulicke And Soffa Industries, Inc. Bonding systems for bonding a semiconductor element to a substrate, and related methods

Citations (3)

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Publication number Priority date Publication date Assignee Title
CN2908003Y (zh) * 2006-04-11 2007-06-06 陈丽鸿 应用于将电子元件压着接合的设备
CN101640167A (zh) * 2008-07-30 2010-02-03 富士通株式会社 加压加热设备及方法
CN101689516A (zh) * 2007-06-28 2010-03-31 松下电器产业株式会社 半导体元件的安装构造体及其制造方法、半导体元件的安装方法及加压工具

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JPH03246953A (ja) * 1990-02-26 1991-11-05 Toshiba Corp フェイスダウンボンディング装置
JP3275396B2 (ja) * 1992-10-12 2002-04-15 カシオ計算機株式会社 Ｉｃチップのボンディング方法およびボンディングヘッド
JPH06349892A (ja) * 1993-06-10 1994-12-22 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
JPH11195870A (ja) * 1998-01-06 1999-07-21 Hitachi Ltd 集積回路アセンブリの製造方法および接合装置
JPH11260859A (ja) * 1998-03-10 1999-09-24 Fujitsu Ltd 半導体素子の実装方法
JP2002507845A (ja) * 1998-03-23 2002-03-12 スフィアテック エルエルシー 基板上にソルダ・ボールを形成する方法および装置
JP2002324821A (ja) * 2001-04-25 2002-11-08 Matsushita Electric Ind Co Ltd 電子部品の圧着装置及び圧着方法
JP2003203952A (ja) * 2001-12-28 2003-07-18 Toshiba Corp 積層モジュールの製造方法および積層モジュールの製造装置
JP2004235411A (ja) * 2003-01-30 2004-08-19 Towa Corp 電子部品のボンディング方法及び装置
JP4379102B2 (ja) * 2003-12-12 2009-12-09 セイコーエプソン株式会社 半導体装置の製造方法
JP2006041559A (ja) * 2005-10-17 2006-02-09 Seiko Epson Corp 半導体装置及び電子機器
JP2011009357A (ja) * 2009-06-24 2011-01-13 Fujitsu Ltd 実装装置
JP2011061073A (ja) * 2009-09-11 2011-03-24 Toshiba Corp 半導体装置の製造方法及び半導体製造装置
JP4901933B2 (ja) * 2009-09-29 2012-03-21 株式会社東芝 半導体装置の製造方法
WO2011048774A1 (ja) * 2009-10-19 2011-04-28 住友ベークライト株式会社 電子装置の製造方法、電子装置および電子装置の製造装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2908003Y (zh) * 2006-04-11 2007-06-06 陈丽鸿 应用于将电子元件压着接合的设备
CN101689516A (zh) * 2007-06-28 2010-03-31 松下电器产业株式会社 半导体元件的安装构造体及其制造方法、半导体元件的安装方法及加压工具
CN101640167A (zh) * 2008-07-30 2010-02-03 富士通株式会社 加压加热设备及方法

Also Published As

Publication number Publication date
KR20130036148A (ko) 2013-04-11
TWI502660B (zh) 2015-10-01
JP2013080759A (ja) 2013-05-02
TW201316422A (zh) 2013-04-16
KR101934595B1 (ko) 2019-01-02
CN103035541A (zh) 2013-04-10
JP5870261B2 (ja) 2016-02-24

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