JP6102452B2 - 半導体装置の製造方法及びハンダ付け用錘 - Google Patents
半導体装置の製造方法及びハンダ付け用錘 Download PDFInfo
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- JP6102452B2 JP6102452B2 JP2013086433A JP2013086433A JP6102452B2 JP 6102452 B2 JP6102452 B2 JP 6102452B2 JP 2013086433 A JP2013086433 A JP 2013086433A JP 2013086433 A JP2013086433 A JP 2013086433A JP 6102452 B2 JP6102452 B2 JP 6102452B2
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- 238000004519 manufacturing process Methods 0.000 title claims description 17
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- 229910000679 solder Inorganic materials 0.000 claims description 57
- 238000000034 method Methods 0.000 claims description 27
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- 238000002844 melting Methods 0.000 claims description 11
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- 230000000052 comparative effect Effects 0.000 description 5
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- 230000002411 adverse Effects 0.000 description 1
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Description
例えば、基材と回路基板とをハンダ付けする際には、基材と回路基板との熱膨張率が異なるため、ハンダ凝固後に基材は上に凸方向に反りが生じる。
実施の形態を通して共通の構成には同一の符号を付すものとし、重複する説明は省略する。
図1は本発明の実施形態におけるハンダ付け用錘の平面図・正面図および下面図である。
足12は直方体の錘本体11のハンダ付け物品と対向する面の縁部にのみ配置されている。これによりハンダ付け物品上面の構造物、例えばボンディングワイヤの上部配線との干渉を防ぐことができるため、それらの有無にかかわらず、安定したハンダ付けを実現することができる。また図に示すように足12はハンダ付け物品と当接する面において非対称に配置されるため、錘の重心15は錘10の中心からずれるように構成されている。
図2は本発明の実施形態における、基材に対するハンダ付け物品のハンダ付け方法を示した模式図である。
ハンダ付け物品40を基材30に以下のようにハンダ付けする。ここで基材30は板状の直方体であり、基材30の主面上に一個もしくは複数個の平面四角形状のハンダ付け物品40をハンダ付けする。板状の基材30が下に凸の反りがある場合、基材30の周辺部に載置されるハンダ付け物品では基材30の外周部側が高くなるなどの高低差が生じる。
この図より、基材30上の高さが低い側にダム材60を配置しているため、ハンダ50の流れがせき止められている。また錘の重心15をハンダ付け物品の中心ではなく、高さが低い位置にシフトするように錘10を配置することにより、高さが低い側のハンダ50が高い側に押し出されていることがわかる。このように基材30の高さが低い側にダム材60を配置するとともに、錘の重心15を高さが低い側にシフトさせて配置することにより、従来例と比べて高さが高い側のはんだ量が増加するため、ボイドの発生が抑えられる。
G=L2/L1・・・(1)
0.1≦G≦0.45・・・(2)
0.002≦W/A≦0.2・・・(3)
なおこの実験は前述の通りSn−Sb系はんだ材料で行ったが、通常のハンダ付け工程で行われる加熱時のピーク温度はハンダの溶融液相温度よりかなり高く設定されていることから、Sn−Sb系以外のハンダ材料においてもハンダの粘性は同程度に低くなるため、いずれのハンダ材料においても上記と同様の最適条件となる。
図4(a)は、ダム材60を基材30の所定範囲のうち、高さが低い側(錘の重心15がシフトしている側)の縁部のみに配置した場合の実施例である。この場合、ダム材60の材料が最小限で済むため、ダム材のコストを抑えたい場合などに有効である。
0.003≦S/D・・・(4)
またハンダ付け工程時に錘10の荷重によりハンダ50の厚さが薄くなりすぎるのを防止するため、基材30の表面に所定高さの突起を形成したり、はんだ中にスペーサとして機能するフィラーを含有させることにより、ハンダ厚をより均等にすることができる。
11 錘本体
12 足
13 爪
14 持ち手
15 錘の重心
20 ハンダ付け治具
30 基材
40 ハンダ付け物品
50 ハンダ
51 ボイド
60 ダム材
Claims (11)
- ハンダと、ハンダ付け物品と、
前記ハンダの融点以上の温度において、主面に反りによる高低差がある基材と、
重心が前記ハンダ付け物品の中心からシフトされるように、前記ハンダ付け物品と当接する面の縁部にのみ足を有するよう構成された錘と、
前記ハンダ付け物品を前記基材主面の所定範囲に保持するための孔を有する位置決め治具と、
溶融した前記ハンダをせき止めることができるダム材と、
を準備し、
前記基材主面の所定範囲の縁部のうち前記反りで相対的に高さが低くなる側の縁部に、前記ダム材を配置する工程と、
前記基材の主面に前記位置決め治具を載置する工程と、
前記孔に前記ハンダと、前記ハンダ付け物品とを重ねて載置する工程と、
前記ハンダ付け物品の上面に、前記錘を、前記反りで相対的に高さが低くなる側に前記重心が位置するように載置する工程と、
前記ハンダの融点以上の温度に昇温する工程と、
を有することを特徴とする半導体装置の製造方法。 - 前記ハンダの融点以上の温度で昇温する工程の直前において、
前記反りで前記ハンダ付け物品の高さが相対的に低くなる縁部と、前記反りで前記ハンダ付け物品の高さが相対的に高くなる縁部との距離に対する、前記反りで前記ハンダ付け物品の高さが相対的に低くなる縁部と、前記錘の重心位置との距離の比が、0.1以上0.45以下であることを特徴とする請求項1に記載の半導体装置の製造方法。 - 前記ハンダ付け物品の主面の面積に対する、前記錘の重さの比が、0.002〜0.2(g/mm2)であることを特徴とする請求項1または2に記載の半導体装置の製造方法。
- 前記ハンダの融点以上の温度で昇温する工程の直前において、前記ハンダ付け物品の上部に立体的な構造物が配設されていることを特徴とする請求項1ないし3のいずれか一項に記載の半導体装置の製造方法。
- 前記ダム材が、レジスト材、黒鉛材料、治具、レーザービーム照射パターンのいずれかで構成されていることを特徴とする請求項1ないし4のいずれか一項に記載の半導体装置の製造方法。
- 前記基材の主面の所定範囲内に突起が設けられていることを特徴とする請求項1ないし5のいずれか一項に記載の半導体装置の製造方法。
- 前記ハンダにフィラーが含有されていることを特徴とする請求項1ないし5のいずれか一項に記載の半導体装置の製造方法。
- 本体と足で構成され、
前記本体が直方体であり、前記本体のハンダ付け物品と対向する面の一の縁部側にのみ前記足が偏って配置されており、
重心が前記本体の中心から前記一の縁部側へシフトされていることを特徴とするハンダ付け用錘。 - 前記足が、U字形状部材からなることを特徴とする請求項8に記載のハンダ付け用錘。
- 前記足が、複数の直線形状部材からなることを特徴とする請求項8に記載のハンダ付け用錘。
- 前記本体の前記ハンダ付け物品と対向する面の、前記足が配置されていない角部に爪が配置されていることを特徴とする請求項8ないし10のいずれか1項に記載のハンダ付け用錘。
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