CN102859436B - 移除材料及转印图案的方法及系统 - Google Patents

移除材料及转印图案的方法及系统 Download PDF

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Publication number
CN102859436B
CN102859436B CN201180007625.5A CN201180007625A CN102859436B CN 102859436 B CN102859436 B CN 102859436B CN 201180007625 A CN201180007625 A CN 201180007625A CN 102859436 B CN102859436 B CN 102859436B
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CN
China
Prior art keywords
substrate
vuv
vacuum ultraviolet
radiation source
radiation
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CN201180007625.5A
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English (en)
Chinese (zh)
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CN102859436A (zh
Inventor
G·M·施米德
M·N·米勒
B-J·乔伊
D·J·雷斯尼克
S·V·斯里尼瓦桑
F·Y·徐
D·D·唐纳德森
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Canon Nanotechnologies Inc
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Molecular Imprints Inc
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Nanotechnology (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Theoretical Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
CN201180007625.5A 2010-01-27 2011-01-27 移除材料及转印图案的方法及系统 Active CN102859436B (zh)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US29873410P 2010-01-27 2010-01-27
US61/298,734 2010-01-27
US29909710P 2010-01-28 2010-01-28
US61/299,097 2010-01-28
US13/014,508 US8980751B2 (en) 2010-01-27 2011-01-26 Methods and systems of material removal and pattern transfer
US13/014,508 2011-01-26
PCT/US2011/022679 WO2011094383A2 (en) 2010-01-27 2011-01-27 Methods and systems of material removal and pattern transfer

Publications (2)

Publication Number Publication Date
CN102859436A CN102859436A (zh) 2013-01-02
CN102859436B true CN102859436B (zh) 2015-07-15

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CN201180007625.5A Active CN102859436B (zh) 2010-01-27 2011-01-27 移除材料及转印图案的方法及系统

Country Status (7)

Country Link
US (1) US8980751B2 (enExample)
JP (1) JP5782460B2 (enExample)
KR (1) KR101947524B1 (enExample)
CN (1) CN102859436B (enExample)
SG (1) SG181560A1 (enExample)
TW (1) TWI551386B (enExample)
WO (1) WO2011094383A2 (enExample)

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US20110048518A1 (en) * 2009-08-26 2011-03-03 Molecular Imprints, Inc. Nanostructured thin film inorganic solar cells
WO2011143327A2 (en) 2010-05-11 2011-11-17 Molecular Imprints, Inc. Nanostructured solar cell
JP5634313B2 (ja) * 2011-03-29 2014-12-03 富士フイルム株式会社 レジストパターン形成方法およびそれを用いたパターン化基板の製造方法
US9616614B2 (en) 2012-02-22 2017-04-11 Canon Nanotechnologies, Inc. Large area imprint lithography
WO2018027069A1 (en) * 2016-08-03 2018-02-08 Board Of Regents, The University Of Texas System Roll-to-roll programmable film imprint lithography
DE102019214074A1 (de) * 2019-09-16 2021-03-18 Robert Bosch Gmbh Verfahren und Vorrichtung zum lokalen Entfernen und/oder Modifizieren eines Polymermaterials auf einer Oberfläche

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EP0510503A2 (de) * 1991-04-25 1992-10-28 Heraeus Noblelight GmbH Verfahren zur Behandlung von Oberflächen
TW200608488A (en) * 2004-08-17 2006-03-01 Taiwan Semiconductor Mfg Co Ltd Low oxygen content photoresist stripping process for low dielectric constant materials
US20060141778A1 (en) * 2002-02-14 2006-06-29 Nec Electronics Corporation Manufacturing method of semiconductor device
CN101053063A (zh) * 2004-09-01 2007-10-10 艾克塞利斯技术公司 用于增加光阻移除率之装置及等离子体灰化方法
US20080302400A1 (en) * 2007-06-05 2008-12-11 Thomas Johnston System and Method for Removal of Materials from an Article
CN101490621A (zh) * 2006-11-21 2009-07-22 第一毛织株式会社 用于加工抗蚀剂下层膜的硬掩模组合物、使用该硬掩模组合物来生产半导体集成电路器件的方法、以及通过该方法生产的半导体集成电路器件

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JPH09123206A (ja) 1995-10-30 1997-05-13 Towa Kk 電子部品の樹脂封止成形装置
JP4045682B2 (ja) 1999-01-26 2008-02-13 株式会社日立ハイテクノロジーズ 紫外線照射による基板処理装置
US6873087B1 (en) 1999-10-29 2005-03-29 Board Of Regents, The University Of Texas System High precision orientation alignment and gap control stages for imprint lithography processes
DE19957034B4 (de) 1999-11-26 2006-04-13 Heraeus Noblelight Gmbh Verfahren zur Behandlung von Oberflächen von Substraten und Vorrichtung
JP2003337432A (ja) 2002-05-20 2003-11-28 Tsukuba Semi Technology:Kk 機能水を使ったレジスト除去方法、およびその装置
US6932934B2 (en) 2002-07-11 2005-08-23 Molecular Imprints, Inc. Formation of discontinuous films during an imprint lithography process
US7077992B2 (en) 2002-07-11 2006-07-18 Molecular Imprints, Inc. Step and repeat imprint lithography processes
US6936194B2 (en) 2002-09-05 2005-08-30 Molecular Imprints, Inc. Functional patterning material for imprint lithography processes
AU2003272613A1 (en) * 2002-09-20 2004-04-08 Pete Atwell System and method for removal of materials from an article
US20040065252A1 (en) 2002-10-04 2004-04-08 Sreenivasan Sidlgata V. Method of forming a layer on a substrate to facilitate fabrication of metrology standards
US8349241B2 (en) 2002-10-04 2013-01-08 Molecular Imprints, Inc. Method to arrange features on a substrate to replicate features having minimal dimensional variability
US7179396B2 (en) 2003-03-25 2007-02-20 Molecular Imprints, Inc. Positive tone bi-layer imprint lithography method
US7396475B2 (en) 2003-04-25 2008-07-08 Molecular Imprints, Inc. Method of forming stepped structures employing imprint lithography
US7157036B2 (en) 2003-06-17 2007-01-02 Molecular Imprints, Inc Method to reduce adhesion between a conformable region and a pattern of a mold
DE10343323A1 (de) 2003-09-11 2005-04-07 Carl Zeiss Smt Ag Stempellithografieverfahren sowie Vorrichtung und Stempel für die Stempellithografie
US8076386B2 (en) 2004-02-23 2011-12-13 Molecular Imprints, Inc. Materials for imprint lithography
DE602005012068D1 (de) * 2005-06-10 2009-02-12 Obducat Ab Kopieren eines Musters mit Hilfe eines Zwischenstempels
US20070138405A1 (en) * 2005-12-16 2007-06-21 3M Innovative Properties Company Corona etching
JP2008091685A (ja) 2006-10-03 2008-04-17 Seiko Epson Corp 素子基板およびその製造方法
US7832416B2 (en) 2006-10-10 2010-11-16 Hewlett-Packard Development Company, L.P. Imprint lithography apparatus and methods
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JP2009034926A (ja) 2007-08-02 2009-02-19 Sumitomo Electric Ind Ltd 樹脂パターン形成方法
US20090166317A1 (en) * 2007-12-26 2009-07-02 Canon Kabushiki Kaisha Method of processing substrate by imprinting
JP5149083B2 (ja) 2008-06-16 2013-02-20 富士フイルム株式会社 パターン形成方法、並びに基板加工方法、モールド構造体の複製方法、及びモールド構造体
US8394203B2 (en) 2008-10-02 2013-03-12 Molecular Imprints, Inc. In-situ cleaning of an imprint lithography tool

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0510503A2 (de) * 1991-04-25 1992-10-28 Heraeus Noblelight GmbH Verfahren zur Behandlung von Oberflächen
US20060141778A1 (en) * 2002-02-14 2006-06-29 Nec Electronics Corporation Manufacturing method of semiconductor device
TW200608488A (en) * 2004-08-17 2006-03-01 Taiwan Semiconductor Mfg Co Ltd Low oxygen content photoresist stripping process for low dielectric constant materials
CN101053063A (zh) * 2004-09-01 2007-10-10 艾克塞利斯技术公司 用于增加光阻移除率之装置及等离子体灰化方法
CN101490621A (zh) * 2006-11-21 2009-07-22 第一毛织株式会社 用于加工抗蚀剂下层膜的硬掩模组合物、使用该硬掩模组合物来生产半导体集成电路器件的方法、以及通过该方法生产的半导体集成电路器件
US20080302400A1 (en) * 2007-06-05 2008-12-11 Thomas Johnston System and Method for Removal of Materials from an Article

Also Published As

Publication number Publication date
JP2013518446A (ja) 2013-05-20
SG181560A1 (en) 2012-07-30
KR101947524B1 (ko) 2019-02-13
KR20120125297A (ko) 2012-11-14
WO2011094383A2 (en) 2011-08-04
CN102859436A (zh) 2013-01-02
US20110183521A1 (en) 2011-07-28
JP5782460B2 (ja) 2015-09-24
TWI551386B (zh) 2016-10-01
US8980751B2 (en) 2015-03-17
TW201139032A (en) 2011-11-16
WO2011094383A3 (en) 2011-09-29

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