CN102712834B - 粘接材料卷轴 - Google Patents

粘接材料卷轴 Download PDF

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Publication number
CN102712834B
CN102712834B CN201180006535.4A CN201180006535A CN102712834B CN 102712834 B CN102712834 B CN 102712834B CN 201180006535 A CN201180006535 A CN 201180006535A CN 102712834 B CN102712834 B CN 102712834B
Authority
CN
China
Prior art keywords
adhesive material
bond layer
adhesive
reel
material reel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201180006535.4A
Other languages
English (en)
Chinese (zh)
Other versions
CN102712834A (zh
Inventor
松田和也
关贵志
藤绳贡
藤枝忠恭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to CN201410610471.4A priority Critical patent/CN104403589B/zh
Publication of CN102712834A publication Critical patent/CN102712834A/zh
Application granted granted Critical
Publication of CN102712834B publication Critical patent/CN102712834B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H37/00—Article or web delivery apparatus incorporating devices for performing specified auxiliary operations
    • B65H37/002—Web delivery apparatus, the web serving as support for articles, material or another web
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H10W72/30—
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • H10W72/073—
    • H10W74/15—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Storage Of Web-Like Or Filamentary Materials (AREA)
CN201180006535.4A 2010-03-12 2011-03-10 粘接材料卷轴 Active CN102712834B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201410610471.4A CN104403589B (zh) 2010-03-12 2011-03-10 粘接材料卷轴

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2010056270 2010-03-12
JP2010-056270 2010-03-12
JP2010-086330 2010-04-02
JP2010086330 2010-04-02
PCT/JP2011/055671 WO2011111784A1 (ja) 2010-03-12 2011-03-10 接着材リール

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN201410610471.4A Division CN104403589B (zh) 2010-03-12 2011-03-10 粘接材料卷轴

Publications (2)

Publication Number Publication Date
CN102712834A CN102712834A (zh) 2012-10-03
CN102712834B true CN102712834B (zh) 2014-11-26

Family

ID=44563582

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201180006535.4A Active CN102712834B (zh) 2010-03-12 2011-03-10 粘接材料卷轴
CN201410610471.4A Active CN104403589B (zh) 2010-03-12 2011-03-10 粘接材料卷轴

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201410610471.4A Active CN104403589B (zh) 2010-03-12 2011-03-10 粘接材料卷轴

Country Status (5)

Country Link
JP (3) JPWO2011111784A1 (enExample)
KR (2) KR101763458B1 (enExample)
CN (2) CN102712834B (enExample)
TW (1) TWI435841B (enExample)
WO (1) WO2011111784A1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6046896B2 (ja) * 2012-01-30 2016-12-21 デクセリアルズ株式会社 フィルム巻装体、及びフィルム巻装体の製造方法
JP5997306B2 (ja) * 2015-02-18 2016-09-28 株式会社ホンマ コーナー部用粘着テープ
WO2017090659A1 (ja) * 2015-11-25 2017-06-01 日立化成株式会社 回路接続用接着剤組成物及び構造体
DE102016200810A1 (de) * 2016-01-21 2017-07-27 Tesa Se Abroller, Verwendung eines Abrollers, Klebeband zur Verklebung von Bauteilen und Verklebung von zwei Bauteilen
CN114196334A (zh) * 2016-01-29 2022-03-18 昭和电工材料株式会社 粘接剂带及其制造方法、以及粘接剂膜用卷轴
CN111466015B (zh) * 2018-03-23 2023-08-29 琳得科株式会社 固晶膜、切割固晶片及半导体芯片的制造方法
JP2020073404A (ja) * 2019-09-30 2020-05-14 日立化成株式会社 異方導電フィルム用リール及び異方導電フィルム巻
JP7446095B2 (ja) * 2019-12-03 2024-03-08 デクセリアルズ株式会社 フィルム巻装体及び接続体の製造方法
JP2022048793A (ja) * 2020-09-15 2022-03-28 昭和電工マテリアルズ株式会社 接着材リール、及び、回路接続構造体の製造方法

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002031809A (ja) * 2000-07-17 2002-01-31 Stanley Electric Co Ltd 液晶装置の製造方法
JP2004186204A (ja) * 2002-11-29 2004-07-02 Hitachi Chem Co Ltd 回路部材接続用フィルム状接着剤及びこれを用いた半導体装置
JP2004202738A (ja) * 2002-12-24 2004-07-22 Hitachi Chem Co Ltd 接着材テープの接続方法
JP2004323621A (ja) * 2003-04-23 2004-11-18 Hitachi Chem Co Ltd 接着材テープ
JP2004323622A (ja) * 2003-04-23 2004-11-18 Hitachi Chem Co Ltd 接着材テープ
CN1965044A (zh) * 2004-06-09 2007-05-16 日立化成工业株式会社 粘结剂组合物、电路连接材料、电路部材的连接结构以及半导体装置
JP2009004354A (ja) * 2007-05-23 2009-01-08 Hitachi Chem Co Ltd 接着材リール及びこれを用いた回路接続体の製造方法
WO2009031472A1 (ja) * 2007-09-05 2009-03-12 Hitachi Chemical Company, Ltd. 接着剤及びそれを用いた接続構造体
TW200941507A (en) * 2008-03-28 2009-10-01 Sony Chem & Inf Device Corp Anisotropic conductive film transfer tool and connection method

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3045427B2 (ja) * 1992-06-22 2000-05-29 ソニー株式会社 異方性導電膜の貼付け方法および装置
JPH0749504A (ja) * 1993-08-06 1995-02-21 Hitachi Electron Eng Co Ltd 異方性導電テープのカット目検出装置
JP3223780B2 (ja) * 1996-01-19 2001-10-29 松下電器産業株式会社 チップの実装装置
JPH1051115A (ja) * 1996-07-29 1998-02-20 Sony Corp 異方性導電膜貼付け装置及び異方性導電膜分割方法
JP4151083B2 (ja) * 1997-05-12 2008-09-17 日立化成工業株式会社 異方導電性接着テープの貼付け方法および装置
JP3648933B2 (ja) * 1997-08-06 2005-05-18 松下電器産業株式会社 異方性導電材の貼着方法
JPH11339575A (ja) * 1998-05-22 1999-12-10 Sony Corp 異方性導電性テープの製造方法及び装置
JP3680669B2 (ja) * 1999-12-17 2005-08-10 ソニーケミカル株式会社 多層異方性導電膜積層体
JP2002226822A (ja) * 2001-01-30 2002-08-14 Three M Innovative Properties Co 光線活性化型接着フィルムを用いた基材接着方法
CN100548840C (zh) * 2002-07-30 2009-10-14 日立化成工业株式会社 粘接材料带连接体及粘接材料带的连接方法
JP4333140B2 (ja) * 2003-01-08 2009-09-16 日立化成工業株式会社 接着剤テープの製造方法
JP4595459B2 (ja) * 2004-09-15 2010-12-08 カシオ計算機株式会社 粘着性接着材の転写方法

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002031809A (ja) * 2000-07-17 2002-01-31 Stanley Electric Co Ltd 液晶装置の製造方法
JP2004186204A (ja) * 2002-11-29 2004-07-02 Hitachi Chem Co Ltd 回路部材接続用フィルム状接着剤及びこれを用いた半導体装置
JP2004202738A (ja) * 2002-12-24 2004-07-22 Hitachi Chem Co Ltd 接着材テープの接続方法
JP2004323621A (ja) * 2003-04-23 2004-11-18 Hitachi Chem Co Ltd 接着材テープ
JP2004323622A (ja) * 2003-04-23 2004-11-18 Hitachi Chem Co Ltd 接着材テープ
CN1965044A (zh) * 2004-06-09 2007-05-16 日立化成工业株式会社 粘结剂组合物、电路连接材料、电路部材的连接结构以及半导体装置
JP2009004354A (ja) * 2007-05-23 2009-01-08 Hitachi Chem Co Ltd 接着材リール及びこれを用いた回路接続体の製造方法
WO2009031472A1 (ja) * 2007-09-05 2009-03-12 Hitachi Chemical Company, Ltd. 接着剤及びそれを用いた接続構造体
TW200941507A (en) * 2008-03-28 2009-10-01 Sony Chem & Inf Device Corp Anisotropic conductive film transfer tool and connection method

Also Published As

Publication number Publication date
WO2011111784A1 (ja) 2011-09-15
JP5928567B2 (ja) 2016-06-01
CN104403589A (zh) 2015-03-11
JP2015083691A (ja) 2015-04-30
KR20120113803A (ko) 2012-10-15
KR101763458B1 (ko) 2017-07-31
JP2014037544A (ja) 2014-02-27
TW201139259A (en) 2011-11-16
KR20140054438A (ko) 2014-05-08
TWI435841B (zh) 2014-05-01
CN104403589B (zh) 2017-01-11
CN102712834A (zh) 2012-10-03
JPWO2011111784A1 (ja) 2013-06-27

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Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C53 Correction of patent of invention or patent application
CB02 Change of applicant information

Address after: Japan Tokyo Chiyoda Marunouchi yidingmu 9 No. 2

Applicant after: HITACHI CHEMICAL Co.,Ltd.

Address before: Tokyo, Japan

Applicant before: HITACHI CHEMICAL Co.,Ltd.

COR Change of bibliographic data

Free format text: CORRECT: APPLICANT; FROM: HITACHI CHEMICAL CO. LTD. TO: HITACHI CHEMICAL CO., LTD.

C14 Grant of patent or utility model
GR01 Patent grant
CP01 Change in the name or title of a patent holder

Address after: Japan Tokyo Chiyoda Marunouchi yidingmu 9 No. 2

Patentee after: Lishennoco Co.,Ltd.

Address before: Japan Tokyo Chiyoda Marunouchi yidingmu 9 No. 2

Patentee before: HITACHI CHEMICAL Co.,Ltd.

CP01 Change in the name or title of a patent holder