CN102666938B - 回焊镀Sn构件 - Google Patents
回焊镀Sn构件 Download PDFInfo
- Publication number
- CN102666938B CN102666938B CN201080054205.8A CN201080054205A CN102666938B CN 102666938 B CN102666938 B CN 102666938B CN 201080054205 A CN201080054205 A CN 201080054205A CN 102666938 B CN102666938 B CN 102666938B
- Authority
- CN
- China
- Prior art keywords
- reflow
- plating
- layer
- face
- less
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
- C25D5/50—After-treatment of electroplated surfaces by heat-treatment
- C25D5/505—After-treatment of electroplated surfaces by heat-treatment of electroplated tin coatings, e.g. by melting
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
- C25D5/611—Smooth layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
- H01R13/035—Plated dielectric material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/922—Static electricity metal bleed-off metallic stock
- Y10S428/9265—Special properties
- Y10S428/929—Electrical contact feature
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12708—Sn-base component
- Y10T428/12715—Next to Group IB metal-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12708—Sn-base component
- Y10T428/12722—Next to Group VIII metal-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12903—Cu-base component
- Y10T428/1291—Next to Co-, Cu-, or Ni-base component
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Description
Claims (2)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009-271472 | 2009-11-30 | ||
JP2009271472A JP5419275B2 (ja) | 2009-11-30 | 2009-11-30 | リフローSnめっき部材 |
PCT/JP2010/068901 WO2011065166A1 (ja) | 2009-11-30 | 2010-10-26 | リフローSnめっき部材 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102666938A CN102666938A (zh) | 2012-09-12 |
CN102666938B true CN102666938B (zh) | 2016-04-27 |
Family
ID=44066270
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201080054205.8A Active CN102666938B (zh) | 2009-11-30 | 2010-10-26 | 回焊镀Sn构件 |
Country Status (7)
Country | Link |
---|---|
US (1) | US8865319B2 (zh) |
EP (1) | EP2495354A4 (zh) |
JP (1) | JP5419275B2 (zh) |
KR (1) | KR101214421B1 (zh) |
CN (1) | CN102666938B (zh) |
TW (1) | TWI409128B (zh) |
WO (1) | WO2011065166A1 (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5419275B2 (ja) | 2009-11-30 | 2014-02-19 | Jx日鉱日石金属株式会社 | リフローSnめっき部材 |
JP6253402B2 (ja) * | 2013-12-27 | 2017-12-27 | 日立オートモティブシステムズ株式会社 | 車載用電子モジュール |
CA2989621A1 (en) * | 2015-06-16 | 2016-12-22 | 3M Innovative Properties Company | Plating bronze on polymer sheets |
KR101900793B1 (ko) * | 2017-06-08 | 2018-09-20 | 주식회사 풍산 | 전기·전자, 자동차 부품용 동합금의 주석 도금 방법 및 이로부터 제조된 동합금의 주석 도금재 |
JP6930327B2 (ja) * | 2017-06-30 | 2021-09-01 | 三菱マテリアル株式会社 | 防食端子材とその製造方法、及び防食端子並びに電線端末部構造 |
JP6946884B2 (ja) * | 2017-06-30 | 2021-10-13 | 三菱マテリアル株式会社 | 防食端子材とその製造方法、及び防食端子並びに電線端末部構造 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3986265B2 (ja) * | 2001-03-13 | 2007-10-03 | 株式会社神戸製鋼所 | 電子・電気部品用銅合金材料 |
DE60211808T2 (de) | 2001-07-31 | 2006-10-19 | Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.), Kobe | Plattierte Kupferlegierung und Verfahren zu ihre Herstellung |
JP4016637B2 (ja) | 2001-10-24 | 2007-12-05 | 松下電器産業株式会社 | 錫−銀合金めっき皮膜を有する電子部品用リードフレーム及びその製造方法 |
JP4897187B2 (ja) * | 2002-03-05 | 2012-03-14 | ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. | スズメッキ方法 |
DE10213185A1 (de) * | 2002-03-23 | 2003-10-02 | Km Europa Metal Ag | Verfahren zur Verringerung der Kupferlöslichkeit an der inneren Oberfläche eines Kupferrohrs |
JP3880877B2 (ja) | 2002-03-29 | 2007-02-14 | Dowaホールディングス株式会社 | めっきを施した銅または銅合金およびその製造方法 |
US6860981B2 (en) | 2002-04-30 | 2005-03-01 | Technic, Inc. | Minimizing whisker growth in tin electrodeposits |
JP4749746B2 (ja) * | 2005-03-24 | 2011-08-17 | Dowaメタルテック株式会社 | 錫めっき材およびその製造方法 |
US7628871B2 (en) * | 2005-08-12 | 2009-12-08 | Intel Corporation | Bulk metallic glass solder material |
JP2007063624A (ja) | 2005-08-31 | 2007-03-15 | Nikko Kinzoku Kk | 挿抜性及び耐熱性に優れる銅合金すずめっき条 |
JPWO2007142352A1 (ja) * | 2006-06-09 | 2009-10-29 | 国立大学法人 熊本大学 | めっき膜の形成方法および材料 |
JP2008274316A (ja) | 2007-04-25 | 2008-11-13 | Toyota Motor Corp | めっき部材およびその製造方法 |
JP2009108339A (ja) * | 2007-10-26 | 2009-05-21 | Renesas Technology Corp | 半導体装置およびその製造方法 |
JP4963490B2 (ja) | 2008-07-03 | 2012-06-27 | トヨタ自動車株式会社 | めっき部材 |
JP5419275B2 (ja) | 2009-11-30 | 2014-02-19 | Jx日鉱日石金属株式会社 | リフローSnめっき部材 |
-
2009
- 2009-11-30 JP JP2009271472A patent/JP5419275B2/ja active Active
-
2010
- 2010-10-26 CN CN201080054205.8A patent/CN102666938B/zh active Active
- 2010-10-26 EP EP10833013.5A patent/EP2495354A4/en not_active Withdrawn
- 2010-10-26 KR KR1020127013324A patent/KR101214421B1/ko active IP Right Grant
- 2010-10-26 US US13/512,486 patent/US8865319B2/en active Active
- 2010-10-26 WO PCT/JP2010/068901 patent/WO2011065166A1/ja active Application Filing
- 2010-10-28 TW TW099136886A patent/TWI409128B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP2495354A4 (en) | 2013-08-14 |
KR101214421B1 (ko) | 2012-12-21 |
CN102666938A (zh) | 2012-09-12 |
EP2495354A1 (en) | 2012-09-05 |
JP2011111663A (ja) | 2011-06-09 |
KR20120085853A (ko) | 2012-08-01 |
TWI409128B (zh) | 2013-09-21 |
JP5419275B2 (ja) | 2014-02-19 |
TW201125673A (en) | 2011-08-01 |
WO2011065166A1 (ja) | 2011-06-03 |
US20120282486A1 (en) | 2012-11-08 |
US8865319B2 (en) | 2014-10-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: Tokyo, Japan, Japan Patentee after: JX NIPPON MINING & METALS CORPORATION Address before: Tokyo, Japan, Japan Patentee before: JX Nippon Mining & Metals Co., Ltd. |
|
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: Tokyo, Japan, Japan Patentee after: JX NIPPON MINING & METALS CORPORATION Address before: Tokyo, Japan, Japan Patentee before: JX NIPPON MINING & METALS CORPORATION |
|
CP02 | Change in the address of a patent holder | ||
CP02 | Change in the address of a patent holder |
Address after: No. 10-4, erdingmu, tiger gate, Tokyo port, Japan Patentee after: JKS Metal Co.,Ltd. Address before: Tokyo, Japan Patentee before: JKS Metal Co.,Ltd. |