CN102620256A - 制造发光组件的方法 - Google Patents
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Abstract
一种制造发光组件的方法,所述方法包括:将一个或多个发光二极管(LED)连接至印刷电路板,所述连接的发光二极管(LED)可通过所述印刷电路板的电路与电源连接;以及将重叠模塑材料嵌件模塑在所述印刷电路板的邻近所述发光二极管(LED)的至少多个部分上,所述重叠模塑材料具有大于约100℃的熔解温度并且具有大于或约为1W/m·K的导热系数。
Description
本申请是申请日为2006年11月29日、申请号为200680044412.9(国际专利申请号为PCT/US2006/045681)、发明名称为“具有热重叠模塑的LED发光组件”的分案申请。
技术领域
下文涉及照明领域。尤其涉及基于LED的发光组件,包括用于挠性发光条(flexible lighting strip)的基于LED的发光组件模块。然而,以下还将提供结合发光组件的应用、用于制造发光组件的方法、与发光组件相关的电子装置、以及使用发光组件的应用,例如照明、发光槽型字(照明槽型字,illuminated channel lettering)、边界照明(border lighting),等等。
背景技术
发光二极管(LED)用于发光组件,在其中它们具有白炽光、荧光、以及其他发光技术的某些优点。例如,LED小巧、耐用、相对能量高效、可在低电压下工作,等等。在通常的设置方案中,一个或多个LED与印刷电路板连接,并可通过印刷电路板的电路与电源相连。如果电源与LED不直接相容(例如,将110V的AC民用电压(house voltage)应用于通常在几伏特的DC下工作的LED),那么印刷电路还可包括将功率转换为可修正的形式以驱动LED的功率调制电路(power conditioning circuitry)。可替代地或另外地,AC/DC转换器、DC电源、或其他功率调制部件可介于(插入)110VAC与印刷电路板之间。
发光组件中的高亮度LED通常在相对较低的电压却相对较高的电流下工作。向商品化的高亮度LED输入的总电功率通常是在每个LED几百毫瓦至几瓦的水平。因而,所关注的是如何有效去除产生的热。
一种已知的用于去除LED工作过程中产生的多余的热的方法是使用金属散热件(heat sink)。LED发射体(emitter)(可由LuminLedsLighting、LLC、San Jose、CA获得)和一些其他的商品化高亮度LED包括金属散热块(heat slug),半导体芯片连接在金属散热块上或以其他方式与其热接触。为了获得小巧的外形,LED的金属散热块不可太大,并且通常要向较大的外部散热件(其将热散逸至周围的环境中)导热。因而,将LED安装在金属散热件上。在一些发光组件中,将金属散热件结合至印刷电路板中。这种复合板通常称作金属芯印刷电路板。
金属散热件增加了发光组件的实际成本(substantial cost)与重量,并且在散热方面相对低效。通常的散热件金属,如铜,具有高密度,使得散热件大且重。此外,用于将热散逸至环境中的表面积与金属散热件的表面积相对应。为了实现与环境良好的热结合,金属散热件通常包括散热片或其他辐射(散热)结构,其增大了散热件的重量和体积。可选择地,由通风机(fan)产生的强制空气对流可用于增加向环境中的热传递,或者可结合活性水冷却(active water cooling)。然而,这些方法增加了实际成本、体积、以及发光组件的复杂性。
金属散热件的另一个问题是由LED至金属散热件的热路径具有受限的面积。如果通过安装导线来安装LED,热路径可能被限制为导线的面积。在一些发光组件中,将导热底层填充材料置于LED与金属芯印刷电路板之间以便于热传递。这种底层填料,特别是当其与具有整体散热块的LED结合使用时,实质上增大了热路径面积,但热路径面积通常不能实质上增大到超出LED的总覆盖面积。
在一些其他方法中,使用导热材料来灌封(pot)LED。例如,Roney等的美国专利第5,632,551号和Roney等的美国专利第5,528,474号公开了灌封的LED组件。通常,灌封材料是双组分环氧树脂或其他双组分灌封材料(当其用于发光组件时,将其进行结合或混合,且随后被固化)。在固化过程中发生在混合物中的缩聚作用、加成反应、或其他化学过程,导致发光组件的LED周围的灌封材料凝固。
灌封可提供LED与散热件之间较大的热接触面积,但具有某些其他缺点。在固化过程中通常需要一个容器或壳体以保持处于液态形式的灌封材料。容器或壳体增加了发光组件的重量和体积,并且对于某些小型(low-profile)发光组件存在问题。此外,灌封材料本身通常不具有足够的热质(thermal mass)以耗散由LED产生的热。因而,在基于LED的发光组件中通常以与金属散热件结合的方式来进行灌封。
下文关注克服了上述局限性及其他的改进的装置和方法。
发明内容
根据一个方面,公开了一种制造发光组件的方法,该方法包括将一个或多个发光二极管(LED)连接至印刷电路板,所述连接的发光二极管(LED)可通过所述印刷电路板的电路与电源连接;以及将重叠模塑材料嵌件模塑在所述印刷电路板的邻近所述发光二极管(LED)的至少多个部分上,所述重叠模塑材料具有大于约100℃的熔解温度并且具有大于或约为1W/m·K的导热系数。
优选的是,嵌件模塑包括:将具有所述连接的发光二极管(LED)的所述印刷电路板置于模具中;将熔解形式的所述重叠模塑材料注射入所述模具中,熔解的所述重叠模塑材料在所述模具中固化以形成固定于所述印刷电路板的邻近所述LED的至少多个部分的重叠模塑件;以及在所述固化之后,将具有所述固定的热塑性重叠模塑件的所述印刷电路板从所述模具中移出。
有利的是,所述模具具有隔离区,所述隔离区用于在具有所述连接的发光二极管(LED)的所述印刷电路板置于所述模具中时容纳所述发光二极管(LED),所述隔离区用于至少防止所述发光二极管(LED)的光输出孔隙在注射所述重叠模塑材料期间被所述重叠模塑材料覆盖。
可选的是,重叠模塑材料选自由热塑性材料和热固性材料组成的组中。
可选的是,重叠模塑材料具有大于或约为10W/m·K的导热系数。
优选的是,重叠模塑材料具有大于或约为10W/m·K的导热系数。
优选的是,所述连接包括:连接一个或者多个发光二极管至不包括金属芯的印刷电路板。
优选的是,所述连接包括:连接一个或者多个发光二极管至包括金属芯的印刷电路板。
优选的是,所述嵌件模塑包括:将所述重叠模塑材料嵌件模塑在所述印刷电路板的邻近所述发光二极管(LED)的至少多个部分上,而所述重叠模塑材料不覆盖一个或者多个所述发光二极管(LED)的光输出孔隙。
有利的是,发光二极管(LED)的光输出孔隙包括所述发光二极管(LED)的透镜。
可选的是,发光二极管(LED)的光输出孔隙包括置于每个所述发光二极管(LED)之上的透光盖。
有选的是,将所述重叠模塑材料嵌件模塑在所述印刷电路板的两个主表面上。
根据本发明提出,连接和嵌件模塑被重复多次,以产生多个发光组件,每个所述发光组件包括一个或多个连接至印刷电路板的发光二极管(LED),所述印刷电路板由独立式高导热材料重叠模塑件覆盖在所述印刷电路板的两个主表面,所述方法还包括:在嵌件模塑之前,将所述发光组件的所述印刷电路板电地和机械地连接至挠性电缆,所述挠性电缆包括多条挠性导线以及在挠性导线周围的绝缘层。
根据本发明的一个优选的设计方案,连接和嵌件模塑产生一个发光组件,所述发光组件包括一个或多个连接至印刷电路板的发光二极管(LED),所述印刷电路板由独立式高导热材料重叠模塑件覆盖在所述印刷电路板的两个主表面。
根据本发明的另一方面提出一种制造发光组件的方法,所述方法包括:将一个或多个发光二极管(LED)连接至印刷电路板,连接的所述一个或多个LED可通过所述印刷电路板的电路与电源连接;以及将热塑性材料再流经过所述印刷电路板的邻近所述一个或多个LED的至少多个部分上,所述热塑性材料具有大于约100℃的熔解温度并且具有大于或约为1W/m·K的导热系数。
优选的是,所述再流包括:将所述热塑性材料嵌件注射模塑在所述印刷电路板的邻近所述一个或多个LED的至少多个部分上。
有利的是,所述嵌件注射模塑包括:加热热塑性材料,而没有伴随的化学反应,从而产生熔解的热塑性材料。
优选的是,所述热塑性材料具有大于或约为10W/m·K的导热系数。
根据本发明提出,所述连接和所述再流生产出一个发光组件,所述发光组件包括一个或多个连接至印刷电路板的发光二极管(LED),所述印刷电路板具有独立式高导热材料重叠模塑件,所述独立式高导热材料包括再流经过所述印刷电路板的邻近所述一个或多个LED的至少多个部分上的所述热塑性材料。
本发明的最后一个方面提出了一种方法,方法,包括:将一个或多个发光二极管(LED)连接至印刷电路板,连接的所述LED可通过所述印刷电路板的电路与电源连接;以及将具有所述连接的发光二级管(LED)的所述印刷电路板置入到模具中;将熔解形式的所述重叠模塑材料注射入所述模具中,熔解的所述重叠模塑材料在所述模具中固化以形成固定于所述印刷电路板的邻近所述LED的至少多个部分的重叠模塑件;以及在所述固化之后,将发光组件从所述模具中移出,所述发光组件包括连接至所述印刷电路板的一个或多个发光二极管(LED),所述印刷电路板具有固定于所述印刷电路板的邻近所述LED的至少多个部分的重叠模塑件,所述重叠模塑件是独立式的并且具有大于约100℃的熔解温度并且具有大于或约为1W/m·K的导热系数。
优选的是,所述连接、所述放置、所述注射和所述移出被重复多次以形成多个所述发光组件,并且所述方法进一步包括:在所述连接、所述放置、所述注射和所述移除之前,将所述发光组件的所述印刷电路板电地和机械地连接至挠性电缆,所述挠性电缆包括多条挠性导线以及在挠性导线周围的绝缘层。
根据一个方面,公开了一种发光组件,其包括印刷电路板和一个或多个设置于印刷电路板上并可通过印刷电路板的电路与电源连接的发光二极管(LED)。一种热塑性重叠模塑件(包覆成型,overmolding)覆盖印刷电路板邻近一个或多个LED的至少多个部分。热塑性重叠模塑件的热塑性材料具有大于约100℃的熔解温度并且具有大于或约为1W/m·K的导热系数。
根据另一个方面,公开了一种制造该发光组件的方法。将一个或多个发光二极管(LED)连接于印刷电路板。连接的LED可通过印刷电路板的电路与电源相连。将重叠模塑材料嵌件模塑(insert mold)在至少部分邻近LED的印刷电路板上。重叠模塑材料具有大于约100℃的熔解温度并且具有大于或约为1W/m·K的导热系数。
根据另一个方面,公开了一种制造发光组件的方法。将一个或多个发光二极管(LED)连接于印刷电路板。连接的一个或多个LED可通过印刷电路板的电路与电源相连。热塑性材料再流(回流,reflow)过印刷电路板邻近一个或多个LED的至少多个部分。该热塑性材料具有大于约100℃的熔解温度并且具有大于或约为1W/m·K的导热系数。
根据另一个方面,公开了一种发光组件,其包括印刷电路板和多个设置于印刷电路板上并可通过印刷电路板的电路与电源相连的发光二极管(LED)。独立式(free-standing)高导热材料重叠模塑件覆盖印刷电路板邻近LED的至少多个部分。该独立式高导热材料具有大于约100℃的熔解温度且具有大于或约为1W/m·K的导热系数。
通过阅读和理解本说明书,对于本领域普通技术人员来说,本发明的许多优点和益处将变得显而易见。
附图说明
本发明可以采用各种部件和部件的安排,并且可以采取各种工艺操作和工艺操作的安排。附图仅仅是为了举例说明优选实施例的目的,而不应理解为限制本发明。
图1图示出了包括LED和在支持印刷电路板的正面主表面(前主侧面,front principal side)和背面主表面(后主侧面)二者上的独立式高导热材料重叠模塑件的发光组件。
图2A、2B和2C图示出了用于形成图1的发光组件的独立式高导热材料重叠模塑件的嵌件注射模塑(注入成型)工艺。图2A图示出了连接有LED的印刷电路板,其设置在嵌件注射模的配合部件之间。图2B图示出了在注射熔解的热塑性材料之前,发光组件在嵌件模的配合部件内。图2C图示出了在注射溶解热塑性材料之后,发光组件在嵌件模的配合部件内。
图3图示出了与图2的发光组件相似的发光组件,但其包括仅在印刷电路板的一个侧面上的独立式高导热材料重叠模塑件。
图4图示出了与图2的发光组件相似的发光组件,但其中印刷电路板是金属芯印刷电路板。
图5图示出了与图2的发光组件相似的发光组件,但其中发光二极管(LED)由圆顶形透光盖所覆盖。
图6图示出了基于LED的发光串的一部分,包括通过绝缘刺破连接器(insulation-displacing connector)连接至挠性电缆的间隔(分开)设置的发光组件模块。
图7图示出了图6的基于LED的发光串的发光组件模块之一的透视图。该发光组件模块包括独立式高导热材料重叠模塑件,以及用于与挠性电缆相连的绝缘刺破连接器。
图8图示出了发光槽型字的俯视图,其由置于该槽型字壳体内的图6的发光串照亮。
具体实施方式
参见图1,发光组件8包括印刷电路板10,其上连接一个或多个发光二极管(LED)12。在示例性的实施方式中,三个LED连接于印刷电路板,然而,连接的LED的数量可以是一个、两个、三个、四个、或更多。基本上可连接任意类型的LED,例如:白色LED,包括由发射白光的荧光材料混合物涂覆的紫外的基于III族氮化物的电致发光半导体二极管;白色LED,包括由发射淡黄色光的荧光材料混合物涂覆的蓝色或蓝紫色的基于III族氮化物的电致发光半导体二极管;蓝色LED,包括蓝色的基于III族氮化物的电致发光半导体二极管;红色LED,包括红色的III族砷化物、III族磷化物、或III族砷化物磷化物的(arsenide-phosphide)电致发光半导体二极管;红色LED,包括红色的III族砷化物、III族磷化物、或III族砷化物磷化物的激光二极管;有机电致发光二极管;等等。在示例性实施方式中,每个LED 12包括基部14(包含电致发光半导体芯片和可选择的散热块(未示出内部部件))、以及包括透镜16的发光孔隙。适合的LED包括,例如,发射体(可由LumiLeds Lighting、LLC、San Jose、CA获得)。
印刷电路板10包括印刷电路(未示出),印刷电路将一个或多个LED12与适合的电能输入端(例如举例说明的设置于印刷电路板10上的电衬垫(electrical pad)20,或设置于印刷电路板之上或与其连接的电源插座(power receptacle),等等)相连。可选择地,发光组件8包括其他的电部件或电子部件,例如举例说明的功率调制集成电路22、限流电阻、静电放电保护装置等。在举例说明的发光组件8中,LED 12和其他部件22被设置于印刷电路板10的单一主表面上;然而,在其他实施方式中,部件可被设置在印刷电路板的两个主表面上并且通过适合的通孔、环绕式(wrap-around)的印刷电路等而彼此电连接。
LED 12能以任何适合的方式与印刷电路板10连接,例如焊接至印刷电路的焊接片(bonding pad)、嵌入适于容纳LED导线的适合的插槽(socket)、等等。如果LED包括整体的散热块,这可以独立地焊接或通过适合的底层填料与印刷电路板连接。在一些LED的设计中,散热块不是电中性的,这种情况下,散热块的连接应与LED导线的连接电隔离。商品化的LED通常具有适合的制造商指定的连接方法或程序。尽管表面装配的LED是有利的,但也可预期使用通过适合的引线接合电连接的引线接合的LED。附加部件22可通过适合的方法进行类似地连接,例如插入适合的插槽、焊接、引线接合等。
图1中所示的发光组件8的印刷电路板10不包括金属芯或其他金属散热件。而是,将正面独立式高导热材料重叠模塑件30和背面独立式高导热材料重叠模塑件32分别设置于印刷电路板10的正面主表面和背面主表面上。在一些实施例中,用于重叠模塑件30、32的独立式高导热材料是导热的热塑性材料或导热的热固性材料。在一些实施例中,用于重叠模塑件30、32的独立式高导热材料是Therma-TechTM液晶聚合物、导热的和电绝缘的热塑性材料(可由PolyOne公司,Avon Lake,OH获得)。可获得具有大于约1W/m·K(如,电绝缘的Therma-TechTM LC5000C TC具有大约2-3W/m·K的导热系数)与大于约10W/m·K(如,电导的Therma-TechTM SF-4500TC和LC-6000TC分别具有10.90W/m·K和18-20W/m·K的导热系数)之间的导热系数值的Therma-TechTM导热的热塑性材料。如果使用导电的高导热材料,那么在设置导电的和导热的高导热材料之前,适当地用绝缘电介质涂覆任何印刷电路、LED导线、或其他暴露的导体。另一方面,可将电绝缘的高导热材料,如Therma-TechTMLC5000C TC设置于导体上,而没有插入的绝缘层。
参见图2A、2B、以及2C,在一些实施方式中,通过嵌件模塑同时形成独立式高导热材料重叠模塑件30、32。在从嵌件模移走后,产生的重叠模塑件30、32是独立的。如图2A中所示,将连接有LED 12和其他部件22的印刷电路板10置于嵌件模的配合部件40、42之间。图2B示出了配合形成封闭的嵌件模之后的两个配对的模部件40、42,该封闭的嵌件模具有容纳连接有LED 12和其他部件22的印刷电路板10的腔。模部件40设计有用于形成正面重叠模塑件30的模塑区44,以及容纳LED 12以至少防止LED 12的光输出孔隙(包括透镜16)被重叠模塑覆盖的可选择的隔离区46。在一些实施方式中,隔离区限定了在LED 12与正面重叠模塑件30之间的间隙。在示出的发光组件8中,隔离区46允许正面重叠模塑件30大致地毗邻LED 12的基部14。在一些实施方式中,隔离区允许正面重叠模塑件30覆盖(overcoat)基部14的一部分。如果重叠模塑件30的高导热材料可充分透光,也可考虑省略隔离区46并允许正面重叠模塑件30覆盖LED 12的透镜16。配合嵌件模部件42包括用于形成背面重叠模32的塑制区48。
参见图2C,导热的热塑性材料或其他高导热模塑材料通常以颗粒(pellet)或其他固体块(solid piece)的形式(未示出)提供,其受热形成熔解的模塑材料,将熔解的模塑材料在压力下通过输送管道52输送至空腔内,例如浇口和流道输送系统(runner delivery system)。注射的熔解的高导热模塑材料56充满模塑区44、48,其中该模塑材料固化以形成正面和背面高导热材料重叠模塑件30、32。然后打开模40、42并移出发光组件8。可选择地,将毛边(flash)或其他模塑物修除。
参见图2A、2B、以及2C,举例描述的嵌件模塑工艺为示例性实施例。基本上可采用任何嵌件模塑过程以形成高导热材料重叠模塑件30、32。由于在完成嵌件注射模塑过程后,将发光组件8从模40、42中移除,发光组件8不适宜包括容器或壳体(其设计用来容纳热塑性材料或其他高导热重叠模塑件30、32)。而是,高导热重叠模塑件30、32是独立的,使得发光组件8能够具有较小的外型。
参见图3,除将背面独立式高导热材料重叠模塑件32省略之外,发光组件8′与图1的发光组件8相似。背面独立式高导热材料重叠模塑件32的省略可简化嵌件模塑或其他重叠模塑工艺,并且可简化发光组件的装配。然而,包括背面独立式高导热材料重叠模塑件32改善了向周围环境的传热。
参见图4,除了用金属芯印刷电路板10″取代印刷电路板10,以及通过延伸过印刷电路板10″的正面主表面和背面主表面的重叠模塑部分60将两个高导热材料重叠模塑件30、32连接以形成单个连续的导热重叠模塑件30、32、60之外,发光组件8″与图1的发光组件8相似。金属芯印刷电路板10″包括设置于限定金属芯64的金属片或金属板上的薄介电层62。薄介电层62优选是薄的,使得在LED 12和其他部件22与金属芯64之间的能够具有良好的导热。导热重叠模塑件30、32、60和金属芯64的结合可提供相对于单独具有重叠模塑件或单独具有金属芯的发光组件的增强的散热。然而,金属芯64通常由铜或其他的高密度金属制成,其增加了发光组件8″的实际重量。
参见图5,除了将LED 12封闭在透光盖中,例如示出的实施例中的基部固定于印刷电路板10的圆顶形盖90之外,发光组件88与图1的发光组件8相似。可选择地,透光盖90包括一个或多个光学涂层92(在图5中用虚线示意性表示),例如荧光涂层、紫外反射层等。在Aanegola等,美国公开申请号2005/0239227A1中公开了一些适合的透光盖设计,其可增强光输出,提供有效的紫外至可见的荧光转换,保护LED免受破坏性物理接触,或提供其他优势。改进的正面独立式高导热材料重叠模塑件130不完全覆盖透光盖90,而是仅接触邻近固定于印刷电路板10的透光盖90的基部区域。
参见图6和图7,公开的热管理观念(heat management concept)易于应用于基于LED的发光串。图7示出了示例发光串180的一部分,包括通过绝缘刺破连接器192、194与绝缘挠性电缆190连接的多个发光组件模块188。挠性电缆190包括多条挠性导线196、198以及在挠性导线196、198周围的绝缘层200(在图6中用虚线图示出)。绝缘刺破连接器192、194将电缆绝缘体200刺破(displace)并与挠性导线196、198电连接。在其他预期实施方式中,挠性电缆190由具有三条或更多条导线(包括一个或多个系列的导线,用于使发光组件模块能够串并联地(series-parallel)相互联接)的电缆取代。在其他预期实施方式中,连续的电缆190由设置于电连接的邻近的发光组件模块之间的短挠性导线段所取代。
具体参见图7,每个发光组件模块188包括支持LED 212的印刷电路板210和包括透镜216的发光孔隙,LED 212包括基部214,基部214包含电致发光半导体芯片和可选的散热块(未示出内部部件)。适合的LED包括,例如,发射体(可由LumiLeds Lighting,LLC,San Jose,CA获得)。将绝缘刺破连接器192、194与电衬垫220焊接或以其他方式电连接以由电缆190的挠性导线196、198向印刷电路板210输送电能,并由此通过印刷电路板210的印刷电路向LED 212输送电能。可选择地,每个发光组件模块188包括其他电部件或电子部件,例如举例说明的功率调制集成电路222、限流电阻、静电放电保护装置,等等。在举例说明的发光组件模块188中,LED 212和其他部件222被设置在印刷电路板210的单个主表面上;然而,在其他实施方式中部件可将设置于印刷电路板的两个主表面上并通过适合的通孔、环绕式的印刷电路等电连接。
除提供开口234之外,将独立的热塑性材料或其他高导热材料重叠模塑件230(在图6和7中由点线图示出)设置于整个印刷电路板210上且部件212、222置于其上,光输出孔隙透镜216和LED 212的基部214的一部分从开口234突出。示出的独立式热塑性材料或其他高导热材料重叠模塑件230也延伸超出印刷电路板210的边缘从而连接印刷电路板210的正面主表面和背面主表面上的重叠模塑件以形成连续的重叠模塑件。示出的独立式热塑性材料或其他高导热材料重叠模塑件230也覆盖与印刷电路板的电衬垫220邻近的绝缘刺破连接器192、194的端子。因此,独立式热塑性材料或其他高导热材料重叠模塑件230为绝缘刺破连接器192、194与电衬垫220之间的连接处产生的热提供了散热。
参见图8,示出了图6中的基于LED的发光串的示例性应用。发光槽型字250包括设置于槽型字壳体252内的发光串180。示例性示出的槽型字壳体252呈现为大写字母“D”;然而,还可使用呈现其他大写字母、或小写字母、或数字、或其他符号、或图像、标识等的槽型字壳体。在示例性实施方式中,发光串180将设置于该槽型字壳体252的底部内表面上,并通过电缆夹、粘合剂等进行适当地固定(在图8中未示出固定)。在其他实施方式中,可将发光串设置于槽型字的内侧壁上。通常,槽型字壳体252包括透光顶盖(由于其为透明的,在图8的俯视图中不可见)。透光顶盖可为有色的或无色(clear)的,并且可选地是半透明的或部分反射的以提供一些光散射。
在每一个发光组件8、8′、8″、88和发光组件模块188中,独立式热塑性材料或其他高导热材料重叠模塑件30、32、60、130、230提供了重量轻且有效的散热路径,用于将由LED 12、212和可选的其他部件22、222产生的热传递至外部环境和/或导热装配表面中(发光组件置于其上)。由于LED 12、212优选为通常在接近100℃的温度下工作的高亮度LED,独立式热塑性材料或其他高导热材料重叠模塑件30、32、60、130、230应具有大于大约100℃的熔化温度从而确保在发光组件工作过程中热塑性材料不会熔解。如果重叠模塑件30、32、60、130、230的高导热材料是热固性材料,那么在完成热固化过程后,该热固性材料在达到大约100℃下应该是热稳定的。
同时,LED 12、212以及可选的其他部件22、222,或与其相关的特征,例如荧光涂覆、焊接、热超声(thermosonic)、或其他结合,等等,通常是温度敏感的。由于重叠模塑通常是在连接这些热敏部件之后进行的,所以重叠模塑过程不应将这些部件暴露于过高的温度下。如果将嵌件注射模塑实施于重叠模塑件30、32、60、130、230,那么在嵌件模中熔解的重叠模塑材料应在大于约100℃的温度下(为了被熔解,即,在液相或其他低粘度相中)并且在小于发光组件元件的损害温度阈(damagetemperature threshold)的温度下。损害温度阈是由将损害发光组件的热敏元件的最低温度确定。取决于温度限制元件,这个温度的上限通常是几百摄氏度至大约500℃或者在一些实施方式中更高。
导热的热塑性材料,例如在310℃与350℃之间熔解的实例Therma-TechTM热塑性材料,对于用作重叠模塑件30、32、60、130、230的高导热材料是有利的,因为它们的熔解温度足够高以避免热塑性材料在LED工作温度下再流,而其熔解温度也足够低以使高导热重叠模塑件30、32、60、130、230的注射模塑或其他形式能够进行,而不损害发光组件的温度敏感元件。因为热塑性材料不需要加热以引发热固性化学反应,所以将热塑性材料熔解以进行嵌件注射模塑不产生伴随的化学反应,并因而热塑性材料的熔点通常相对较低。
相反,热固性材料在嵌件模中趋向于被赋予较高的温度,从而热启动聚合物交联或其他热固化学反应。然而,如果热固温度低于发光组件的损害温度阈,导热的热固性材料也可用于高导热材料重叠模塑件30、32、60、130、230。
已参照优选实施方式描述了本发明。显然,其他人通过阅读和理解前面的详细描述将想到多种修改和变更。本发明意欲解释为包括所有这些修改和变更,只要它们在所附权利要求或其等同物的范围内。
Claims (21)
1.一种制造发光组件的方法,所述方法包括:
将一个或多个发光二极管(LED)连接至印刷电路板,所述连接的发光二极管(LED)可通过所述印刷电路板的电路与电源连接;以及
将重叠模塑材料嵌件模塑在所述印刷电路板的邻近所述发光二极管(LED)的至少多个部分上,所述重叠模塑材料具有大于约100℃的熔解温度并且具有大于或约为1W/m·K的导热系数。
2.根据权利要求1所述的方法,其中,所述嵌件模塑包括:将具有所述连接的发光二极管(LED)的所述印刷电路板放置于模具中;
将熔解形式的所述重叠模塑材料注射入所述模具中,熔解的所述重叠模塑材料在所述模具中固化以形成固定于所述印刷电路板的邻近所述LED的至少多个部分的重叠模塑件;以及
在所述固化之后,将具有所述固定的热塑性重叠模塑件的所述印刷电路板从所述模具中移出。
3.根据权利要求2所述的方法,其中,所述模具具有隔离区,所述隔离区用于在具有所述连接的发光二极管(LED)的所述印刷电路板置于所述模具中时容纳所述发光二极管(LED),所述隔离区用于至少防止所述发光二极管(LED)的光输出孔隙在注射所述重叠模塑材料期间被所述重叠模塑材料覆盖。
4.根据权利要求2所述的方法,其中,所述重叠模塑材料选自由热塑性材料和热固性材料组成的组中。
5.根据权利要求2所述的方法,其中,所述重叠模塑材料具有大于或约为10W/m·K的导热系数。
6.根据权利要求1所述的方法,其中,所述重叠模塑材料具有大于或约为10W/m·K的导热系数。
7.根据权利要求1所述的方法,其中,所述连接包括:连接一个或者多个发光二极管至不包括金属芯的印刷电路板。
8.根据权利要求1所述的方法,其中,所述连接包括:连接一个或者多个发光二极管至包括金属芯的印刷电路板。
9.根据权利要求1所述的方法,其中,所述嵌件模塑包括:将所述重叠模塑材料嵌件模塑在所述印刷电路板的邻近所述发光二极管(LED)的至少多个部分上,而所述重叠模塑材料不覆盖一个或者多个所述发光二极管(LED)的光输出孔隙。
10.根据权利要求9所述的方法,其中,所述发光二极管(LED)的光输出孔隙包括所述发光二极管(LED)的透镜。
11.根据权利要求9所述的方法,其中,所述发光二极管(LED)的光输出孔隙包括置于每个所述发光二极管(LED)之上的透光盖。
12.根据权利要求1所述的方法,其中,所述嵌件模塑包括:将所述重叠模塑材料嵌件模塑在所述印刷电路板的两个主表面上。
13.根据权利要求12所述的方法,其中,所述连接和所述嵌件模塑被重复多次,以产生多个发光组件,每个所述发光组件包括一个或多个连接至印刷电路板的发光二极管(LED),所述印刷电路板由独立式高导热材料重叠模塑件覆盖在所述印刷电路板的两个主表面,所述方法还包括:在所述嵌件模塑之前,将所述发光组件的所述印刷电路板电地和机械地连接至挠性电缆,所述挠性电缆包括多条挠性导线以及在挠性导线周围的绝缘层。
14.根据权利要求1所述的方法,其中,所述连接和所述嵌件模塑产生一个发光组件,所述发光组件包括一个或多个连接至印刷电路板的发光二极管(LED),所述印刷电路板由独立式高导热材料重叠模塑件覆盖在所述印刷电路板的两个主表面。
15.一种制造发光组件的方法,所述方法包括:
将一个或多个发光二极管(LED)连接至印刷电路板,连接的所述一个或多个LED可通过所述印刷电路板的电路与电源连接;以及
将热塑性材料再流经过所述印刷电路板的邻近所述一个或多个LED的至少多个部分上,所述热塑性材料具有大于约100℃的熔解温度并且具有大于或约为1W/m·K的导热系数。
16.根据权利要求15所述的方法,其中,所述再流包括:
将所述热塑性材料嵌件注射模塑在所述印刷电路板的邻近所述一个或多个LED的至少多个部分上。
17.根据权利要求16所述的方法,其中,所述嵌件注射模塑包括:加热热塑性材料,而没有伴随的化学反应,从而产生熔解的热塑性材料。
18.根据权利要求15所述的方法,其中,所述热塑性材料具有大于或约为10W/m·K的导热系数。
19.根据权利要求15所述的方法,其中,所述连接和所述再流生产出一个发光组件,所述发光组件包括一个或多个连接至印刷电路板的发光二极管(LED),所述印刷电路板具有独立式高导热材料重叠模塑件,所述独立式高导热材料包括再流经过所述印刷电路板的邻近所述一个或多个LED的至少多个部分上的所述热塑性材料。
20.一种方法,包括:
将一个或多个发光二极管(LED)连接至印刷电路板,连接的所述LED可通过所述印刷电路板的电路与电源连接;以及
将具有所述连接的发光二级管(LED)的所述印刷电路板放置到模具中;
将熔解形式的所述重叠模塑材料注射入所述模具中,熔解的所述重叠模塑材料在所述模具中固化以形成固定于所述印刷电路板的邻近所述LED的至少多个部分的重叠模塑件;以及
在所述固化之后,将发光组件从所述模具中移出,所述发光组件包括连接至所述印刷电路板的一个或多个发光二极管(LED),所述印刷电路板具有固定于所述印刷电路板的邻近所述LED的至少多个部分的重叠模塑件,所述重叠模塑件是独立式的并且具有大于约100℃的熔解温度并且具有大于或约为1W/m·K的导热系数。
21.根据权利要求20所述的方法,其中,所述连接、所述放置、所述注射和所述移出被重复多次以形成多个所述发光组件,并且所述方法进一步包括:在所述连接、所述放置、所述注射和所述移除之前,将所述发光组件的所述印刷电路板电地和机械地连接至挠性电缆,所述挠性电缆包括多条挠性导线以及在挠性导线周围的绝缘层。
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US9585239B2 (en) | 2017-02-28 |
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US10091867B2 (en) | 2018-10-02 |
US8465175B2 (en) | 2013-06-18 |
CN101317034A (zh) | 2008-12-03 |
US20120066900A1 (en) | 2012-03-22 |
US9872377B2 (en) | 2018-01-16 |
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