CN102558871A - 自粘性硬化剂组合物 - Google Patents
自粘性硬化剂组合物 Download PDFInfo
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- CN102558871A CN102558871A CN2011103307018A CN201110330701A CN102558871A CN 102558871 A CN102558871 A CN 102558871A CN 2011103307018 A CN2011103307018 A CN 2011103307018A CN 201110330701 A CN201110330701 A CN 201110330701A CN 102558871 A CN102558871 A CN 102558871A
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- 239000000203 mixture Substances 0.000 title claims abstract description 59
- 239000004848 polyfunctional curative Substances 0.000 title claims abstract description 27
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- 239000003054 catalyst Substances 0.000 claims abstract description 16
- 238000004132 cross linking Methods 0.000 claims abstract description 13
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 13
- 150000001875 compounds Chemical class 0.000 claims abstract description 7
- 229910052784 alkaline earth metal Inorganic materials 0.000 claims abstract description 5
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims abstract description 4
- 150000001342 alkaline earth metals Chemical class 0.000 claims abstract description 4
- 150000004679 hydroxides Chemical class 0.000 claims abstract description 4
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- 229910052783 alkali metal Inorganic materials 0.000 claims description 3
- 150000001340 alkali metals Chemical class 0.000 claims description 3
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- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 7
- 150000003961 organosilicon compounds Chemical class 0.000 description 7
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
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- 229930195733 hydrocarbon Natural products 0.000 description 4
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- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 3
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 3
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- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
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- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 2
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- 229910052710 silicon Inorganic materials 0.000 description 2
- ZQZCOBSUOFHDEE-UHFFFAOYSA-N tetrapropyl silicate Chemical compound CCCO[Si](OCCC)(OCCC)OCCC ZQZCOBSUOFHDEE-UHFFFAOYSA-N 0.000 description 2
- 150000003606 tin compounds Chemical class 0.000 description 2
- 150000003609 titanium compounds Chemical class 0.000 description 2
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 2
- JCGDCINCKDQXDX-UHFFFAOYSA-N trimethoxy(2-trimethoxysilylethyl)silane Chemical compound CO[Si](OC)(OC)CC[Si](OC)(OC)OC JCGDCINCKDQXDX-UHFFFAOYSA-N 0.000 description 2
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- 238000004073 vulcanization Methods 0.000 description 2
- 125000006017 1-propenyl group Chemical group 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- KXDHJXZQYSOELW-UHFFFAOYSA-M Carbamate Chemical compound NC([O-])=O KXDHJXZQYSOELW-UHFFFAOYSA-M 0.000 description 1
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 1
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- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
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- 229920002367 Polyisobutene Polymers 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical group CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 125000002777 acetyl group Chemical group [H]C([H])([H])C(*)=O 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 125000004423 acyloxy group Chemical group 0.000 description 1
- 125000003342 alkenyl group Chemical group 0.000 description 1
- 125000003302 alkenyloxy group Chemical group 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 125000003368 amide group Chemical group 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 125000002344 aminooxy group Chemical group [H]N([H])O[*] 0.000 description 1
- 125000005428 anthryl group Chemical group [H]C1=C([H])C([H])=C2C([H])=C3C(*)=C([H])C([H])=C([H])C3=C([H])C2=C1[H] 0.000 description 1
- 125000003710 aryl alkyl group Chemical group 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 125000000043 benzamido group Chemical group [H]N([*])C(=O)C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
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- 230000007797 corrosion Effects 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- 125000000582 cycloheptyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
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- 125000001033 ether group Chemical group 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
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- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 1
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- 239000004611 light stabiliser Substances 0.000 description 1
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- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 1
- 125000003136 n-heptyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001280 n-hexyl group Chemical group C(CCCCC)* 0.000 description 1
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 125000001971 neopentyl group Chemical group [H]C([*])([H])C(C([H])([H])[H])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000012860 organic pigment Substances 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
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- 125000005646 oximino group Chemical group 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 125000005561 phenanthryl group Chemical group 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 125000003808 silyl group Chemical group [H][Si]([H])([H])[*] 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 230000002269 spontaneous effect Effects 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 125000001973 tert-pentyl group Chemical group [H]C([H])([H])C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- UQMOLLPKNHFRAC-UHFFFAOYSA-N tetrabutyl silicate Chemical compound CCCCO[Si](OCCCC)(OCCCC)OCCCC UQMOLLPKNHFRAC-UHFFFAOYSA-N 0.000 description 1
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 1
- JCVQKRGIASEUKR-UHFFFAOYSA-N triethoxy(phenyl)silane Chemical compound CCO[Si](OCC)(OCC)C1=CC=CC=C1 JCVQKRGIASEUKR-UHFFFAOYSA-N 0.000 description 1
- GYTROFMCUJZKNA-UHFFFAOYSA-N triethyl triethoxysilyl silicate Chemical compound CCO[Si](OCC)(OCC)O[Si](OCC)(OCC)OCC GYTROFMCUJZKNA-UHFFFAOYSA-N 0.000 description 1
- 125000005023 xylyl group Chemical group 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/544—Silicon-containing compounds containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/10—Metal compounds
- C08K3/105—Compounds containing metals of Groups 1 to 3 or of Groups 11 to 13 of the Periodic Table
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
- C08K5/098—Metal salts of carboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
- C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
- C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxyl groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Sealing Material Composition (AREA)
- Silicon Polymers (AREA)
Abstract
用于缩合交联的RTV-2聚硅氧烷组合物的硬化剂组合物，其包含：(A)至少一种交联剂；(B)至少一种选自以下组中的交联催化剂：碱金属和碱土金属的除了其氢氧化物以外的化合物；(C)至少一种作为粘结助剂的官能硅烷。
Description
技术领域
本发明涉及自粘性硬化剂组合物。
背景技术
在现有技术中早就已知双组分(2K)聚硅氧烷组合物，其通常在各种不同的应用中用作粘合剂和密封剂。在室温下交联的双组分聚硅氧烷称作“室温硫化2部分聚硅氧烷”(RTV-2)。这两种组分之一通常称作聚合物组合物或者称作A组分。第二组分通常称作硬化剂组合物或者还称作B组分。
该配制品典型地包含作为交联催化剂的锡化合物，其在室温下催化聚合物被交联剂组分的交联(缩聚作用)，例如在Walter Noll的Chemistryand Technology of Silicones，1968年，第2版，第395页及其后中所述。
虽然缩聚反应即使在不使用催化剂的情况下也可以进行，但是需要催化剂从而可以在可接受的期限内进行交联。该催化剂通常是基于重金属，通常是有机锡化合物。近来对于该有机锡化合物的潜在风险的越来越强调的讨论以及锡化合物还促进逆反应(逆转)的已知能力致使需要寻找替代性的催化剂。然而，以前的对于解决方案的尝试表明，替代性催化剂的反应性不足，或者使该组合物不具有存储稳定性。因此，羧酸铋连同氨基官能的烷氧基硅烷倾向于形成胶体状Bi(0)沉淀物，导致可使用的活性Bi(III)的量减少，并因此无法获得存储稳定性。
钛催化的单组分缩合组合物是现有技术，例如在WO 01/49774A2中所述，但是不可用于双组分体系，这是因为钛化合物导致在此使用的α，ω-二羟基官能的聚合物的自发硫化。此外，钛化合物被含胺化合物严重抑制，这排除了自粘性组合物的配制品。
其他的金属化合物例如锌或铝的乙酰丙酮化物在用作催化剂时导致反应性端基的官能化，即交联的并发反应，这导致转化成RTV-1机制。
作为不含锡的替代性方案，在WO 2009/080266中使用煅烧高岭土作为催化剂，在EP 0 933 398A中还连同碱性组分一起使用。因为高岭土是以分散的形式存在，并且在WO 2009/080266中以每100份聚合物3至400份的量使用，所以产生无法制造透明组合物的缺点。
发明内容
因此，本发明的目的在于提供用于2K聚硅氧烷组合物的硬化剂组合物，其不含在有害物质法律意义上成问题的催化剂，并且此外还具有自粘性。用于此目的的粘结助剂(Haftvermittler)不得抑制该催化剂。此外，应当实现对于工业加工典型的储存期，并且在储存之后不应发生反应性损失。
该目的是通过根据本发明用于缩合交联的RTV-2聚硅氧烷组合物的硬化剂组合物实现的，其包含
(A)至少一种交联剂，
(B)至少一种选自以下组中的交联催化剂：碱金属和碱土金属的除了其氢氧化物以外的化合物，
(D)至少一种作为粘结助剂的官能硅烷。
根据本发明的硬化剂组合物连同聚合物组合物一起用作在RTV-2体系中的第二组分。用于RTV-2体系的该聚合物组合物是本领域技术人员早就已知的。其通常包含羟基封端的聚二甲基硅氧烷作为可交联的聚合物，通常包含三甲基甲硅烷基封端的聚二甲基硅氧烷作为增塑剂组分，此外还包含增强性或非增强性填料，如二氧化硅、炭黑、石英、白垩、硅藻土等。此外任选使用组分如热稳定剂、用于优化流变性或特定性质的添加剂、杀真菌剂。
根据本发明使用的交联剂(A)优选为通式(I)的有机硅化合物及其部分水解产物
ZcSiR2 (4-c) (I)，
其中，
R2可相同或不同且彼此独立地代表任选被卤素取代的、可被氧原子间隔的单价烃基，
Z可相同或不同且彼此独立地代表可水解基团，及
c等于3或4。
在此，部分水解产物可以是部分同元水解产物，即一种类型的通式(I)的有机硅化合物的部分水解产物，还可以是部分共水解产物，即至少两种不同类型的通式(I)的有机硅化合物的部分水解产物。根据本发明的交联剂或部分水解产物的最大重均Mw为1200g/mol。
虽然在式(I)中没有表明，但是根据本发明使用的有机硅化合物可以根据制备方法而具有少量羟基，优选最多至所有Si键结基团的5％。
若用于本发明组合物中的交联剂(A)是式(I)的有机硅化合物的部分水解产物，则其优选具有最多10个硅原子。
基团R2优选为具有1至18个碳原子的单价烃基，其任选被卤原子、醚基或(聚)二醇基取代，其中(聚)二醇基由环氧乙烷和/或环氧丙烷单元组成。但是，基团R2还可以是例如将两个甲硅烷基相互连接的二价基团。
基团R2的例子是烷基，如甲基、乙基、正丙基、异丙基、1-正丁基、2-正丁基、异丁基、叔丁基、正戊基、异戊基、新戊基、叔戊基；己基，如正己基；庚基，如正庚基；辛基，如正辛基和异辛基，如2，2，4-三甲基戊基；壬基，如正壬基；癸基，如正癸基；十二烷基，如正十二烷基；十八烷基，如正十八烷基；环烷基，如环戊基、环己基、环庚基和甲基环己基；烯基，如乙烯基、1-丙烯基和2-丙烯基；芳基，如苯基、萘基、蒽基和菲基；烷芳基，如邻-、间-、对-甲苯基；二甲苯基和乙苯基；和芳烷基，如苯甲基、α-和β-苯乙基。
被氧间隔的基团R2的例子是甲氧基乙基、乙氧基乙基和乙氧基乙氧基乙基。
二价基团R2的例子是聚异丁烯二基和丙烷二基封端的聚丙二醇基。
对于基团R2，优选具有1至12个碳原子的烃基，特别优选甲基和乙烯基。
Z的例子是所有目前已知的可水解基团，例如经由氧原子或氮原子键结在硅原子上的、任选经取代的烃基。
基团Z优选为-OR1基团，其中R1代表经取代或未经取代的、可被氧原子间隔的烃基。Z的例子是甲氧基、乙氧基、正丙氧基、异丙氧基、正丁氧基、异丁氧基、仲丁氧基、叔丁氧基和2-甲氧基乙氧基；氨基，如甲基氨基、二甲基氨基、乙基氨基、二乙基氨基和环己基氨基；酰胺基，如N-甲基-乙酰氨基和苯甲酰胺基；氨氧基，如二乙基氨氧基；肟基，如二甲基酮肟基、甲基乙基酮肟基和甲基异丁基酮肟基，以及烯氧基，如2-丙烯氧基，和酰氧基，如乙酰基。
用于本发明组合物中的交联剂(A)优选为四甲氧基硅烷、四乙氧基硅烷、四丙氧基硅烷、四丁氧基硅烷、甲基三甲氧基硅烷、甲基三乙氧基硅烷、乙烯基三甲氧基硅烷、乙烯基三乙氧基硅烷、苯基三甲氧基硅烷、苯基三乙氧基硅烷、1，2-双(三甲氧基甲硅烷基)乙烷、1，2-双(三乙氧基甲硅烷基)乙烷，以及所述有机硅化合物的部分水解产物，例如六乙氧基二硅氧烷。
用于本发明组合物中的交联剂(A)特别优选为四乙氧基硅烷、四丙氧基硅烷、甲基三甲氧基硅烷、甲基三乙氧基硅烷、乙烯基三甲氧基硅烷、乙烯基三乙氧基硅烷、苯基三甲氧基硅烷、1，2-双(三甲氧基甲硅烷基)乙烷、1，2-双(三乙氧基甲硅烷基)乙烷及其部分水解产物，特别是四乙氧基硅烷、1，2-双(三乙氧基甲硅烷基)乙烷、乙烯基三甲氧基硅烷、乙烯基三乙氧基硅烷及其部分水解产物和共水解产物。
在本发明硬化剂组合物中使用的交联剂(A)是市售产品或者可以根据硅化学中已知的方法制得。
根据本发明的交联剂(A)的使用量为基于待交联成分的端基含量至少2倍摩尔量过量的可水解或经水解的交联剂官能团。优选调节交联剂官能团与待交联基团的摩尔比为2∶1至10∶1。
使用碱金属和碱土金属的除了其氢氧化物以外的化合物作为根据本发明的催化剂(B)。
作为催化剂(B)优选锂的化合物。特别优选为对应的羧酸盐。
根据本发明的硬化剂组合物包含对于缩合反应常用的量的催化剂(B)。在即用型RTV-2混合物(硬化剂组合物+聚合物组合物)中，均基于金属，在锂化合物的情况下以在50至1,000ppm的范围内的量存在。特别优选在100至500ppm的范围内。
根据本发明的硬化剂组合物包含粘结助剂(D)作为额外的组分。其被视为官能硅烷或偶联剂，并且区别于组分(A)。用于本发明组合物中的粘结助剂(D)的例子是具有官能基团的硅烷和有机聚硅氧烷，例如具有缩水甘油醚氧基、氨基或甲基丙烯酰氧基者。此外，具有可水解基团和SiC键结的乙烯基、丙烯酰氧基、甲基丙烯酰氧基、环氧基、酸酐基、酸基、酯基、氰尿酸酯基、氨基甲酸酯基或酰脲基官能基团的硅烷及其部分水解产物和共水解产物也可用作粘结助剂(D)。粘结助剂优选为具有可水解基团的、氨基、丙烯酰基、环氧基、氰尿酸酯基、氨基甲酸酯基或酰脲基官能的硅烷及其部分水解产物。(D)的含量优选使得每100重量份经催化的、即用型RTV-2混合物(＝硬化剂组合物+聚合物组合物)包含优选最多50重量份、特别优选0.1至20重量份、尤其是0.25至10重量份的(D)。
此外，将组分(C)加入所述硬化剂组合物作为其他的成分，从而可以更容易地调节RTV-2体系中硬化剂组合物与聚合物组合物的混合比例，并使所有成分可混溶。由此，组分(C)用于增加所述硬化剂组合物的体积，这可以更好地控制混合过程中的计量，并且确保混合物的均匀性。
使用直链或分支的有机硅化合物或有机聚合物或非挥发性烃类作为增量聚合物(C)。
此外，所述硬化剂组合物还可包含本领域技术人员早就已知的其他成分(E)。可用于本发明组合物的(E)的例子是填料如增强性和非增强性填料、增塑剂、可溶性染料、无机和有机颜料、溶剂、杀真菌剂、芳香剂、分散助剂、流变性添加剂、腐蚀抑制剂、氧化抑制剂、光稳定剂、热稳定剂、阻燃剂和用于影响电学性质的试剂。
使用根据本发明的硬化剂组合物作为缩合交联的RTV-2聚硅氧烷组合物中的组分。在各种不同的应用中，该缩合交联的RTV-2聚硅氧烷组合物例如又用作粘合剂和密封剂。该组合物还可用于电学或电子元件的封装、涂布或绝缘。
具体实施方式
实施例
在下述的实施例中，除非另有说明，所有的份数和百分比数据均是基于重量。除非另有说明，以下实施例均是在环境大气压力下，即约1000hPa下，及在室温下，即约20℃下，或者在未额外加热或冷却的情况下在室温下将反应物组合在一起所达到的温度下实施的。下面所有的粘度数据均是基于在20℃的温度及1s-1的剪切速率下的动态粘度。以下实施例用于阐述本发明，在此没有任何限制性的作用。
使用以下缩写：
Shore A 根据DIN 53505的硬度
EB 根据DIN 53504-85S1以百分比计的断裂伸长率
UTS 根据DIN 53504-85S1以N/mm2计的极限拉伸强度
实施例1：聚合物组合物
作为聚合物组合物，使用ELASTOSIL
RT 774，可商购自WackerChemie股份公司，慕尼黑。
硬化剂组合物的实施例
实施例2：(非本发明)
作为用于比较例的硬化剂组合物，使用硬化剂T77，可商购自WackerChemie股份公司，慕尼黑。
实施例3(根据本发明)
将15份粘度为1000mPa·s的三甲基甲硅烷基封端的聚二甲基硅氧烷和30份乙烯基封端的聚二甲基硅氧烷与20份部分水解的硅酸四乙酯TES40(Wacker Chemie股份公司)、5份g-氨基丙基三乙氧基硅烷、5份N-氨基乙基氨基丙基三甲氧基硅烷和15份Oktasoligen Li 2(购自Borchers，Monheim)，以获得均匀的混合物。
实施例4(根据本发明)
将30份包含30％的T单元和70％的D单元且重均分子量为2800g/mol的不含羟基的树脂组分与18份部分水解的硅酸四乙酯TES40、20份g-氨基丙基三乙氧基硅烷、7份Ensacko MS炭黑(购自Timcal，Düsseldorf)和25份Oktasoligen Li 2(购自Borchers，Monheim)混合以获得均匀的混合物。
实施例5(根据本发明)
将30份包含30％的T单元和70％的D单元且重均分子量为2800g/mol的不含羟基的树脂组分与30份部分水解的硅酸四乙酯TES40、15份g-氨基丙基三乙氧基硅烷和25份Oktasoligen Li 2(购自Borchers，Monheim)混合以获得均匀的混合物。
实施例6(根据本发明)
将25份包含30％的T单元和70％的D单元且重均分子量为2800g/mol的不含羟基的树脂组分与20份部分水解的硅酸四乙酯TES40、20份g-氨基丙基三乙氧基硅烷、10份炭黑(Ensacko MS)均匀化以获得立得住的(standfest)膏状物，并与25份Oktasoligen Li 2(购自Borchers，Monheim)混合。
来自实施例1的聚合物组合物与来自实施例2至6的硬化剂组合物的各个混合比例均为9∶1。储存期被定义为直至超过1000Pa·s的时间，其是借助于锥-板式流变仪在D＝1.0s-1下测定的。
表1
| 实施例 | 2 | 3 | 4 | 5 | 6 |
| 储存期[min] | 10 | 20 | 60 | 40 | 60 |
| Shore A | 46 | 26 | 28 | 30 | 25 |
| UTS | 1.8 | 1.6 | 1.2 | 1.4 | 1.2 |
| EB | 200 | 250 | 310 | 250 | 350 |
表1列出了在混合两种RTV-2组分之后的储存期以及在硫化3天之后的弹性体特性。使用根据本发明的硬化剂组合物可以实现非常良好的储存期和良好的深度硫化，同时其他的弹性体特性同样完全满足对于该体系的要求。
Claims (5)
1.用于缩合交联的RTV-2聚硅氧烷组合物的硬化剂组合物，其包含
(A)至少一种交联剂，
(B)至少一种选自以下组中的交联催化剂：碱金属和碱土金属的除了其氢氧化物以外的化合物，
(D)至少一种作为粘结助剂的官能硅烷。
2.根据权利要求1的硬化剂组合物，其特征在于，(B)是锂化合物。
3.制备根据权利要求1或2的硬化剂组合物的方法，其是通过混合组分(A)、(B)和(D)实施的。
4.缩合交联的RTV-2聚硅氧烷组合物，其特征在于，两种组分之一是根据权利要求1或2的硬化剂组合物。
5.根据权利要求4的缩合交联的RTV-2聚硅氧烷组合物作为粘合剂和密封剂的用途。
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2011
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- 2011-10-17 US US13/274,399 patent/US8598294B2/en not_active Expired - Fee Related
- 2011-10-20 KR KR1020110107420A patent/KR101325890B1/ko not_active IP Right Cessation
- 2011-10-20 CN CN2011103307018A patent/CN102558871A/zh active Pending
- 2011-10-20 JP JP2011230788A patent/JP5442694B2/ja not_active Expired - Fee Related
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| CN1974669A (zh) * | 2005-06-23 | 2007-06-06 | 信越化学工业株式会社 | 自粘性有机聚硅氧烷组合物 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112805344A (zh) * | 2018-10-05 | 2021-05-14 | 中国涂料株式会社 | 防污涂料组合物、防污涂膜、以及带有防污涂膜的基材及其制造方法 |
| CN112805344B (zh) * | 2018-10-05 | 2022-06-17 | 中国涂料株式会社 | 防污涂料组合物、防污涂膜、以及带有防污涂膜的基材及其制造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20120041145A (ko) | 2012-04-30 |
| US20120101237A1 (en) | 2012-04-26 |
| JP5442694B2 (ja) | 2014-03-12 |
| JP2012087303A (ja) | 2012-05-10 |
| EP2444456A1 (de) | 2012-04-25 |
| KR101325890B1 (ko) | 2013-11-08 |
| US8598294B2 (en) | 2013-12-03 |
| EP2444456B1 (de) | 2013-07-03 |
| DE102010042712A1 (de) | 2012-04-26 |
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