CN102468190A - 一种封装模具及使用该模具的半导体封装工艺 - Google Patents

一种封装模具及使用该模具的半导体封装工艺 Download PDF

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CN102468190A
CN102468190A CN2010105568925A CN201010556892A CN102468190A CN 102468190 A CN102468190 A CN 102468190A CN 2010105568925 A CN2010105568925 A CN 2010105568925A CN 201010556892 A CN201010556892 A CN 201010556892A CN 102468190 A CN102468190 A CN 102468190A
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packaging
thimble
plastic
mould
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刘海
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Samsung Semiconductor China R&D Co Ltd
Samsung Electronics Co Ltd
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Samsung Semiconductor China R&D Co Ltd
Samsung Electronics Co Ltd
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Abstract

本发明提供了一种封装模具及使用该模具的半导体封装工艺，所述半导体封装工艺包括如下步骤：对需要在塑封表面开孔的位置，根据需要的开孔的大小，通过在塑封模具上设置相应的顶针，从而实现从塑封表面到基板的开孔。其中，实现从塑封表面到基板的开孔的步骤是通过在注入塑封料之后将设置有相应的顶针的模具分离而实现的。根据本发明的半导体封装工艺制造的半导体封装件，通过塑封模具的设计，即在塑封模具上设置相应的顶针，可省去通过激光打孔实现从塑封表面到基板的开孔的步骤，从而可提高每小时的产量(UPH)并降低半导体封装的成本。

Description

一种封装模具及使用该模具的半导体封装工艺
技术领域
本发明涉及一种封装模具及使用该模具的半导体封装工艺，更具体地讲，涉及一种封装模具及使用该模具在半导体封装件塑封表面形成开孔的工艺。
背景技术
消费者期望电子产品在各方面都比较紧凑，这也是主要电子产品日益缩小的主要动力。所以，终端产品的总体尺寸在不断地缩小，而这要利用较小的半导体封装来实现。因此，缩小封装是半导体封装行业的一个主要发展趋势。
堆叠封装是一种以较高集成度实现微型化的良好方式。堆叠封装可以分为封装内封装(package in package，PiP)与封装上封装(package on package，PoP)。PoP产品由两个封装件堆叠而成，即，一个封装件在另一个封装件的上方，用焊球将两个封装件结合。半导体行业对PoP封装件的需求不断在增长，因为这种技术具有成本低、封装尺寸较小及组装灵活等优点。这种技术在促进封装小型化和更高的封装密度的同时，具有技术和商业方面的灵活性。PoP封装的主要优势在于：较高的晶圆利用率扩展了功能，有助于在移动设备中实现更多的功能；占用较少的基板空间；较短的互联实现了更快的数据传输速率；较小的尺寸与较少的重量减小了电路板面积；提供了设计灵活性；信号在芯片间传输速度快；制造过程的每个环节都可节约成本。
目前PoP主要有两种实现方式，传统的是上面一个封装件100设置在下面一个封装件200上，且封装件100与封装件200通过焊球302实现电气互连，如图1所示。图2所示的是另外一种PoP的结构，其中，通过在塑封表面激光打孔形成通孔24，然后在通孔24中填充导电材料，再将上面一层封装件21堆叠到下面的封装件22的上面，通过焊球23、通孔24中的导电材料及焊盘25实现上封装件21与下封装件22的电气互连。
采用图1所示的PoP对于下面一层芯片比较厚的情况，比较难实现，同时下面一层封装的PCB也需要特别的设计。采用图2所示的PoP，不存在这个问题，但是通孔24的形成要通过激光打孔来实现，多一道工序，因而制造成本也相对较高。
发明内容
本发明的目的在于提供一种封装模具及使用该模具的半导体封装工艺。更具体地讲，本发明提供一种封装模具及使用该模具在半导体封装件塑封表面形成开孔的工艺。所述半导体封装工艺可包括如下步骤：对需要在塑封表面开孔的位置，根据需要的开孔的大小，可通过在塑封模具上设置相应的顶针，从而实现从塑封表面到基板的开孔。
根据本发明的一方面，实现从塑封表面到基板的开孔的步骤是通过在注入塑封料之后将设置有相应的顶针的模具分离而实现的。
根据本发明的一方面，顶针可利用弹簧通过螺栓固定于所述塑封模具中。
根据本发明的一方面，顶针可与塑封模具一体地形成。
根据本发明的半导体封装工艺制造的半导体封装件，通过塑封模具的设计，即在塑封模具上设置相应的顶针，可省去通过激光打孔实现从塑封表面到基板的开孔的步骤，从而可提高每小时的产量(UPH)并降低半导体封装的成本。
附图说明
通过下面结合附图对本发明进行的描述，本发明的上述和其他目的和特点将会变得更加清楚并容易理解，附图中：
图1为示出传统的PoP的封装结构的示意图；
图2为根据现有技术的利用激光打孔来形成通孔的PoP的封装结构的示意图；
图3是示出根据本发明的示例性实施例的设置有顶针的塑封模具的示意图；
图4是示出根据本发明的示例性实施例的顶针与塑封模具的连接结构的示意图；
图5是示出根据本发明的示例性实施例的顶针与塑封模具的连接结构的另一示意图；
图6是示出根据本发明的示例性实施例的顶针与塑封模具的另一连接结构的示意图；
图7是示出根据本发明的示例性实施例的通过在塑封模具上设置的顶针实现从塑封表面到基板的开孔的示意图；
图8是示出根据本发明的示例性实施例的通过在塑封模具上设置的顶针实现从塑封表面到基板的开孔的封装件的示意图。
具体实施方式
在下文中参照附图更充分地描述了本发明，在附图中示出了本发明的示例性实施例。然而，本发明可以以许多不同的形式来实施，且不应该解释为局限于在这里所提出的示例性实施例。相反，提供这些实施例使得本公开将是彻底和完全的，并将本发明的范围充分地传达给本领域技术人员。在附图中，为了清晰起见，会夸大层和区域的尺寸和相对尺寸。
图3是示出根据本发明的示例性实施例的设置有顶针的塑封模具的示意图。
参照图3，根据本发明的示例性实施例的塑封模具包括上模具31和下模具34。上模具31上设置有顶针33，对需要在塑封表面开孔的位置，可根据需要的开孔的大小，设计顶针33的位置和尺寸。这里，塑封表面指在半导体封装工艺中，在塑封模具中注入塑封材料后形成的塑封材料的表面。顶针33可通过弹簧32固定在塑封模具中。然而，本发明不限于此，例如，顶针33可通过其它方式固定于塑封模具中。虽然图3中示出了4个顶针，然而，本发明不限于此，即，可根据实际需要设置顶针的数量。
图4是示出根据本发明的示例性实施例的顶针与塑封模具的连接结构的示意图，图5是示出根据本发明的示例性实施例的顶针与塑封模具的连接结构的另一示意图。
参照图4和图5，弹簧42的一端可与顶针43通过例如焊接等的方式结合，弹簧42的另一端可与螺栓41通过例如焊接等的方式结合，然后将螺栓41拧入在塑封模具51中预先形成的孔中，从而实现顶针33与塑封模具51的连接。然而，本发明不限于此，例如，顶针33可通过其它方式实现与塑封模具51的连接。利用弹簧42的弹性可确保顶针与基板的良好接触，所述基板可以是例如印刷电路板(PCB)，但本发明不限于此。
图6是示出根据本发明的示例性实施例的顶针63与塑封模具61的另一连接结构的示意图。如图6所示，作为顶针63与塑封模具61的另一连接方式，顶针63可与塑封模具61一体地形成，而没有如图4和图5中所示的弹簧42和螺栓41的连接。
图7是示出根据本发明的示例性实施例的通过在塑封模具上设置的顶针实现从塑封表面到基板的开孔的示意图。
如图7所示，芯片76设置在基板(例如PCB)77上，其中，芯片76可通过引线键合(wire bonding)、倒装焊芯片(flip chip)或其他本领域常用的连接方式实现与基板的连接。顶针73可通过弹簧72固定于上模具71中，但本发明不限于此，例如顶针73可以以其他方式固定于上模具71中，例如，顶针73可以与上模具71一体地形成。将上模具71与下模具74对接以包封芯片76和基板77。然后，通过注入孔(未示出)将塑封料75注入塑封模具中的空间。之后，将上模具71与下模具74分离，从而实现从塑封表面到基板的开孔。图8示出了根据本发明的示例性实施例的通过在塑封模具上设置的顶针实现从塑封表面到基板的开孔的封装件，其中芯片86设置在基板87上，通过在塑封模具上设置的顶针实现从塑封表面到基板的通孔83。然后在通孔中填充导电材料，再将上面一层封装件堆叠到下面的封装件的上面，通过焊球、通孔中的导电材料及焊盘等实现上封装件与下封装件的电气互连。
通过塑封模具的设计，即在塑封模具上设置相应的顶针，可省去通过激光打孔实现从塑封表面到基板的开孔的步骤，从而可提高每小时的产量(UPH)并降低半导体封装的成本。
尽管已经参照本发明的示例性实施例具体示出并描述了本发明，但本领域技术人员应当理解的是，在不脱离由权利要求限定的本发明的精神和范围的情况下，可以对本发明作出各种形式和细节上的改变。

Claims (7)

1.一种塑封模具，所述塑封模具包括上模具和下模具，其特征在于，上模具中固定有顶针。
2.如权利要求1所述的塑封模具，其特征在于，所述顶针通过弹簧固定在上模具中。
3.如权利要求1所述的塑封模具，其特征在于，所述顶针与上模具一体地形成。
4.一种半导体封装工艺，其特征在于包括如下步骤：
对需要在塑封表面开孔的位置，根据需要的开孔的大小，通过在塑封模具上设置相应的顶针，从而实现从塑封表面到基板的开孔。
5.根据权利要求4所述的半导体封装工艺，其中，实现从塑封表面到基板的开孔的步骤是通过在注入塑封料之后将设置有相应的顶针的模具分离而实现的。
6.根据权利要求4所述的半导体封装工艺，其中，所述顶针利用弹簧通过螺栓固定于所述塑封模具中。
7.根据权利要求4所述的半导体封装工艺，其中，所述顶针与塑封模具一体地形成。
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