CN201259886Y - 一种顶针模块 - Google Patents
一种顶针模块 Download PDFInfo
- Publication number
- CN201259886Y CN201259886Y CNU2008200950038U CN200820095003U CN201259886Y CN 201259886 Y CN201259886 Y CN 201259886Y CN U2008200950038 U CNU2008200950038 U CN U2008200950038U CN 200820095003 U CN200820095003 U CN 200820095003U CN 201259886 Y CN201259886 Y CN 201259886Y
- Authority
- CN
- China
- Prior art keywords
- thimble
- ejector pin
- ring
- hole
- module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2008200950038U CN201259886Y (zh) | 2008-06-20 | 2008-06-20 | 一种顶针模块 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2008200950038U CN201259886Y (zh) | 2008-06-20 | 2008-06-20 | 一种顶针模块 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN201259886Y true CN201259886Y (zh) | 2009-06-17 |
Family
ID=40774122
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNU2008200950038U Expired - Fee Related CN201259886Y (zh) | 2008-06-20 | 2008-06-20 | 一种顶针模块 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN201259886Y (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102468190A (zh) * | 2010-11-12 | 2012-05-23 | 三星半导体(中国)研究开发有限公司 | 一种封装模具及使用该模具的半导体封装工艺 |
CN103681442A (zh) * | 2013-12-18 | 2014-03-26 | 大连佳峰电子有限公司 | 一种突上针磁性固定机构 |
CN110299303A (zh) * | 2018-03-23 | 2019-10-01 | 旺矽科技股份有限公司 | 芯片挑拣总成及芯片移动方法 |
CN115249758A (zh) * | 2022-09-22 | 2022-10-28 | 深圳市卓兴半导体科技有限公司 | 一种像素固晶机 |
-
2008
- 2008-06-20 CN CNU2008200950038U patent/CN201259886Y/zh not_active Expired - Fee Related
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102468190A (zh) * | 2010-11-12 | 2012-05-23 | 三星半导体(中国)研究开发有限公司 | 一种封装模具及使用该模具的半导体封装工艺 |
CN103681442A (zh) * | 2013-12-18 | 2014-03-26 | 大连佳峰电子有限公司 | 一种突上针磁性固定机构 |
CN110299303A (zh) * | 2018-03-23 | 2019-10-01 | 旺矽科技股份有限公司 | 芯片挑拣总成及芯片移动方法 |
CN110299303B (zh) * | 2018-03-23 | 2021-09-14 | 旺矽科技股份有限公司 | 芯片挑拣总成及芯片移动方法 |
CN115249758A (zh) * | 2022-09-22 | 2022-10-28 | 深圳市卓兴半导体科技有限公司 | 一种像素固晶机 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101323152B (zh) | 一种顶针模块、使用该模块分离晶片和蓝膜的方法 | |
CN201259886Y (zh) | 一种顶针模块 | |
CN102101259B (zh) | 水钻吸塑盘及其成型方法和成型设备 | |
CN106826624B (zh) | 真空吸附单元和真空吸附载台 | |
CN205190507U (zh) | 真空吸盘结构改良 | |
CN103862281A (zh) | 一种微小型零件的装配方法 | |
CN102254852B (zh) | 装片机顶针帽 | |
CN208819853U (zh) | 一种吸芯顶针机构 | |
CN107369642A (zh) | 一种能避免超薄芯片碎裂的吸取方法 | |
CN112386110A (zh) | 一种气泡水制造机 | |
CN205350020U (zh) | 一种新型真空吸盘 | |
KR101322516B1 (ko) | 다이 이젝팅 방법, 다이 이젝팅 유닛 및 이를 포함하는 다이 본딩 장치 | |
CN206223508U (zh) | 一种模杯分离式细胞制片机 | |
CN212385262U (zh) | 一种用于研磨机的物料吸取装置 | |
CN210392738U (zh) | 晶圆片翻转贴片机构 | |
CN206210764U (zh) | 半导体晶片顶起机构 | |
CN201907662U (zh) | 一种膜片吸放装置 | |
CN217933757U (zh) | 一种片状顶块座 | |
CN207537103U (zh) | 单管脱帽机 | |
CN206473872U (zh) | 一种苯氧乙酸固液分离消泡装置 | |
CN205609484U (zh) | 一种新型倒装芯片固晶机构 | |
KR20170030336A (ko) | 다이 이젝팅 장치 | |
CN206732472U (zh) | 一种瓶盖自动加垫机 | |
CN210325719U (zh) | 一种晶粒分选机构 | |
CN205990065U (zh) | 薄片上料装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: CAO XIANGMEI Free format text: FORMER OWNER: AITIEN ELECTROMECHANICAL (SHENZHEN) CO., LTD. Effective date: 20100108 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20100108 Address after: Room 323, West building, 3 floor, 4 Annwa Industrial Zone, Shenzhen, Guangdong, Che Kung Temple, China: 518034 Patentee after: Cao Xiangmei Address before: No. 1, first floor, building 2, AVIC Shahe Industrial Zone, Nanshan District overseas Chinese road, Guangdong, Shenzhen Province, China: 518055 Patentee before: ITM (Shenzhen) Limited |
|
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090617 Termination date: 20110620 |