CN102450109B - 光电子模块和用于制造光电子模块的方法 - Google Patents

光电子模块和用于制造光电子模块的方法 Download PDF

Info

Publication number
CN102450109B
CN102450109B CN201080023025.3A CN201080023025A CN102450109B CN 102450109 B CN102450109 B CN 102450109B CN 201080023025 A CN201080023025 A CN 201080023025A CN 102450109 B CN102450109 B CN 102450109B
Authority
CN
China
Prior art keywords
radiation
carrier substrates
optoelectronic module
emitted radiation
carrier substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201080023025.3A
Other languages
English (en)
Chinese (zh)
Other versions
CN102450109A (zh
Inventor
G.博格纳
S.格鲁贝尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Publication of CN102450109A publication Critical patent/CN102450109A/zh
Application granted granted Critical
Publication of CN102450109B publication Critical patent/CN102450109B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/183—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components mounted in and supported by recessed areas of the PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10515—Stacked components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Led Device Packages (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
CN201080023025.3A 2009-05-27 2010-04-28 光电子模块和用于制造光电子模块的方法 Expired - Fee Related CN102450109B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102009022901A DE102009022901A1 (de) 2009-05-27 2009-05-27 Optoelektronisches Modul und Verfahren zur Herstellung eines optoelektronischen Moduls
DE102009022901.9 2009-05-27
PCT/DE2010/000492 WO2010136006A1 (de) 2009-05-27 2010-04-28 Optoelektronisches modul und verfahren zur herstellung eines optoelektronischen moduls

Publications (2)

Publication Number Publication Date
CN102450109A CN102450109A (zh) 2012-05-09
CN102450109B true CN102450109B (zh) 2015-07-29

Family

ID=42558477

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201080023025.3A Expired - Fee Related CN102450109B (zh) 2009-05-27 2010-04-28 光电子模块和用于制造光电子模块的方法

Country Status (7)

Country Link
US (1) US8916900B2 (https=)
EP (1) EP2436242B1 (https=)
JP (1) JP2012528470A (https=)
KR (1) KR101675008B1 (https=)
CN (1) CN102450109B (https=)
DE (1) DE102009022901A1 (https=)
WO (1) WO2010136006A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6827295B2 (ja) * 2015-12-22 2021-02-10 シチズン電子株式会社 Ｌｅｄ発光装置
KR102801218B1 (ko) * 2019-08-30 2025-04-29 삼성전자주식회사 디스플레이 모듈 패키지
DE102024115867A1 (de) * 2024-06-06 2025-12-11 Ams-Osram International Gmbh Optoelektronisches bauteil mit einem optoelektronischen-halbleiterchip und einem dem optoelektronischen halbleiterchip zugeordneten zusatzchip

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02281976A (ja) 1989-04-24 1990-11-19 Sharp Corp Ｌｅｄプリンタヘッド
JPH04276649A (ja) 1991-03-04 1992-10-01 Hitachi Ltd 複合形半導体装置およびその実装構造体並びにその実装方法
JP2001203427A (ja) * 2000-01-20 2001-07-27 Canon Inc 波長多重面型発光素子装置、その製造方法およびこれを用いた波長多重伝送システム
JP2002231885A (ja) * 2001-02-06 2002-08-16 Mitsubishi Electric Corp 半導体装置
JP2004319530A (ja) * 2003-02-28 2004-11-11 Sanyo Electric Co Ltd 光半導体装置およびその製造方法
US20070257901A1 (en) * 2004-04-19 2007-11-08 Matsushita Electric Industrial Co., Ltd. Semiconductor chip for driving light emitting element, light emitting device, and lighting device
US20070295975A1 (en) * 2004-06-25 2007-12-27 Sanyo Electric Co., Ltd. Light-Emitting Device
DE102004064150B4 (de) * 2004-06-29 2010-04-29 Osram Opto Semiconductors Gmbh Elektronisches Bauteil mit Gehäuse mit leitfähiger Beschichtung zum ESD-Schutz
US7977698B2 (en) * 2005-03-18 2011-07-12 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. System and method for surface mountable display
CN100539219C (zh) * 2005-04-28 2009-09-09 皇家飞利浦电子股份有限公司 包括设置在凹部中的led的光源
DE102006004397A1 (de) 2005-09-30 2007-04-05 Osram Opto Semiconductors Gmbh Elektromagnetische Strahlung emittierendes optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements
JP2007312107A (ja) 2006-05-18 2007-11-29 Alps Electric Co Ltd 表面弾性波装置
DE102006025162B3 (de) * 2006-05-30 2008-01-31 Epcos Ag Flip-Chip-Bauelement und Verfahren zur Herstellung
US20080106251A1 (en) * 2006-11-03 2008-05-08 Cabral Roy Manuel Daylight-readable digital panel meter with auto-brightness adjusting led display
DE102007020475A1 (de) 2007-04-27 2008-11-06 Häusermann GmbH Verfahren zur Herstellung einer Leiterplatte mit einer Kavität für die Integration von Bauteilen und Leiterplatte und Anwendung
JP4912275B2 (ja) * 2007-11-06 2012-04-11 新光電気工業株式会社 半導体パッケージ
US20090173958A1 (en) * 2008-01-04 2009-07-09 Cree, Inc. Light emitting devices with high efficiency phospor structures
US20100059783A1 (en) * 2008-09-08 2010-03-11 Harry Chandra Light Emitting Chip Package With Metal Leads For Enhanced Heat Dissipation

Also Published As

Publication number Publication date
KR20120036892A (ko) 2012-04-18
JP2012528470A (ja) 2012-11-12
CN102450109A (zh) 2012-05-09
US20120056235A1 (en) 2012-03-08
EP2436242A1 (de) 2012-04-04
EP2436242B1 (de) 2013-01-09
KR101675008B1 (ko) 2016-11-10
US8916900B2 (en) 2014-12-23
DE102009022901A1 (de) 2010-12-02
WO2010136006A1 (de) 2010-12-02

Similar Documents

Publication Publication Date Title
JP5222509B2 (ja) 半導体装置
US20210057388A1 (en) Substrate assembly semiconductor package including the same and method of manufacturing the semiconductor package
TWI481001B (zh) 晶片封裝結構及其製造方法
US7679178B2 (en) Semiconductor package on which a semiconductor device can be stacked and fabrication method thereof
US11127341B2 (en) Light emitting module and display device
KR20070088177A (ko) 반도체 패키지 및 그 제조 방법
KR20040062764A (ko) 칩 스케일 적층 패키지
US20130015570A1 (en) Stacked semiconductor package and manufacturing method thereof
US20090310322A1 (en) Semiconductor Package
EP1908124A2 (en) Light-emitting module and mounting board used therefor
US7332803B2 (en) Circuit device
CN102450109B (zh) 光电子模块和用于制造光电子模块的方法
CN1206728C (zh) 芯片封装及其制造方法
KR20150014282A (ko) 반도체 칩 패키지 모듈 및 그 제조방법
KR20110055985A (ko) 스택 패키지
KR101046392B1 (ko) 반도체 패키지용 기판과, 이를 포함하는 반도체 패키지 및 이를 이용한 스택 패키지
KR20080077837A (ko) 탭용 테이프를 구비하는 패키지 온 패키지 형태의 반도체패키지
KR20040059741A (ko) 반도체용 멀티 칩 모듈의 패키징 방법
KR20030012192A (ko) 다이 적층형 윈도우 칩 스케일 패키지
JPH06216492A (ja) 電子装置
KR100788340B1 (ko) 반도체 패키지
KR20070087765A (ko) 적층형 패키지 및 그 제조 방법
KR100708050B1 (ko) 반도체패키지
KR100252861B1 (ko) 적층형 반도체 패키지 및 그의 어셈블리 방법
KR101363108B1 (ko) 다층구조 인쇄회로기판

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20150729

CF01 Termination of patent right due to non-payment of annual fee