JP2012528470A - オプトエレクトロニクスモジュールおよびオプトエレクトロニクスモジュールの製造方法 - Google Patents
オプトエレクトロニクスモジュールおよびオプトエレクトロニクスモジュールの製造方法 Download PDFInfo
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- JP2012528470A JP2012528470A JP2012512198A JP2012512198A JP2012528470A JP 2012528470 A JP2012528470 A JP 2012528470A JP 2012512198 A JP2012512198 A JP 2012512198A JP 2012512198 A JP2012512198 A JP 2012512198A JP 2012528470 A JP2012528470 A JP 2012528470A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/10515—Stacked components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10674—Flip chip
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10977—Encapsulated connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/049—Wire bonding
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
Claims (15)
- 放射出力半導体素子(1)と電気素子(2)と支持基板(3)を備えたオプトエレクトロニクスモジュールにおいて、
前記支持基板(3)は上面(31)と下面(33)を有しており、
前記下面(33)には第1の電気端子(8)が、前記上面(31)には第2の電気端子(5a,5b,6a,6b,7a,7b)が配置されており、
前記電気素子(2)は、前記支持基板(3)の上面(31)に配置されていて、前記第1の電気端子(8)と導電接続されており、
前記放射出力半導体素子(1)は、前記電気素子(2)の、前記支持基板(3)とは反対側に配置されており、
前記放射出力半導体素子(1)は導体構造部(4a,4b)を備え、該導体構造部(4a,4b)は前記第2の電気端子(5a,5b,6a,6b,7a,7b)と導電接続されていることを特徴とする、
オプトエレクトロニクスモジュール。 - 前記支持基板(3)は配線板であり、前記放射出力半導体素子(1)はLEDであり、前記電気素子(2)は該LEDを制御するICである、請求項1記載のオプトエレクトロニクスモジュール。
- 前記導体構造(4a,4b)は、前記放射出力半導体素子(1)から突出した導電性ウェブである、請求項1または2記載のオプトエレクトロニクスモジュール。
- 前記導電性ウェブ(4a,4b)は、前記放射出力半導体素子(1)から離れて前記支持基板(3)の方向に湾曲するように成形されている、請求項3記載のオプトエレクトロニクスモジュール。
- 前記導電性ウェブ(4a,4b)はL字状に形成されている、請求項4記載のオプトエレクトロニクスモジュール。
- 前記導電性ウェブ(4a,4b)はZ字状に形成されている、請求項4記載のオプトエレクトロニクスモジュール。
- 前記導電性ウェブ(4a,4b)はJ字状に形成されている、請求項4記載のオプトエレクトロニクスモジュール。
- 前記導電性ウェブ(4a,4b)は金属ウェブである、請求項3から7のいずれか1項記載のオプトエレクトロニクスモジュール。
- 前記第1の電気端子(8)は、スルーホール(11)によって前記支持基板(3)中を案内されている、請求項1から8のいずれか1項記載のオプトエレクトロニクスモジュール。
- 前記支持基板(3)は高さHを有するキャビティ(32)を備えており、該キャビティ(32)内に電気素子(2)が配置されており、
前記キャビティ(32)の高さHは前記電気素子(2)の高さh1よりも高く、
前記電気素子(2)は封止材料(10)により充填されており、前記電気素子(2)の高さh1に該電気素子(2)の上の封止材料(10)の高さh2を加えた高さは、前記キャビティ(32)の高さHと一致し、
前記放射出力半導体素子(1)は前記封止材料(10)の上に配置されている、
請求項1から9のいずれか1項記載のオプトエレクトロニクスモジュール。 - さらにケーシングが設けられており、該ケーシング内に、前記支持基板(3)と前記電気素子(2)と前記放射出力半導体素子(1)が配置されており、該ケーシングは放射を吸収する粒子を有している、請求項1から10のいずれか1項記載のオプトエレクトロニクスモジュール。
- さらにモールド材料が設けられており、該モールド材料は前記放射出力半導体素子(1)を取り囲み、該モールド材料は放射を吸収する粒子を有している、請求項11記載のオプトエレクトロニクスモジュール。
- 前記支持基板(3)は多層基板として形成されている、請求項1から12のいずれか1項記載のオプトエレクトロニクスモジュール。
- 前記支持基板(3)の上面(31)に別の電気素子(2)が配置されており、該別の電気素子(2)は、前記支持基板(3)の下面(33)において別の第1の電気端子(8)と導電接続されており、
それぞれ1つの電気素子(2)の、前記支持基板(3)とは反対側に、別の放射出力半導体素子(1)が配置されており、該別の放射出力半導体素子(1)は、前記支持基板(3)の上面(31)における別の第2の電気端子(5a,5b,6a,6b,7a,7b)と導電接続されている、
請求項1から13のいずれか1項記載のオプトエレクトロニクスモジュール。 - オプトエレクトロニクスモジュールの製造方法において、
電気素子(2)を支持基板(3)の上面(31)に取り付けるステップを有しており、該支持基板(3)は、下面(33)に第1の電気端子を備え、上面(31)に第2の電気端子(5a,5b,6a,6b,7a,7b)を備え、前記電気素子(2)を前記第1の電気端子(8)と導電接続し、
放射出力半導体素子(1)を取り付けるステップを有しており、該放射出力半導体素子(1)を、前記電気素子(2)の、前記支持基板(3)とは反対側に配置し、該放射出力半導体素子(1)の導体構造部(4a,4b)を前記第2の電気端子(5a,5b,6a,6b,7a,7b)と導電接続することを特徴とする、
オプトエレクトロニクスモジュールの製造方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102009022901A DE102009022901A1 (de) | 2009-05-27 | 2009-05-27 | Optoelektronisches Modul und Verfahren zur Herstellung eines optoelektronischen Moduls |
DE102009022901.9 | 2009-05-27 | ||
PCT/DE2010/000492 WO2010136006A1 (de) | 2009-05-27 | 2010-04-28 | Optoelektronisches modul und verfahren zur herstellung eines optoelektronischen moduls |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012528470A true JP2012528470A (ja) | 2012-11-12 |
JP2012528470A5 JP2012528470A5 (ja) | 2013-03-21 |
Family
ID=42558477
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2012512198A Pending JP2012528470A (ja) | 2009-05-27 | 2010-04-28 | オプトエレクトロニクスモジュールおよびオプトエレクトロニクスモジュールの製造方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US8916900B2 (ja) |
EP (1) | EP2436242B1 (ja) |
JP (1) | JP2012528470A (ja) |
KR (1) | KR101675008B1 (ja) |
CN (1) | CN102450109B (ja) |
DE (1) | DE102009022901A1 (ja) |
WO (1) | WO2010136006A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017118101A (ja) * | 2015-12-22 | 2017-06-29 | シチズン電子株式会社 | Led発光装置 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02281976A (ja) * | 1989-04-24 | 1990-11-19 | Sharp Corp | Ledプリンタヘッド |
JPH04276649A (ja) * | 1991-03-04 | 1992-10-01 | Hitachi Ltd | 複合形半導体装置およびその実装構造体並びにその実装方法 |
JP2002231885A (ja) * | 2001-02-06 | 2002-08-16 | Mitsubishi Electric Corp | 半導体装置 |
JP2007312107A (ja) * | 2006-05-18 | 2007-11-29 | Alps Electric Co Ltd | 表面弾性波装置 |
JP2009510741A (ja) * | 2005-09-30 | 2009-03-12 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | オプトエレクトロニクス構成素子を製造する方法及び電磁ビームを放出するオプトエレクトロニクス構成素子 |
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JP2001203427A (ja) * | 2000-01-20 | 2001-07-27 | Canon Inc | 波長多重面型発光素子装置、その製造方法およびこれを用いた波長多重伝送システム |
JP2004319530A (ja) * | 2003-02-28 | 2004-11-11 | Sanyo Electric Co Ltd | 光半導体装置およびその製造方法 |
US20070257901A1 (en) * | 2004-04-19 | 2007-11-08 | Matsushita Electric Industrial Co., Ltd. | Semiconductor chip for driving light emitting element, light emitting device, and lighting device |
US20070295975A1 (en) * | 2004-06-25 | 2007-12-27 | Sanyo Electric Co., Ltd. | Light-Emitting Device |
DE102004064150B4 (de) * | 2004-06-29 | 2010-04-29 | Osram Opto Semiconductors Gmbh | Elektronisches Bauteil mit Gehäuse mit leitfähiger Beschichtung zum ESD-Schutz |
US7977698B2 (en) * | 2005-03-18 | 2011-07-12 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | System and method for surface mountable display |
EP1878062A2 (en) * | 2005-04-28 | 2008-01-16 | Koninklijke Philips Electronics N.V. | Light source comprising led arranged in recess |
DE102006025162B3 (de) * | 2006-05-30 | 2008-01-31 | Epcos Ag | Flip-Chip-Bauelement und Verfahren zur Herstellung |
US20080106251A1 (en) * | 2006-11-03 | 2008-05-08 | Cabral Roy Manuel | Daylight-readable digital panel meter with auto-brightness adjusting led display |
DE102007020475A1 (de) | 2007-04-27 | 2008-11-06 | Häusermann GmbH | Verfahren zur Herstellung einer Leiterplatte mit einer Kavität für die Integration von Bauteilen und Leiterplatte und Anwendung |
JP4912275B2 (ja) * | 2007-11-06 | 2012-04-11 | 新光電気工業株式会社 | 半導体パッケージ |
US20090173958A1 (en) * | 2008-01-04 | 2009-07-09 | Cree, Inc. | Light emitting devices with high efficiency phospor structures |
US20100059783A1 (en) * | 2008-09-08 | 2010-03-11 | Harry Chandra | Light Emitting Chip Package With Metal Leads For Enhanced Heat Dissipation |
-
2009
- 2009-05-27 DE DE102009022901A patent/DE102009022901A1/de not_active Withdrawn
-
2010
- 2010-04-28 CN CN201080023025.3A patent/CN102450109B/zh not_active Expired - Fee Related
- 2010-04-28 US US13/318,504 patent/US8916900B2/en not_active Expired - Fee Related
- 2010-04-28 KR KR1020117031189A patent/KR101675008B1/ko active IP Right Grant
- 2010-04-28 JP JP2012512198A patent/JP2012528470A/ja active Pending
- 2010-04-28 WO PCT/DE2010/000492 patent/WO2010136006A1/de active Application Filing
- 2010-04-28 EP EP10721292A patent/EP2436242B1/de not_active Not-in-force
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02281976A (ja) * | 1989-04-24 | 1990-11-19 | Sharp Corp | Ledプリンタヘッド |
JPH04276649A (ja) * | 1991-03-04 | 1992-10-01 | Hitachi Ltd | 複合形半導体装置およびその実装構造体並びにその実装方法 |
JP2002231885A (ja) * | 2001-02-06 | 2002-08-16 | Mitsubishi Electric Corp | 半導体装置 |
JP2009510741A (ja) * | 2005-09-30 | 2009-03-12 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | オプトエレクトロニクス構成素子を製造する方法及び電磁ビームを放出するオプトエレクトロニクス構成素子 |
JP2007312107A (ja) * | 2006-05-18 | 2007-11-29 | Alps Electric Co Ltd | 表面弾性波装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017118101A (ja) * | 2015-12-22 | 2017-06-29 | シチズン電子株式会社 | Led発光装置 |
Also Published As
Publication number | Publication date |
---|---|
CN102450109B (zh) | 2015-07-29 |
US20120056235A1 (en) | 2012-03-08 |
US8916900B2 (en) | 2014-12-23 |
EP2436242A1 (de) | 2012-04-04 |
KR20120036892A (ko) | 2012-04-18 |
EP2436242B1 (de) | 2013-01-09 |
KR101675008B1 (ko) | 2016-11-10 |
WO2010136006A1 (de) | 2010-12-02 |
CN102450109A (zh) | 2012-05-09 |
DE102009022901A1 (de) | 2010-12-02 |
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