KR101675008B1 - 광전자 모듈 그리고 광전자 모듈을 제조하기 위한 방법 - Google Patents

광전자 모듈 그리고 광전자 모듈을 제조하기 위한 방법 Download PDF

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Publication number
KR101675008B1
KR101675008B1 KR1020117031189A KR20117031189A KR101675008B1 KR 101675008 B1 KR101675008 B1 KR 101675008B1 KR 1020117031189 A KR1020117031189 A KR 1020117031189A KR 20117031189 A KR20117031189 A KR 20117031189A KR 101675008 B1 KR101675008 B1 KR 101675008B1
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KR
South Korea
Prior art keywords
radiation
carrier substrate
emitting
electrical
semiconductor element
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Expired - Fee Related
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KR1020117031189A
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English (en)
Korean (ko)
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KR20120036892A (ko
Inventor
게오르크 보그너
슈테판 그루버
Original Assignee
오스람 옵토 세미컨덕터스 게엠베하
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Publication of KR20120036892A publication Critical patent/KR20120036892A/ko
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/183—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components mounted in and supported by recessed areas of the PCBs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10515—Stacked components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Led Device Packages (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
KR1020117031189A 2009-05-27 2010-04-28 광전자 모듈 그리고 광전자 모듈을 제조하기 위한 방법 Expired - Fee Related KR101675008B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102009022901A DE102009022901A1 (de) 2009-05-27 2009-05-27 Optoelektronisches Modul und Verfahren zur Herstellung eines optoelektronischen Moduls
DE102009022901.9 2009-05-27
PCT/DE2010/000492 WO2010136006A1 (de) 2009-05-27 2010-04-28 Optoelektronisches modul und verfahren zur herstellung eines optoelektronischen moduls

Publications (2)

Publication Number Publication Date
KR20120036892A KR20120036892A (ko) 2012-04-18
KR101675008B1 true KR101675008B1 (ko) 2016-11-10

Family

ID=42558477

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020117031189A Expired - Fee Related KR101675008B1 (ko) 2009-05-27 2010-04-28 광전자 모듈 그리고 광전자 모듈을 제조하기 위한 방법

Country Status (7)

Country Link
US (1) US8916900B2 (https=)
EP (1) EP2436242B1 (https=)
JP (1) JP2012528470A (https=)
KR (1) KR101675008B1 (https=)
CN (1) CN102450109B (https=)
DE (1) DE102009022901A1 (https=)
WO (1) WO2010136006A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6827295B2 (ja) * 2015-12-22 2021-02-10 シチズン電子株式会社 Ｌｅｄ発光装置
KR102801218B1 (ko) * 2019-08-30 2025-04-29 삼성전자주식회사 디스플레이 모듈 패키지
DE102024115867A1 (de) * 2024-06-06 2025-12-11 Ams-Osram International Gmbh Optoelektronisches bauteil mit einem optoelektronischen-halbleiterchip und einem dem optoelektronischen halbleiterchip zugeordneten zusatzchip

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070257901A1 (en) * 2004-04-19 2007-11-08 Matsushita Electric Industrial Co., Ltd. Semiconductor chip for driving light emitting element, light emitting device, and lighting device
JP2009510741A (ja) * 2005-09-30 2009-03-12 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング オプトエレクトロニクス構成素子を製造する方法及び電磁ビームを放出するオプトエレクトロニクス構成素子

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02281976A (ja) 1989-04-24 1990-11-19 Sharp Corp Ｌｅｄプリンタヘッド
JPH04276649A (ja) 1991-03-04 1992-10-01 Hitachi Ltd 複合形半導体装置およびその実装構造体並びにその実装方法
JP2001203427A (ja) * 2000-01-20 2001-07-27 Canon Inc 波長多重面型発光素子装置、その製造方法およびこれを用いた波長多重伝送システム
JP2002231885A (ja) * 2001-02-06 2002-08-16 Mitsubishi Electric Corp 半導体装置
JP2004319530A (ja) * 2003-02-28 2004-11-11 Sanyo Electric Co Ltd 光半導体装置およびその製造方法
US20070295975A1 (en) * 2004-06-25 2007-12-27 Sanyo Electric Co., Ltd. Light-Emitting Device
DE102004064150B4 (de) * 2004-06-29 2010-04-29 Osram Opto Semiconductors Gmbh Elektronisches Bauteil mit Gehäuse mit leitfähiger Beschichtung zum ESD-Schutz
US7977698B2 (en) * 2005-03-18 2011-07-12 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. System and method for surface mountable display
CN100539219C (zh) * 2005-04-28 2009-09-09 皇家飞利浦电子股份有限公司 包括设置在凹部中的led的光源
JP2007312107A (ja) 2006-05-18 2007-11-29 Alps Electric Co Ltd 表面弾性波装置
DE102006025162B3 (de) * 2006-05-30 2008-01-31 Epcos Ag Flip-Chip-Bauelement und Verfahren zur Herstellung
US20080106251A1 (en) * 2006-11-03 2008-05-08 Cabral Roy Manuel Daylight-readable digital panel meter with auto-brightness adjusting led display
DE102007020475A1 (de) 2007-04-27 2008-11-06 Häusermann GmbH Verfahren zur Herstellung einer Leiterplatte mit einer Kavität für die Integration von Bauteilen und Leiterplatte und Anwendung
JP4912275B2 (ja) * 2007-11-06 2012-04-11 新光電気工業株式会社 半導体パッケージ
US20090173958A1 (en) * 2008-01-04 2009-07-09 Cree, Inc. Light emitting devices with high efficiency phospor structures
US20100059783A1 (en) * 2008-09-08 2010-03-11 Harry Chandra Light Emitting Chip Package With Metal Leads For Enhanced Heat Dissipation

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070257901A1 (en) * 2004-04-19 2007-11-08 Matsushita Electric Industrial Co., Ltd. Semiconductor chip for driving light emitting element, light emitting device, and lighting device
JP2009510741A (ja) * 2005-09-30 2009-03-12 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング オプトエレクトロニクス構成素子を製造する方法及び電磁ビームを放出するオプトエレクトロニクス構成素子

Also Published As

Publication number Publication date
KR20120036892A (ko) 2012-04-18
JP2012528470A (ja) 2012-11-12
CN102450109A (zh) 2012-05-09
US20120056235A1 (en) 2012-03-08
CN102450109B (zh) 2015-07-29
EP2436242A1 (de) 2012-04-04
EP2436242B1 (de) 2013-01-09
US8916900B2 (en) 2014-12-23
DE102009022901A1 (de) 2010-12-02
WO2010136006A1 (de) 2010-12-02

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