KR100788340B1 - 반도체 패키지 - Google Patents
반도체 패키지 Download PDFInfo
- Publication number
- KR100788340B1 KR100788340B1 KR1020010019559A KR20010019559A KR100788340B1 KR 100788340 B1 KR100788340 B1 KR 100788340B1 KR 1020010019559 A KR1020010019559 A KR 1020010019559A KR 20010019559 A KR20010019559 A KR 20010019559A KR 100788340 B1 KR100788340 B1 KR 100788340B1
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- South Korea
- Prior art keywords
- chip
- lead
- substrate
- semiconductor package
- hole
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/105—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L27/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
- H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
- H01L2225/1047—Details of electrical connections between containers
- H01L2225/1058—Bump or bump-like electrical connections, e.g. balls, pillars, posts
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
- H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
- H01L2225/1047—Details of electrical connections between containers
- H01L2225/1064—Electrical connections provided on a side surface of one or more of the containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
Claims (6)
- 칩이 삽입되는 홀을 구비한 섭스트레이트와;상기 칩이 삽입되는 홀의 내측면에 부착되며 섭스트레이트의 표면 또는 배면까지 연장형성된 리드와;접속패드가 측면으로 노출되어 상기 노출된 접속패드가 상기 리드와 접촉되도록 한 칩과;상기 노출된 접속패드와 접촉되는 리드면에 코팅되어 칩의 접속패드와 리드를 전기적으로 결합시키도록 전도성 코팅재로 이루어지는 본딩수단과;상기 섭스트레이트가 마더보드에 실장되기 위한 전도성 범프를 포함하고, 상기 칩을 섭스트레이트의 홀에 적층삽입하되 칩의 노출된 접속패드가 일렬로 리드와 접속되도록 한 것을 특징으로 하는 반도체 패키지.
- 제 1 항에 있어서,상기 반도체 칩은 사이드 패드를 구비한 것을 특징으로 하는 반도체 패키지.
- 제 1 항에 있어서,상기 반도체 칩은 동일한 사이즈인 것을 특징으로 하는 반도체 패키지.
- 제 1 항에 있어서,상기 리드는 섭스트레이트 외면으로 절곡인출된 것을 특징으로 하는 반도체 패키지.
- 제 1 항에 있어서,상기 섭스트레이트의 외면으로 절곡된 리드와 하부칩을 봉지재로 봉지한 것을 특징으로 하는 반도체 패키지.
- 제 1항에 있어서,상기 본딩수단은 솔더(solder)로 이루어짐을 특징으로 하는 반도체 패키지.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020010019559A KR100788340B1 (ko) | 2001-04-12 | 2001-04-12 | 반도체 패키지 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020010019559A KR100788340B1 (ko) | 2001-04-12 | 2001-04-12 | 반도체 패키지 |
Publications (2)
Publication Number | Publication Date |
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KR20020079015A KR20020079015A (ko) | 2002-10-19 |
KR100788340B1 true KR100788340B1 (ko) | 2007-12-27 |
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KR1020010019559A KR100788340B1 (ko) | 2001-04-12 | 2001-04-12 | 반도체 패키지 |
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Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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KR100594229B1 (ko) | 2003-09-19 | 2006-07-03 | 삼성전자주식회사 | 반도체 패키지 및 그 제조방법 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR970063685A (ko) * | 1996-02-29 | 1997-09-12 | 황인길 | 볼 그리드 어레이(Ball Grid Array) 반도체 패키지의 구조 및 제조 방법 |
KR20000007735A (ko) * | 1998-07-07 | 2000-02-07 | 윤종용 | 시간 정보 관리 방법 |
KR20010018381A (ko) * | 1999-08-19 | 2001-03-05 | 마이클 디. 오브라이언 | 전도성 잉크를 이용한 회로 기판 및 이를 이용한 반도체 패키지 |
-
2001
- 2001-04-12 KR KR1020010019559A patent/KR100788340B1/ko active IP Right Grant
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR970063685A (ko) * | 1996-02-29 | 1997-09-12 | 황인길 | 볼 그리드 어레이(Ball Grid Array) 반도체 패키지의 구조 및 제조 방법 |
KR20000007735A (ko) * | 1998-07-07 | 2000-02-07 | 윤종용 | 시간 정보 관리 방법 |
KR20010018381A (ko) * | 1999-08-19 | 2001-03-05 | 마이클 디. 오브라이언 | 전도성 잉크를 이용한 회로 기판 및 이를 이용한 반도체 패키지 |
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Publication number | Publication date |
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KR20020079015A (ko) | 2002-10-19 |
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