CN102415224A - 用于改善互连结构的功率增益和损耗的方法和设备 - Google Patents

用于改善互连结构的功率增益和损耗的方法和设备 Download PDF

Info

Publication number
CN102415224A
CN102415224A CN2010800197895A CN201080019789A CN102415224A CN 102415224 A CN102415224 A CN 102415224A CN 2010800197895 A CN2010800197895 A CN 2010800197895A CN 201080019789 A CN201080019789 A CN 201080019789A CN 102415224 A CN102415224 A CN 102415224A
Authority
CN
China
Prior art keywords
power
path
blind hole
modified elements
pcb
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2010800197895A
Other languages
English (en)
Chinese (zh)
Inventor
J.V.拉塞尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
R&D Circuits Inc
Original Assignee
R&D Circuits Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by R&D Circuits Inc filed Critical R&D Circuits Inc
Publication of CN102415224A publication Critical patent/CN102415224A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231—Capacitors or dielectric substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0234—Resistors or by disposing resistive or lossy substances in or near power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/096—Vertically aligned vias, holes or stacked vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
CN2010800197895A 2009-05-04 2010-01-08 用于改善互连结构的功率增益和损耗的方法和设备 Pending CN102415224A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US21536909P 2009-05-04 2009-05-04
US61/215,369 2009-05-04
PCT/US2010/000043 WO2010129002A1 (en) 2009-05-04 2010-01-08 Method and apparatus for improving power and loss for interconect configurations

Publications (1)

Publication Number Publication Date
CN102415224A true CN102415224A (zh) 2012-04-11

Family

ID=43050319

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010800197895A Pending CN102415224A (zh) 2009-05-04 2010-01-08 用于改善互连结构的功率增益和损耗的方法和设备

Country Status (6)

Country Link
EP (1) EP2428105A4 (ja)
JP (1) JP2012526380A (ja)
KR (1) KR20120007521A (ja)
CN (1) CN102415224A (ja)
SG (1) SG178121A1 (ja)
WO (1) WO2010129002A1 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104253359A (zh) * 2013-06-28 2014-12-31 波音公司 桁架互连
CN107255784A (zh) * 2017-07-10 2017-10-17 深圳崇达多层线路板有限公司 一种线路板的多物理量测量系统及测量方法
CN109070214A (zh) * 2016-09-02 2018-12-21 R & D 电路股份有限公司 用于3d导线模块的方法和结构
CN109669059A (zh) * 2017-10-17 2019-04-23 中华精测科技股份有限公司 调整电源信号阻抗之电路结构及其半导体测试接口系统

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11103170A (ja) * 1997-09-29 1999-04-13 Kyocera Corp 抵抗体内蔵多層セラミック回路基板
EP1098368B1 (en) * 1999-04-16 2011-12-21 Panasonic Corporation Module component and method of manufacturing the same
JP4953499B2 (ja) * 1999-09-02 2012-06-13 イビデン株式会社 プリント配線板
JP3813402B2 (ja) * 2000-01-31 2006-08-23 新光電気工業株式会社 半導体装置の製造方法
JP4683770B2 (ja) * 2001-05-31 2011-05-18 京セラ株式会社 電気素子内蔵配線基板およびその製法
JP4854345B2 (ja) * 2006-03-16 2012-01-18 富士通株式会社 コンデンサシート及び電子回路基板

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104253359A (zh) * 2013-06-28 2014-12-31 波音公司 桁架互连
CN104253359B (zh) * 2013-06-28 2018-06-19 波音公司 桁架互连
CN109070214A (zh) * 2016-09-02 2018-12-21 R & D 电路股份有限公司 用于3d导线模块的方法和结构
CN107255784A (zh) * 2017-07-10 2017-10-17 深圳崇达多层线路板有限公司 一种线路板的多物理量测量系统及测量方法
CN109669059A (zh) * 2017-10-17 2019-04-23 中华精测科技股份有限公司 调整电源信号阻抗之电路结构及其半导体测试接口系统
CN109669059B (zh) * 2017-10-17 2021-03-16 中华精测科技股份有限公司 调整电源信号阻抗之电路结构及其半导体测试接口系统

Also Published As

Publication number Publication date
EP2428105A1 (en) 2012-03-14
JP2012526380A (ja) 2012-10-25
WO2010129002A1 (en) 2010-11-11
SG178121A1 (en) 2012-03-29
KR20120007521A (ko) 2012-01-20
EP2428105A4 (en) 2013-05-29

Similar Documents

Publication Publication Date Title
US8238109B2 (en) Flex-rigid wiring board and electronic device
EP2429270A1 (en) Multilayer circuit board and production method thereof and communication device
US20100051326A1 (en) Flex-rigid wiring board and electronic device
US20100276188A1 (en) Method and apparatus for improving power gain and loss for interconect configurations
KR20120068908A (ko) 상호연결 구조에서 전력 이득(분배) 및 전력 손실(낭비)을 개선하기 위해 인터포저 보드에 내장된 부품들
CN105323951A (zh) 印刷电路板及其制造方法
CN103295988A (zh) 具有集成插槽的系统级封装
CN107516764B (zh) 天线结构及其制作方法
KR20150064976A (ko) 인쇄회로기판 및 그 제조방법
CN109587974A (zh) 柔性电路板及该柔性电路板的制造方法
US9462703B2 (en) Solder void reduction between electronic packages and printed circuit boards
CN102415224A (zh) 用于改善互连结构的功率增益和损耗的方法和设备
US20190357364A1 (en) Component Carrier With Only Partially Filled Thermal Through-Hole
CN101546740B (zh) 嵌入式印刷电路板及其制造方法
KR101167453B1 (ko) 전자부품 내장형 인쇄회로기판 및 그 제조방법
US20090080168A1 (en) Printed circuit board, fabrication method and apparatus
CN103545303B (zh) 集成电路封装体组件、用于组装印刷电路板的方法 和集成电路封装体
CN108282954B (zh) 一种电路板、电子设备和电路板制作方法
US6982387B2 (en) Method and apparatus to establish circuit layers interconnections
CN209861251U (zh) 电路板
US6541853B1 (en) Electrically conductive path through a dielectric material
EP3570645B1 (en) Component carrier with only partially filled thermal through-hole
Tsunoda et al. Advanced vertical interconnect technology with high density interconnect and conductive paste
KR101744247B1 (ko) 임베디드 인쇄회로기판의 제조 방법
KR20110122044A (ko) 반도체 패키지 기판 및 그 제조방법

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20120411