EP2428105A4 - METHOD AND DEVICE FOR INCREASED PERFORMANCE AND LESS LOSS IN NETWORK CONFIGURATIONS - Google Patents

METHOD AND DEVICE FOR INCREASED PERFORMANCE AND LESS LOSS IN NETWORK CONFIGURATIONS

Info

Publication number
EP2428105A4
EP2428105A4 EP10772351.2A EP10772351A EP2428105A4 EP 2428105 A4 EP2428105 A4 EP 2428105A4 EP 10772351 A EP10772351 A EP 10772351A EP 2428105 A4 EP2428105 A4 EP 2428105A4
Authority
EP
European Patent Office
Prior art keywords
interconect
configurations
loss
improving power
improving
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP10772351.2A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP2428105A1 (en
Inventor
James V Russell
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
R&D Circuits Inc
Original Assignee
R&D Circuits Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by R&D Circuits Inc filed Critical R&D Circuits Inc
Publication of EP2428105A1 publication Critical patent/EP2428105A1/en
Publication of EP2428105A4 publication Critical patent/EP2428105A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231—Capacitors or dielectric substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0234—Resistors or by disposing resistive or lossy substances in or near power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/096—Vertically aligned vias, holes or stacked vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
EP10772351.2A 2009-05-04 2010-01-08 METHOD AND DEVICE FOR INCREASED PERFORMANCE AND LESS LOSS IN NETWORK CONFIGURATIONS Withdrawn EP2428105A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US21536909P 2009-05-04 2009-05-04
PCT/US2010/000043 WO2010129002A1 (en) 2009-05-04 2010-01-08 Method and apparatus for improving power and loss for interconect configurations

Publications (2)

Publication Number Publication Date
EP2428105A1 EP2428105A1 (en) 2012-03-14
EP2428105A4 true EP2428105A4 (en) 2013-05-29

Family

ID=43050319

Family Applications (1)

Application Number Title Priority Date Filing Date
EP10772351.2A Withdrawn EP2428105A4 (en) 2009-05-04 2010-01-08 METHOD AND DEVICE FOR INCREASED PERFORMANCE AND LESS LOSS IN NETWORK CONFIGURATIONS

Country Status (6)

Country Link
EP (1) EP2428105A4 (ja)
JP (1) JP2012526380A (ja)
KR (1) KR20120007521A (ja)
CN (1) CN102415224A (ja)
SG (1) SG178121A1 (ja)
WO (1) WO2010129002A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9406462B2 (en) * 2013-06-28 2016-08-02 The Boeing Company Truss interconnect
KR102206150B1 (ko) * 2016-09-02 2021-01-22 알&디 설킷트스 인크. 3d 와이어 불록 구조 및 방법
CN107255784A (zh) * 2017-07-10 2017-10-17 深圳崇达多层线路板有限公司 一种线路板的多物理量测量系统及测量方法
CN109669059B (zh) * 2017-10-17 2021-03-16 中华精测科技股份有限公司 调整电源信号阻抗之电路结构及其半导体测试接口系统

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11103170A (ja) * 1997-09-29 1999-04-13 Kyocera Corp 抵抗体内蔵多層セラミック回路基板
EP1098368A1 (en) * 1999-04-16 2001-05-09 Matsushita Electric Industrial Co., Ltd. Module component and method of manufacturing the same
US20080013295A1 (en) * 2006-03-16 2008-01-17 Fujitsu Limited Capacitor sheet and electronic circuit board

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4953499B2 (ja) * 1999-09-02 2012-06-13 イビデン株式会社 プリント配線板
JP3813402B2 (ja) * 2000-01-31 2006-08-23 新光電気工業株式会社 半導体装置の製造方法
JP4683770B2 (ja) * 2001-05-31 2011-05-18 京セラ株式会社 電気素子内蔵配線基板およびその製法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11103170A (ja) * 1997-09-29 1999-04-13 Kyocera Corp 抵抗体内蔵多層セラミック回路基板
EP1098368A1 (en) * 1999-04-16 2001-05-09 Matsushita Electric Industrial Co., Ltd. Module component and method of manufacturing the same
US20080013295A1 (en) * 2006-03-16 2008-01-17 Fujitsu Limited Capacitor sheet and electronic circuit board

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2010129002A1 *

Also Published As

Publication number Publication date
SG178121A1 (en) 2012-03-29
EP2428105A1 (en) 2012-03-14
CN102415224A (zh) 2012-04-11
WO2010129002A1 (en) 2010-11-11
JP2012526380A (ja) 2012-10-25
KR20120007521A (ko) 2012-01-20

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Effective date: 20130502

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