CN102415224A

CN102415224A - Method and apparatus for improving power and loss for interconect configurations

Info

Publication number: CN102415224A
Application number: CN2010800197895A
Authority: CN
Inventors: J.V.拉塞尔
Original assignee: R&D Circuits Inc
Current assignee: R&D Circuits Inc
Priority date: 2009-05-04
Filing date: 2010-01-08
Publication date: 2012-04-11
Also published as: SG178121A1; EP2428105A1; WO2010129002A1; EP2428105A4; JP2012526380A; KR20120007521A

Abstract

The present disclosure relates to embedding a power modification component such as a capacitance or a resistance inside of pads that are located to extend over and beyond the vias of the PCB so that a portion of the pad containing the embedded capacitance or resistance is located beyond where the vias or blinds are located. Each of the pads will include an opening that is located over a given one of the vias or blinds to permit that via to conduct through the opening. In this way the capacitance and the resistance will have a closer contact point the electrical component.

Description

Be used to improve the power gain of interconnection structure and the method and apparatus of loss

Related application

This is the non-provisional application of James V.Russell at the provisional application sequence number 61/215,369 of submission on May 4th, 2009.

Background technology

1. field

During to the downside of printed circuit board (PCB) (PCB) and/or upside, there is the problem of power loss in electronic component arrangements, perhaps because the problem that the distance of the position of electric capacity to the corresponding integrated circuit (IC) of its application causes.With the electric capacity direct physical the contact pad that navigates on the printed circuit be impossible, wherein the contact pad of this printed circuit is corresponding to the input and output point of integrated circuit or be the corresponding points of testing jack (test socket) under the situation of test board.Similarly, the problem that has insufficient dissipation owing to the distance of resistance and electronic component.Equally, the contact pad that resistance is physically navigated on the printed circuit board (PCB) is unlikely.

Therefore; Need have a kind of method and apparatus; Its provide electric capacity or resistance near being provided with, electric capacity or resistance should be regarded as the power modified elements, because it be IC or the other electron component perhaps distribution power (power gain) (electric capacity) better of dissipation power (power loss) (resistance) better on the PCB; Better power gain or distribution to be provided, perhaps power loss or dissipation.

Summary of the invention

The present invention is provided as the downside that electric capacity or resistance is directly adhered to or is embedded into pad; Said pad is set to extending on the path of PCB and extending to outside the said path, thereby the part that will comprise the pad that embeds power modified elements (electric capacity or resistance) is arranged on outside the position of said path.Each pad is connected to the end points of power modified elements that is positioned at its below through the opening in the dielectric substance under the pad, to allow through said opening conduction.By this way, said electric capacity and resistance have the contact point more approaching with said electronic component.

Description of drawings

Fig. 1 is the standard interconnect structure figure of the setting of expression electric capacity or resistance;

Fig. 2 A illustrates the interconnection structure of placing electric capacity or resistance according to the present invention;

Fig. 2 B is an alternative embodiment of the invention, representes for trickleer pitch with a vertically aligned through hole of the mode at another top;

Fig. 3 is an alternative embodiment of the invention, and wherein embedding element is vertically aligned element in the plate; And

Fig. 4 is embodiments of the invention, the embedded resistor that is illustrated in the plate vertical and horizontal aligument with embed electric capacity.

Embodiment

With reference to the accompanying drawings, Fig. 1 representes a kind of typical interconnect structure, wherein electric capacity or resistance is arranged on electrical testing structural framing (housing) with IC chip (not shown) at a distance of sizable distance.Fig. 2 representes interconnection structure of the present invention.In this structure, power modified elements 5 can be but be not limited to electric capacity 5c (Fig. 4) or resistance 5a (Fig. 3), and power modified elements 5 is embedded under the pad 7 of contact zone (footprint) of electrical testing structural framing of IC chip (not shown).Pad 7 is provided with does not have overlay path or blind hole (blind) 11, but be positioned near the embedded part the electronic component.By this way, this setting can provide better distribute power (power distribution) through approaching electronic component, and making does not almost have power dissipation, and electric capacity does not become inductive.Similarly, when needs, near electronic component power dissipation is provided equally through making resistance.Resistance causes power dissipation to reduce to electronic component away from (distant placement) is set, shown in Figure 3 in problem that the present invention handles and solves such as the accompanying drawing.

Fig. 2 A representes one embodiment of the present of invention, shows power modified elements 5, and for example resistance 5a (Fig. 3) or electric capacity 5c (Fig. 4) are attached to the interconnection structure of pad 7 downsides, and wherein pad 7 is preferably formed by the copper layer of printed circuit board (PCB) (PCB).It is under the dielectric layer then that the power modified elements 5 (such as but not limited to electric capacity or resistance) that embeds is arranged at one deck Copper Foil.Power modified elements 5 in its side by for example fiber reinforcement or reinforced epoxy or plastic material do not center on of prepreg (prepreg).Power modified elements 5 is attached to 7 layers of pads through solder paste, conductive epoxy resin or the coat of metal 14.Should be appreciated that any other known attachment means also can adopt, and the present invention also is not limited to these certain materials of Copper Foil, dielectric layer and prepreg of explaining here.Shown in Fig. 2 A, power modified elements 5 be embedded as near but do not stop path or the blind hole 11 of PCB 8.Preferably, electric capacity 5c is 0201 cap (0201 cap).Yet, can adopt open ended any required capacitance or size.As shown in Figure 4, electric capacity 5c adheres to through conductive epoxy resin, solder paste or the coat of metal 14.

Fig. 3 representes to improve through embedded resistor 5a in PC plate 8 another embodiment of power dissipation.Under the pad 7a that inserts the plate top and under the pad 7b of PC plate 10 bottoms, create opening; And resistance 5a is vertically positioned in respectively in the opening between pad 7a and the 7b up and down; It is used as effective layer path of PC plate 10 on effect; Wherein PC plate 10 is assumed to multilayer PC plate, thereby is electrically connected through the resistance 5a that is embedded in the PC plate 10.

Pad

7a and 7b are connected respectively to resistance 5a.The end points and the opening between pad 7a and the 7b that lay respectively at resistance 5a in the PC plate 8 can use scolder, the coat of metal or conductive epoxy resin 14 to fill.

Fig. 4 representes an alternative embodiment of the invention, and the embedded resistor 5a that wherein embeds electric capacity 5c and Fig. 3 is arranged in the same PC plate 8 together.

Although represented and explained to be expressly understood specific embodiment, the invention is not restricted to this, and can in the scope of claims of enclosing, otherwise implement.

Claims

1. one kind for the electronic component on the printed circuit board (PCB) (PCB) provides the distribute power of improvement or the method for power dissipation, and this method may further comprise the steps:

The power modified elements is embedded into a perhaps inboard of more pads;

Said one or more a plurality of embedding pads are set on the path of said PCB or blind hole, extend and extend to outside said path or the blind hole; Thereby the part that will comprise the pad that embeds the power modified elements is arranged on outside the position of said path or blind hole; Said one or more pads comprise that the opening that is arranged on given of said path or the blind hole is to allow said path through said opening conduction; Thereby said power modified elements has the contact point more approaching with said electronic component, increases distribute power or power dissipation thus respectively.

2. method according to claim 1, wherein said power modified elements is an electric capacity.

3. method according to claim 1, wherein said power modified elements is a resistance.

4. one kind for the electronic component on the printed circuit board (PCB) (PCB) provides the distribute power of improvement or the equipment of power dissipation, and this equipment comprises:

The power modified elements is embedded into a perhaps inboard of more pads;

Printed circuit board (PCB); Have one or more multipath or blind hole; Said one or more a plurality of embedding pads are set on the path of said printed circuit board (PCB) or blind hole, extend and extend to outside said path or the blind hole; Thereby the part that will comprise the pad that embeds the power modified elements is arranged on outside the position of said path or blind hole; Said one or more pads comprise that the opening that is arranged on given of said path or the blind hole is to allow said path or blind hole through said opening conduction; Thereby said power modified elements has the contact point more approaching with said electronic component, increases distribute power or power dissipation thus respectively.

5. equipment according to claim 4, wherein said power modified elements is an electric capacity.

6. equipment according to claim 4, wherein said power modified elements is a resistance.