CN102365715A - 金属硅化物膜的形成方法 - Google Patents

金属硅化物膜的形成方法 Download PDF

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Publication number
CN102365715A
CN102365715A CN2010800142854A CN201080014285A CN102365715A CN 102365715 A CN102365715 A CN 102365715A CN 2010800142854 A CN2010800142854 A CN 2010800142854A CN 201080014285 A CN201080014285 A CN 201080014285A CN 102365715 A CN102365715 A CN 102365715A
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CN
China
Prior art keywords
film
annealing
forming
metal
gas
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Pending
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CN2010800142854A
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English (en)
Chinese (zh)
Inventor
铃木干夫
西森崇
汤浅秀树
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of CN102365715A publication Critical patent/CN102365715A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
    • H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
    • H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table
    • H01L21/28518—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table the conductive layers comprising silicides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/42—Silicides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/56—After-treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
    • H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
    • H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table
    • H01L21/28556—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table by chemical means, e.g. CVD, LPCVD, PECVD, laser CVD

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
CN2010800142854A 2009-09-15 2010-08-20 金属硅化物膜的形成方法 Pending CN102365715A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2009-213290 2009-09-15
JP2009213290A JP2011066060A (ja) 2009-09-15 2009-09-15 金属シリサイド膜の形成方法
PCT/JP2010/064071 WO2011033903A1 (ja) 2009-09-15 2010-08-20 金属シリサイド膜の形成方法

Publications (1)

Publication Number Publication Date
CN102365715A true CN102365715A (zh) 2012-02-29

Family

ID=43758516

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010800142854A Pending CN102365715A (zh) 2009-09-15 2010-08-20 金属硅化物膜的形成方法

Country Status (5)

Country Link
US (1) US20120171863A1 (enExample)
JP (1) JP2011066060A (enExample)
KR (1) KR101334946B1 (enExample)
CN (1) CN102365715A (enExample)
WO (1) WO2011033903A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116497231A (zh) * 2023-06-21 2023-07-28 核工业理化工程研究院 一种四（三氟膦）镍制备镍的方法

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5725454B2 (ja) * 2011-03-25 2015-05-27 株式会社アルバック ＮｉＳｉ膜の形成方法、シリサイド膜の形成方法、シリサイドアニール用金属膜の形成方法、真空処理装置、及び成膜装置
JP5826698B2 (ja) 2011-04-13 2015-12-02 株式会社アルバック Ｎｉ膜の形成方法
JP5934609B2 (ja) * 2012-08-24 2016-06-15 株式会社アルバック 金属膜の成膜方法
JP5917351B2 (ja) * 2012-09-20 2016-05-11 東京エレクトロン株式会社 金属膜の成膜方法
CN105518830B (zh) 2014-04-18 2018-01-26 富士电机株式会社 半导体装置的制造方法
WO2015159436A1 (ja) 2014-04-18 2015-10-22 富士電機株式会社 半導体装置の製造方法
KR102150253B1 (ko) 2014-06-24 2020-09-02 삼성전자주식회사 반도체 장치
JP6387791B2 (ja) 2014-10-29 2018-09-12 富士電機株式会社 半導体装置の製造方法
US10388533B2 (en) * 2017-06-16 2019-08-20 Applied Materials, Inc. Process integration method to tune resistivity of nickel silicide
JP7266105B2 (ja) * 2019-02-08 2023-04-27 アプライド マテリアルズ インコーポレイテッド 半導体デバイス、半導体デバイスの製造方法、および処理システム
CN113394090B (zh) * 2021-06-11 2023-01-31 西安微电子技术研究所 一种n型低电阻率的4H-SiC欧姆接触制造方法
US20230115130A1 (en) * 2021-10-13 2023-04-13 Applied Materials, Inc. Methods for preparing metal silicides
TW202429576A (zh) * 2023-01-05 2024-07-16 美商應用材料股份有限公司 藉由鉬與鈦的整合之觸點電阻降低

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0590293A (ja) * 1991-07-19 1993-04-09 Toshiba Corp 半導体装置およびその製造方法
JPH11195619A (ja) * 1998-01-06 1999-07-21 Sony Corp 半導体装置の製造方法
WO2006012052A2 (en) * 2004-06-25 2006-02-02 Arkema, Inc. Amidinate ligand containing chemical vapor deposition precursors

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KR101437250B1 (ko) * 2002-11-15 2014-10-13 프레지던트 앤드 펠로우즈 오브 하바드 칼리지 금속 아미디네이트를 이용한 원자층 증착법
KR100629266B1 (ko) * 2004-08-09 2006-09-29 삼성전자주식회사 샐리사이드 공정 및 이를 사용한 반도체 소자의 제조방법
KR20060016269A (ko) * 2004-08-17 2006-02-22 삼성전자주식회사 금속 실리사이드막 형성 방법 및 이를 이용한 반도체소자의 금속배선 형성 방법
US7064224B1 (en) * 2005-02-04 2006-06-20 Air Products And Chemicals, Inc. Organometallic complexes and their use as precursors to deposit metal films
JP5046506B2 (ja) * 2005-10-19 2012-10-10 東京エレクトロン株式会社 基板処理装置，基板処理方法，プログラム，プログラムを記録した記録媒体
KR100691099B1 (ko) * 2005-12-29 2007-03-12 동부일렉트로닉스 주식회사 반도체 소자의 실리사이드막 형성 방법

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0590293A (ja) * 1991-07-19 1993-04-09 Toshiba Corp 半導体装置およびその製造方法
JPH11195619A (ja) * 1998-01-06 1999-07-21 Sony Corp 半導体装置の製造方法
WO2006012052A2 (en) * 2004-06-25 2006-02-02 Arkema, Inc. Amidinate ligand containing chemical vapor deposition precursors

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116497231A (zh) * 2023-06-21 2023-07-28 核工业理化工程研究院 一种四（三氟膦）镍制备镍的方法
CN116497231B (zh) * 2023-06-21 2024-01-05 核工业理化工程研究院 一种四（三氟膦）镍制备镍的方法

Also Published As

Publication number Publication date
US20120171863A1 (en) 2012-07-05
KR101334946B1 (ko) 2013-11-29
WO2011033903A1 (ja) 2011-03-24
KR20120040746A (ko) 2012-04-27
JP2011066060A (ja) 2011-03-31

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Application publication date: 20120229