CN102304218B - 镀液及镀覆方法 - Google Patents

镀液及镀覆方法 Download PDF

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Publication number
CN102304218B
CN102304218B CN2011101283127A CN201110128312A CN102304218B CN 102304218 B CN102304218 B CN 102304218B CN 2011101283127 A CN2011101283127 A CN 2011101283127A CN 201110128312 A CN201110128312 A CN 201110128312A CN 102304218 B CN102304218 B CN 102304218B
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China
Prior art keywords
alkyl
copper
aryl
hydroxyl
compound
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CN2011101283127A
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English (en)
Chinese (zh)
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CN102304218A (zh
Inventor
Z·I·尼亚齐比托瓦
M·A·热兹尼科
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DuPont Electronic Materials International LLC
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Rohm and Haas Electronic Materials LLC
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Publication of CN102304218A publication Critical patent/CN102304218A/zh
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D235/00—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, condensed with other rings
    • C07D235/02—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, condensed with other rings condensed with carbocyclic rings or ring systems
    • C07D235/04—Benzimidazoles; Hydrogenated benzimidazoles
    • C07D235/06—Benzimidazoles; Hydrogenated benzimidazoles with only hydrogen atoms, hydrocarbon or substituted hydrocarbon radicals, directly attached in position 2
    • C07D235/08—Radicals containing only hydrogen and carbon atoms
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/421—Blind plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Electrochemistry (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Plural Heterocyclic Compounds (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
CN2011101283127A 2010-03-15 2011-03-15 镀液及镀覆方法 Active CN102304218B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/661,311 US8262895B2 (en) 2010-03-15 2010-03-15 Plating bath and method
US12/661,311 2010-03-15

Publications (2)

Publication Number Publication Date
CN102304218A CN102304218A (zh) 2012-01-04
CN102304218B true CN102304218B (zh) 2013-11-06

Family

ID=43941913

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2011101283127A Active CN102304218B (zh) 2010-03-15 2011-03-15 镀液及镀覆方法

Country Status (6)

Country Link
US (1) US8262895B2 (https=)
EP (1) EP2366694B1 (https=)
JP (1) JP6054595B2 (https=)
KR (1) KR101739413B1 (https=)
CN (1) CN102304218B (https=)
TW (1) TWI427066B (https=)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
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US8268157B2 (en) * 2010-03-15 2012-09-18 Rohm And Haas Electronic Materials Llc Plating bath and method
WO2011135716A1 (ja) * 2010-04-30 2011-11-03 荏原ユージライト株式会社 新規化合物およびその利用
US8454815B2 (en) 2011-10-24 2013-06-04 Rohm And Haas Electronics Materials Llc Plating bath and method
CN102888628B (zh) * 2012-10-11 2015-04-01 合肥奥福表面处理科技有限公司 Pet基材的fpc板材电镀镍工作液
CN105229095A (zh) * 2012-12-14 2016-01-06 蓝立方知识产权有限责任公司 高含固量环氧树脂涂料
US20140238868A1 (en) 2013-02-25 2014-08-28 Dow Global Technologies Llc Electroplating bath
JP6211185B2 (ja) 2013-11-06 2017-10-11 ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ レベラーとしての窒素含有ポリマー
WO2015074190A1 (en) 2013-11-20 2015-05-28 Rohm And Haas Electronic Materials Llc Polymers containing benzimidazole moieties as levelers
US9439294B2 (en) * 2014-04-16 2016-09-06 Rohm And Haas Electronic Materials Llc Reaction products of heterocyclic nitrogen compounds polyepoxides and polyhalogens
US9809891B2 (en) 2014-06-30 2017-11-07 Rohm And Haas Electronic Materials Llc Plating method
US9725816B2 (en) 2014-12-30 2017-08-08 Rohm And Haas Electronic Materials Llc Amino sulfonic acid based polymers for copper electroplating
US9611560B2 (en) 2014-12-30 2017-04-04 Rohm And Haas Electronic Materials Llc Sulfonamide based polymers for copper electroplating
US9783905B2 (en) 2014-12-30 2017-10-10 Rohm and Haas Electronic Mateirals LLC Reaction products of amino acids and epoxies
CN104562102A (zh) * 2014-12-31 2015-04-29 苏州福莱盈电子有限公司 一种高深度盲孔电镀铜溶液
CN105002527B (zh) * 2015-07-31 2017-06-16 广东光华科技股份有限公司 整平剂溶液及其制备方法和应用
CN105132977B (zh) * 2015-08-31 2017-12-29 广东东硕科技有限公司 一种用于线路板制造的调整液及其制备方法
US10988852B2 (en) 2015-10-27 2021-04-27 Rohm And Haas Electronic Materials Llc Method of electroplating copper into a via on a substrate from an acid copper electroplating bath
TWI762731B (zh) * 2017-11-08 2022-05-01 美商羅門哈斯電子材料有限公司 銅電鍍組合物及在基板上電鍍銅之方法
TWI703148B (zh) * 2017-11-08 2020-09-01 美商羅門哈斯電子材料有限公司 銅電鍍組合物及在基板上電鍍銅之方法
EP3781729B1 (en) * 2018-04-20 2024-09-25 Basf Se Composition for tin or tin alloy electroplating comprising suppressing agent
CN110016699B (zh) * 2019-05-29 2021-05-04 广州旗泽科技有限公司 一种电镀铜填孔整平剂及其制备方法和应用
CN111876799A (zh) * 2020-07-07 2020-11-03 广东硕成科技有限公司 一种适用于背板孔金属化组合物及其孔金属化方法
JP7530759B2 (ja) * 2020-07-28 2024-08-08 上村工業株式会社 無電解パラジウムめっき浴
CN115894908B (zh) * 2021-09-30 2025-06-06 华为技术有限公司 聚合物、整平剂及其制备方法、电镀液和电镀方法
CN118812835A (zh) * 2024-06-19 2024-10-22 广东省科学院化工研究所 一种含2-取代苯并咪唑基团整平剂及其制备方法与应用

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CN1908240A (zh) * 2005-07-08 2007-02-07 罗门哈斯电子材料有限公司 镀敷方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU1743158A1 (ru) * 1990-09-04 1998-02-20 Институт физико-органической химии и углехимии АН УССР 1-глицидилимидазолы в качестве соотвердителей эпоксидных смол
CN1908240A (zh) * 2005-07-08 2007-02-07 罗门哈斯电子材料有限公司 镀敷方法

Also Published As

Publication number Publication date
EP2366694A3 (en) 2011-11-02
JP6054595B2 (ja) 2016-12-27
CN102304218A (zh) 2012-01-04
JP2011213717A (ja) 2011-10-27
EP2366694A2 (en) 2011-09-21
US8262895B2 (en) 2012-09-11
KR101739413B1 (ko) 2017-05-24
KR20110103893A (ko) 2011-09-21
TW201136896A (en) 2011-11-01
US20110220513A1 (en) 2011-09-15
EP2366694B1 (en) 2013-05-01
TWI427066B (zh) 2014-02-21

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Address after: Massachusetts, USA

Patentee after: DuPont Electronic Materials International LLC

Country or region after: U.S.A.

Address before: Massachusetts, USA

Patentee before: ROHM AND HAAS ELECTRONIC MATERIALS, LLC

Country or region before: U.S.A.

CP03 Change of name, title or address