CN102300405A - 埋入式电路板及其制作方法 - Google Patents
埋入式电路板及其制作方法 Download PDFInfo
- Publication number
- CN102300405A CN102300405A CN2011102347287A CN201110234728A CN102300405A CN 102300405 A CN102300405 A CN 102300405A CN 2011102347287 A CN2011102347287 A CN 2011102347287A CN 201110234728 A CN201110234728 A CN 201110234728A CN 102300405 A CN102300405 A CN 102300405A
- Authority
- CN
- China
- Prior art keywords
- cell body
- electronic device
- circuit board
- copper
- insulating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10166—Transistor
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
Claims (12)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110234728.7A CN102300405B (zh) | 2011-08-16 | 2011-08-16 | 埋入式电路板及其制作方法 |
PCT/CN2011/079033 WO2013023388A1 (zh) | 2011-08-16 | 2011-08-29 | 埋入式电路板及其制作方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110234728.7A CN102300405B (zh) | 2011-08-16 | 2011-08-16 | 埋入式电路板及其制作方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102300405A true CN102300405A (zh) | 2011-12-28 |
CN102300405B CN102300405B (zh) | 2014-05-07 |
Family
ID=45360481
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201110234728.7A Active CN102300405B (zh) | 2011-08-16 | 2011-08-16 | 埋入式电路板及其制作方法 |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN102300405B (zh) |
WO (1) | WO2013023388A1 (zh) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102655710A (zh) * | 2012-05-12 | 2012-09-05 | 浙江大学 | 带有散热结构的功率模块dbc板 |
CN102833947A (zh) * | 2012-08-14 | 2012-12-19 | 惠州Tcl移动通信有限公司 | 一种移动通信终端、嵌入式pcb板结构及其加工方法 |
CN103260351A (zh) * | 2012-02-20 | 2013-08-21 | 联想(北京)有限公司 | 一种电子设备及一种电路板 |
CN103533749A (zh) * | 2013-10-31 | 2014-01-22 | 华为技术有限公司 | 功率放大器电路板及其制造方法 |
CN103687327A (zh) * | 2012-09-21 | 2014-03-26 | 联想(北京)有限公司 | 印刷电路板以及在印刷电路板上设置元件的方法 |
CN103945646A (zh) * | 2013-01-21 | 2014-07-23 | 联想(北京)有限公司 | 一种电路板 |
CN107734850A (zh) * | 2017-09-18 | 2018-02-23 | 维沃移动通信有限公司 | 一种印刷电路板的制作方法及印刷电路板 |
CN111295053A (zh) * | 2020-03-31 | 2020-06-16 | 生益电子股份有限公司 | 一种内嵌有导热体的pcb制备方法及pcb |
CN112367773A (zh) * | 2020-10-28 | 2021-02-12 | 安徽瑞迪微电子有限公司 | Dbc基板与芯片焊接方法 |
TWI761723B (zh) * | 2019-10-21 | 2022-04-21 | 大陸商宏啟勝精密電子(秦皇島)有限公司 | 全向內埋模組及製作方法、封裝結構及製作方法 |
CN116477963A (zh) * | 2023-04-18 | 2023-07-25 | 福建华清电子材料科技有限公司 | 带孔陶瓷生产带引脚陶瓷覆铜基板的方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07183433A (ja) * | 1993-12-24 | 1995-07-21 | Murata Mfg Co Ltd | 半導体デバイス |
JP2006156499A (ja) * | 2004-11-25 | 2006-06-15 | Kyocera Corp | 複数個取り基板およびガラスセラミック基板 |
CN101902883A (zh) * | 2010-07-16 | 2010-12-01 | 施吉连 | 一种微波高频陶瓷电路板的制造方法 |
CN201699011U (zh) * | 2010-04-06 | 2011-01-05 | 淄博市临淄银河高技术开发有限公司 | Igbt模块用低热阻陶瓷覆铜板 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1450850A (zh) * | 2003-04-29 | 2003-10-22 | 洪千惠 | 一种带发光二极体的电路板 |
CN100565862C (zh) * | 2007-07-17 | 2009-12-02 | 南亚电路板股份有限公司 | 埋入式芯片基板结构 |
CN101251969A (zh) * | 2007-11-30 | 2008-08-27 | 和谐光电科技(泉州)有限公司 | 二极管点距阵/数码管的高导热反射盖及其封装结构 |
JP5367668B2 (ja) * | 2009-11-17 | 2013-12-11 | スタンレー電気株式会社 | 発光装置およびその製造方法 |
CN201750623U (zh) * | 2010-06-13 | 2011-02-16 | 党艳杰 | 一种高效散热的pcb板 |
-
2011
- 2011-08-16 CN CN201110234728.7A patent/CN102300405B/zh active Active
- 2011-08-29 WO PCT/CN2011/079033 patent/WO2013023388A1/zh active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07183433A (ja) * | 1993-12-24 | 1995-07-21 | Murata Mfg Co Ltd | 半導体デバイス |
JP2006156499A (ja) * | 2004-11-25 | 2006-06-15 | Kyocera Corp | 複数個取り基板およびガラスセラミック基板 |
CN201699011U (zh) * | 2010-04-06 | 2011-01-05 | 淄博市临淄银河高技术开发有限公司 | Igbt模块用低热阻陶瓷覆铜板 |
CN101902883A (zh) * | 2010-07-16 | 2010-12-01 | 施吉连 | 一种微波高频陶瓷电路板的制造方法 |
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103260351A (zh) * | 2012-02-20 | 2013-08-21 | 联想(北京)有限公司 | 一种电子设备及一种电路板 |
CN102655710A (zh) * | 2012-05-12 | 2012-09-05 | 浙江大学 | 带有散热结构的功率模块dbc板 |
CN102833947A (zh) * | 2012-08-14 | 2012-12-19 | 惠州Tcl移动通信有限公司 | 一种移动通信终端、嵌入式pcb板结构及其加工方法 |
CN103687327B (zh) * | 2012-09-21 | 2016-10-05 | 联想(北京)有限公司 | 印刷电路板以及在印刷电路板上设置元件的方法 |
CN103687327A (zh) * | 2012-09-21 | 2014-03-26 | 联想(北京)有限公司 | 印刷电路板以及在印刷电路板上设置元件的方法 |
CN103945646B (zh) * | 2013-01-21 | 2017-12-29 | 联想(北京)有限公司 | 一种电路板 |
CN103945646A (zh) * | 2013-01-21 | 2014-07-23 | 联想(北京)有限公司 | 一种电路板 |
CN103533749B (zh) * | 2013-10-31 | 2016-12-07 | 华为技术有限公司 | 功率放大器电路板及其制造方法 |
CN103533749A (zh) * | 2013-10-31 | 2014-01-22 | 华为技术有限公司 | 功率放大器电路板及其制造方法 |
CN107734850A (zh) * | 2017-09-18 | 2018-02-23 | 维沃移动通信有限公司 | 一种印刷电路板的制作方法及印刷电路板 |
CN107734850B (zh) * | 2017-09-18 | 2019-11-15 | 维沃移动通信有限公司 | 一种印刷电路板的制作方法及印刷电路板 |
TWI761723B (zh) * | 2019-10-21 | 2022-04-21 | 大陸商宏啟勝精密電子(秦皇島)有限公司 | 全向內埋模組及製作方法、封裝結構及製作方法 |
CN111295053A (zh) * | 2020-03-31 | 2020-06-16 | 生益电子股份有限公司 | 一种内嵌有导热体的pcb制备方法及pcb |
CN111295053B (zh) * | 2020-03-31 | 2021-07-16 | 生益电子股份有限公司 | 一种内嵌有导热体的pcb制备方法及pcb |
CN112367773A (zh) * | 2020-10-28 | 2021-02-12 | 安徽瑞迪微电子有限公司 | Dbc基板与芯片焊接方法 |
CN116477963A (zh) * | 2023-04-18 | 2023-07-25 | 福建华清电子材料科技有限公司 | 带孔陶瓷生产带引脚陶瓷覆铜基板的方法 |
CN116477963B (zh) * | 2023-04-18 | 2023-12-26 | 福建华清电子材料科技有限公司 | 带孔陶瓷生产带引脚陶瓷覆铜基板的方法 |
Also Published As
Publication number | Publication date |
---|---|
WO2013023388A1 (zh) | 2013-02-21 |
CN102300405B (zh) | 2014-05-07 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: SHENNAN CIRCUIT CO., LTD. Free format text: FORMER NAME: SHENZHEN SHENNAN CIRCUITS CO., LTD. |
|
CP03 | Change of name, title or address |
Address after: 518053 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee after: SHENZHEN SHENNAN CIRCUIT CO., LTD. Address before: 518000 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee before: Shenzhen Shennan Circuits Co., Ltd. |
|
ASS | Succession or assignment of patent right |
Owner name: WUXI TIANXIN NETWORK TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: SHENNAN CIRCUIT CO., LTD. Effective date: 20150609 |
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C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 518053 SHENZHEN, GUANGDONG PROVINCE TO: 214062 WUXI, JIANGSU PROVINCE |
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TR01 | Transfer of patent right |
Effective date of registration: 20150609 Address after: 214062 Jiangsu New District of Wuxi City Linghu Road No. 200 Chinese Sensor Network International Innovation Park F District Service Building East Building Patentee after: Wuxi sky Interconnect Technology Co., Ltd. Address before: 518053 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee before: SHENZHEN SHENNAN CIRCUIT CO., LTD. |
|
CP03 | Change of name, title or address |
Address after: 518000 No.3 huanping Road, Gaoqiao community, Pingdi street, Longgang District, Shenzhen City, Guangdong Province Patentee after: Tianxin Internet Technology Co., Ltd Address before: 214062 Jiangsu New District of Wuxi City Linghu Road No. 200 Chinese Sensor Network International Innovation Park F District Service Building East Building Patentee before: WUXI SKY CHIP INTERCONNECTION TECHNOLOGY Co.,Ltd. |
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CP03 | Change of name, title or address |