CN102300405B - 埋入式电路板及其制作方法 - Google Patents
埋入式电路板及其制作方法 Download PDFInfo
- Publication number
- CN102300405B CN102300405B CN201110234728.7A CN201110234728A CN102300405B CN 102300405 B CN102300405 B CN 102300405B CN 201110234728 A CN201110234728 A CN 201110234728A CN 102300405 B CN102300405 B CN 102300405B
- Authority
- CN
- China
- Prior art keywords
- cell body
- electronic device
- insulating layer
- circuit board
- ceramic substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 9
- 239000000919 ceramic Substances 0.000 claims abstract description 63
- 229910052751 metal Inorganic materials 0.000 claims abstract description 57
- 239000002184 metal Substances 0.000 claims abstract description 57
- 239000000758 substrate Substances 0.000 claims abstract description 28
- 210000005056 cell body Anatomy 0.000 claims description 57
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 31
- 229910052802 copper Inorganic materials 0.000 claims description 31
- 239000010949 copper Substances 0.000 claims description 31
- 238000000034 method Methods 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 14
- 229920005989 resin Polymers 0.000 claims description 10
- 239000011347 resin Substances 0.000 claims description 10
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 6
- 239000002002 slurry Substances 0.000 claims description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 239000006071 cream Substances 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 230000005855 radiation Effects 0.000 abstract description 3
- 238000009413 insulation Methods 0.000 abstract 3
- 238000005516 engineering process Methods 0.000 description 6
- 239000006185 dispersion Substances 0.000 description 5
- 238000004806 packaging method and process Methods 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical compound C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- 229910017083 AlN Inorganic materials 0.000 description 1
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 238000006552 photochemical reaction Methods 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10166—Transistor
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
Claims (6)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110234728.7A CN102300405B (zh) | 2011-08-16 | 2011-08-16 | 埋入式电路板及其制作方法 |
PCT/CN2011/079033 WO2013023388A1 (zh) | 2011-08-16 | 2011-08-29 | 埋入式电路板及其制作方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110234728.7A CN102300405B (zh) | 2011-08-16 | 2011-08-16 | 埋入式电路板及其制作方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102300405A CN102300405A (zh) | 2011-12-28 |
CN102300405B true CN102300405B (zh) | 2014-05-07 |
Family
ID=45360481
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201110234728.7A Active CN102300405B (zh) | 2011-08-16 | 2011-08-16 | 埋入式电路板及其制作方法 |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN102300405B (zh) |
WO (1) | WO2013023388A1 (zh) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103260351A (zh) * | 2012-02-20 | 2013-08-21 | 联想(北京)有限公司 | 一种电子设备及一种电路板 |
CN102655710A (zh) * | 2012-05-12 | 2012-09-05 | 浙江大学 | 带有散热结构的功率模块dbc板 |
CN102833947A (zh) * | 2012-08-14 | 2012-12-19 | 惠州Tcl移动通信有限公司 | 一种移动通信终端、嵌入式pcb板结构及其加工方法 |
CN103687327B (zh) * | 2012-09-21 | 2016-10-05 | 联想(北京)有限公司 | 印刷电路板以及在印刷电路板上设置元件的方法 |
CN103945646B (zh) * | 2013-01-21 | 2017-12-29 | 联想(北京)有限公司 | 一种电路板 |
CN103533749B (zh) * | 2013-10-31 | 2016-12-07 | 华为技术有限公司 | 功率放大器电路板及其制造方法 |
CN107734850B (zh) * | 2017-09-18 | 2019-11-15 | 维沃移动通信有限公司 | 一种印刷电路板的制作方法及印刷电路板 |
CN112770495B (zh) * | 2019-10-21 | 2022-05-27 | 宏启胜精密电子(秦皇岛)有限公司 | 全向内埋模组及制作方法、封装结构及制作方法 |
CN111295053B (zh) * | 2020-03-31 | 2021-07-16 | 生益电子股份有限公司 | 一种内嵌有导热体的pcb制备方法及pcb |
CN112367773A (zh) * | 2020-10-28 | 2021-02-12 | 安徽瑞迪微电子有限公司 | Dbc基板与芯片焊接方法 |
CN116477963B (zh) * | 2023-04-18 | 2023-12-26 | 福建华清电子材料科技有限公司 | 带孔陶瓷生产带引脚陶瓷覆铜基板的方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101902883A (zh) * | 2010-07-16 | 2010-12-01 | 施吉连 | 一种微波高频陶瓷电路板的制造方法 |
CN201699011U (zh) * | 2010-04-06 | 2011-01-05 | 淄博市临淄银河高技术开发有限公司 | Igbt模块用低热阻陶瓷覆铜板 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07183433A (ja) * | 1993-12-24 | 1995-07-21 | Murata Mfg Co Ltd | 半導体デバイス |
CN1450850A (zh) * | 2003-04-29 | 2003-10-22 | 洪千惠 | 一种带发光二极体的电路板 |
JP2006156499A (ja) * | 2004-11-25 | 2006-06-15 | Kyocera Corp | 複数個取り基板およびガラスセラミック基板 |
CN100565862C (zh) * | 2007-07-17 | 2009-12-02 | 南亚电路板股份有限公司 | 埋入式芯片基板结构 |
CN101251969A (zh) * | 2007-11-30 | 2008-08-27 | 和谐光电科技(泉州)有限公司 | 二极管点距阵/数码管的高导热反射盖及其封装结构 |
JP5367668B2 (ja) * | 2009-11-17 | 2013-12-11 | スタンレー電気株式会社 | 発光装置およびその製造方法 |
CN201750623U (zh) * | 2010-06-13 | 2011-02-16 | 党艳杰 | 一种高效散热的pcb板 |
-
2011
- 2011-08-16 CN CN201110234728.7A patent/CN102300405B/zh active Active
- 2011-08-29 WO PCT/CN2011/079033 patent/WO2013023388A1/zh active Application Filing
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201699011U (zh) * | 2010-04-06 | 2011-01-05 | 淄博市临淄银河高技术开发有限公司 | Igbt模块用低热阻陶瓷覆铜板 |
CN101902883A (zh) * | 2010-07-16 | 2010-12-01 | 施吉连 | 一种微波高频陶瓷电路板的制造方法 |
Non-Patent Citations (1)
Title |
---|
JP平7-183433A 1995.07.21 |
Also Published As
Publication number | Publication date |
---|---|
CN102300405A (zh) | 2011-12-28 |
WO2013023388A1 (zh) | 2013-02-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN102300405B (zh) | 埋入式电路板及其制作方法 | |
CN101027948B (zh) | 电子模块及其制造方法 | |
CN108347820B (zh) | 容纳部件的基底结构上的高导热涂层 | |
US9331011B2 (en) | Electronic component built-in substrate and method of manufacturing the same | |
TWI569387B (zh) | 具有隔離件之散熱增益型線路板製作方法 | |
US20200321323A1 (en) | Semiconductor composite device and package board used therein | |
KR100763345B1 (ko) | 전자소자 내장형 인쇄회로기판의 제조방법 | |
US9698089B2 (en) | Substrate device and electric circuit arrangement having first substrate section perpendicular to second substrate section | |
CN107787112A (zh) | 具有电子元件的印刷电路板、其制造方法及电子元件模块 | |
JP2017098404A (ja) | 配線基板およびその製造方法 | |
US11450587B2 (en) | Heat removal mechanism for stack-based electronic device with process control component and processing components | |
WO2014162478A1 (ja) | 部品内蔵基板及びその製造方法 | |
US11799198B2 (en) | Component carrier-based device with antenna coupling of electronic component and thermal coupling on opposing sides | |
CN104377177A (zh) | 芯片装置 | |
EP3833163A1 (en) | Method of manufacturing component carrier and component carrier | |
US20190103335A1 (en) | Electronic component-embedded board | |
CN101533818B (zh) | 集成电路元件的封装结构及其制造方法 | |
US11257713B2 (en) | Interposer board without feature layer structure and method for manufacturing the same | |
US20220238474A1 (en) | Electronic component embedded substrate and circuit module using the same | |
TWI738019B (zh) | 用於射頻組件之多堆疊冷卻結構 | |
KR100917028B1 (ko) | 아노다이징을 이용한 금속 기판 및 이의 제조방법 | |
EP4081005A1 (en) | Component carrier | |
TWI809754B (zh) | 線路板及其製造方法 | |
CN110277367B (zh) | 一种ltcc基板结构及其激光加工方法 | |
US20220287181A1 (en) | Component Carrier Comprising at Least Two Components |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: SHENNAN CIRCUIT CO., LTD. Free format text: FORMER NAME: SHENZHEN SHENNAN CIRCUITS CO., LTD. |
|
CP03 | Change of name, title or address |
Address after: 518053 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee after: SHENZHEN SHENNAN CIRCUIT CO., LTD. Address before: 518000 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee before: Shenzhen Shennan Circuits Co., Ltd. |
|
ASS | Succession or assignment of patent right |
Owner name: WUXI TIANXIN NETWORK TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: SHENNAN CIRCUIT CO., LTD. Effective date: 20150609 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 518053 SHENZHEN, GUANGDONG PROVINCE TO: 214062 WUXI, JIANGSU PROVINCE |
|
TR01 | Transfer of patent right |
Effective date of registration: 20150609 Address after: 214062 Jiangsu New District of Wuxi City Linghu Road No. 200 Chinese Sensor Network International Innovation Park F District Service Building East Building Patentee after: Wuxi sky Interconnect Technology Co., Ltd. Address before: 518053 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee before: SHENZHEN SHENNAN CIRCUIT CO., LTD. |
|
CP03 | Change of name, title or address |
Address after: 518000 No.3 huanping Road, Gaoqiao community, Pingdi street, Longgang District, Shenzhen City, Guangdong Province Patentee after: Tianxin Internet Technology Co., Ltd Address before: 214062 Jiangsu New District of Wuxi City Linghu Road No. 200 Chinese Sensor Network International Innovation Park F District Service Building East Building Patentee before: WUXI SKY CHIP INTERCONNECTION TECHNOLOGY Co.,Ltd. |
|
CP03 | Change of name, title or address |