CN102250466B - 聚酰胺模塑材料及其用于制造led外壳元件的用途 - Google Patents

聚酰胺模塑材料及其用于制造led外壳元件的用途 Download PDF

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Publication number
CN102250466B
CN102250466B CN201110126613.6A CN201110126613A CN102250466B CN 102250466 B CN102250466 B CN 102250466B CN 201110126613 A CN201110126613 A CN 201110126613A CN 102250466 B CN102250466 B CN 102250466B
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component
weight
polyamide molding
polyamide
molding material
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Chinese (zh)
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CN102250466A (zh
Inventor
尼古拉·兰贝茨
安德烈亚斯·拜尔
曼弗雷德·赫韦尔
海因茨·霍夫
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EMS Patent AG
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EMS Patent AG
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24—Acids; Salts thereof
    • C08K3/26—Carbonates; Bicarbonates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/14—Glass

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Led Device Packages (AREA)
CN201110126613.6A 2010-05-17 2011-05-13 聚酰胺模塑材料及其用于制造led外壳元件的用途 Active CN102250466B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP10162998A EP2388293B1 (de) 2010-05-17 2010-05-17 Polyamidformmasse und deren Verwendung zur Herstellung von LED-Gehäusekomponenten
EP10162998.8 2010-05-17

Publications (2)

Publication Number Publication Date
CN102250466A CN102250466A (zh) 2011-11-23
CN102250466B true CN102250466B (zh) 2015-12-09

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CN201110126613.6A Active CN102250466B (zh) 2010-05-17 2011-05-13 聚酰胺模塑材料及其用于制造led外壳元件的用途

Country Status (7)

Country Link
US (1) US8859662B2 (ja)
EP (1) EP2388293B1 (ja)
JP (1) JP5786262B2 (ja)
KR (1) KR101484595B1 (ja)
CN (1) CN102250466B (ja)
MY (1) MY162176A (ja)
TW (1) TWI487744B (ja)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9151455B2 (en) * 2011-06-08 2015-10-06 Mitsui Chemicals, Inc. Thermoplastic resin composition for reflector, reflector plate, and light-emitting diode element
JP6015652B2 (ja) * 2012-02-28 2016-10-26 東洋紡株式会社 Ｌｅｄ反射板用熱可塑性樹脂組成物
EP2641939A1 (de) * 2012-03-21 2013-09-25 Basf Se Hellgefärbte flammgeschützte Polyamide
CN102675863A (zh) * 2012-05-11 2012-09-19 金发科技股份有限公司 一种低翘曲聚酰胺复合材料
CN102809100A (zh) * 2012-08-09 2012-12-05 京东方科技集团股份有限公司 背光源及其制备方法
CN104583329B (zh) * 2012-09-14 2017-08-29 三菱工程塑料株式会社 热塑性树脂组合物和树脂成型品
JP6190812B2 (ja) * 2012-09-14 2017-08-30 三菱エンジニアリングプラスチックス株式会社 熱可塑性樹脂組成物、樹脂成形品、及びメッキ層付樹脂成形品の製造方法
EP2949704B1 (de) * 2012-12-21 2019-04-24 Ems-Patent Ag Anfärberesistente artikel und ihre verwendung
EP2746341B2 (de) * 2012-12-21 2018-11-14 Ems-Patent Ag Schmutzabweisende Artikel und ihre Verwendung
US20140191263A1 (en) * 2013-01-07 2014-07-10 Sabic Innovative Plastics Ip B.V. Compositions for an led reflector and articles thereof
JP5646120B1 (ja) * 2013-02-19 2014-12-24 ユニチカ株式会社 半芳香族ポリアミド樹脂組成物
CN104448809A (zh) * 2013-09-25 2015-03-25 上海杰事杰新材料(集团)股份有限公司 玻璃纤维/矿物复合增强改性半芳香族尼龙材料及制备方法
US20170114217A1 (en) 2014-06-25 2017-04-27 Unitika Ltd. Resin composition and formed article thereof
JP2016084399A (ja) * 2014-10-24 2016-05-19 大塚化学株式会社 反射板用樹脂組成物及び反射板
JP6395048B2 (ja) * 2014-12-24 2018-09-26 日亜化学工業株式会社 パッケージ及び発光装置の製造方法
KR101988868B1 (ko) * 2015-02-13 2019-06-13 이엠에스-패턴트 에이지 폴리아미드 성형 조성물 및 이 성형 조성물로부터 제조된 성형 제품
KR101893709B1 (ko) * 2017-12-31 2018-08-30 롯데첨단소재(주) 폴리아미드 수지 조성물 및 이를 포함하는 성형품
CN115819964B (zh) * 2021-09-18 2024-03-01 珠海万通特种工程塑料有限公司 一种聚酰胺模塑复合材料及其制备方法和应用

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5124391A (en) * 1989-09-07 1992-06-23 Basf Aktiengesellschaft Filler-containing thermoplastic molding materials
CN1688643A (zh) * 2002-09-06 2005-10-26 埃姆斯化学股份公司 含超细填料的聚酰胺模塑混合料及由其制造的光反射组件
CN101104733A (zh) * 2006-07-11 2008-01-16 Ems-化学公开股份有限公司 聚酰胺模塑料及其用途

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1495393B2 (de) 1964-11-12 1979-10-18 Dynamit Nobel Ag, 5210 Troisdorf Verfahren zur Herstellung von Polyamiden aus Methylestern der Tere- und/oder Isophthalsäure und alipatischen primären Diaminen
US3843611A (en) 1972-05-22 1974-10-22 Phillips Petroleum Co Copolyamide from terephthalic acid,dodecanedioic acid and dodecane diamine
US3839296A (en) 1972-05-22 1974-10-01 Phillips Petroleum Co Sequential preparation of tractable polyterephthalamides
DE3321579A1 (de) 1983-06-15 1984-12-20 Basf Ag, 6700 Ludwigshafen Verfahren zur kontinuierlichen herstellung von polyamiden
DE3321581A1 (de) 1983-06-15 1984-12-20 Basf Ag, 6700 Ludwigshafen Verfahren zur kontinuierlichen herstellung von polyamiden
JPS60158220A (ja) 1984-01-27 1985-08-19 Mitsui Petrochem Ind Ltd 摺動材用成形材料
DE3667779D1 (de) * 1985-03-23 1990-02-01 Nitto Boseki Co Ltd Glasspinnfaden und verfahren zu seiner herstellung.
DE3707689A1 (de) 1987-03-11 1988-09-22 Basf Ag Formaldehydarme bindemittel
EP0299444B2 (de) 1987-07-17 2007-02-14 BASF Aktiengesellschaft Teilaromatische Copolyamide mit verringertem Triamingehalt
JP2928325B2 (ja) 1989-05-01 1999-08-03 三井化学株式会社 赤外線リフロー用組成物および電子部品
DE19513940A1 (de) 1994-07-14 1996-01-18 Inventa Ag Verfahren zur Herstellung von Vorkondensaten teilkristalliner oder amorpher, thermoplastisch verarbeitbarer teilaromatischer Polyamide bzw. Copolyamide
JPH08311198A (ja) 1995-05-24 1996-11-26 Mitsui Petrochem Ind Ltd 芳香族ポリアミドの製造方法
JP4179703B2 (ja) 1998-07-30 2008-11-12 株式会社クラレ ポリアミドの製造方法
JP4117130B2 (ja) 2001-12-26 2008-07-16 大塚化学ホールディングス株式会社 紫外線発生源用反射板材料
US20050112351A1 (en) * 2003-11-21 2005-05-26 Eastman Kodak Company Highly reflective optical element
JP2005194513A (ja) * 2003-12-09 2005-07-21 Mitsui Chemicals Inc 反射板用樹脂組成物および反射板
EP1693418A4 (en) 2003-12-09 2009-01-21 Mitsui Chemicals Inc RESIN COMPOSITION FOR LIGHT REFLECTOR AND LIGHT REFLECTOR
US20060293435A1 (en) 2005-06-10 2006-12-28 Marens Marvin M Light-emitting diode assembly housing comprising high temperature polyamide compositions
US20060293427A1 (en) * 2005-06-10 2006-12-28 Martens Marvin M Thermally conductive polyamide-based components used in light emitting diode reflector applications
JP2007218980A (ja) * 2006-02-14 2007-08-30 Idemitsu Kosan Co Ltd 反射体及びその製造方法
JP2007271834A (ja) 2006-03-31 2007-10-18 Mitsui Chemicals Inc 反射板用樹脂組成物および反射板
ATE445660T1 (de) * 2007-05-03 2009-10-15 Ems Patent Ag Teilaromatische polyamidformmassen und deren verwendungen
JP5491089B2 (ja) * 2009-07-16 2014-05-14 旭化成ケミカルズ株式会社 Ｌｅｄリフレクタ用ポリアミド組成物

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5124391A (en) * 1989-09-07 1992-06-23 Basf Aktiengesellschaft Filler-containing thermoplastic molding materials
CN1688643A (zh) * 2002-09-06 2005-10-26 埃姆斯化学股份公司 含超细填料的聚酰胺模塑混合料及由其制造的光反射组件
CN101104733A (zh) * 2006-07-11 2008-01-16 Ems-化学公开股份有限公司 聚酰胺模塑料及其用途

Also Published As

Publication number Publication date
US8859662B2 (en) 2014-10-14
CN102250466A (zh) 2011-11-23
MY162176A (en) 2017-05-31
TWI487744B (zh) 2015-06-11
TW201207041A (en) 2012-02-16
JP5786262B2 (ja) 2015-09-30
KR20110126550A (ko) 2011-11-23
JP2011241398A (ja) 2011-12-01
EP2388293B1 (de) 2012-12-26
US20110281990A1 (en) 2011-11-17
KR101484595B1 (ko) 2015-01-20
EP2388293A1 (de) 2011-11-23

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