CN102160129A - 电器件装置 - Google Patents
电器件装置 Download PDFInfo
- Publication number
- CN102160129A CN102160129A CN200980128602.2A CN200980128602A CN102160129A CN 102160129 A CN102160129 A CN 102160129A CN 200980128602 A CN200980128602 A CN 200980128602A CN 102160129 A CN102160129 A CN 102160129A
- Authority
- CN
- China
- Prior art keywords
- varistor
- varistor body
- arrangement according
- electrical
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
- H01C7/12—Overvoltage protection resistors; Arresters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
- H01C7/102—Varistor boundary, e.g. surface layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
- H01C7/105—Varistor cores
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5434—Dispositions of bond wires the connected ends being on auxiliary connecting means on bond pads, e.g. on other bond wires
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Thermistors And Varistors (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102008024479.1 | 2008-05-21 | ||
| DE102008024479A DE102008024479A1 (de) | 2008-05-21 | 2008-05-21 | Elektrische Bauelementanordnung |
| PCT/EP2009/056247 WO2009141437A1 (de) | 2008-05-21 | 2009-05-22 | Elektrische bauelementanordnung |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102160129A true CN102160129A (zh) | 2011-08-17 |
Family
ID=41010059
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200980128602.2A Pending CN102160129A (zh) | 2008-05-21 | 2009-05-22 | 电器件装置 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US9177703B2 (https=) |
| EP (1) | EP2289076B1 (https=) |
| JP (1) | JP2011523778A (https=) |
| KR (1) | KR101666230B1 (https=) |
| CN (1) | CN102160129A (https=) |
| DE (1) | DE102008024479A1 (https=) |
| TW (1) | TWI427761B (https=) |
| WO (1) | WO2009141437A1 (https=) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106124994A (zh) * | 2016-06-12 | 2016-11-16 | 北京长城华冠汽车科技股份有限公司 | 一种电动汽车的电池参数检测装置和电动汽车 |
| TWI730077B (zh) * | 2016-04-22 | 2021-06-11 | 德商Epcos Ag集團股份公司 | 多層-載體系統、製造多層-載體系統的方法及多層-載體系統的應用 |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102008024479A1 (de) * | 2008-05-21 | 2009-12-03 | Epcos Ag | Elektrische Bauelementanordnung |
| WO2012035484A1 (en) * | 2010-09-15 | 2012-03-22 | Koninklijke Philips Electronics N.V. | Embedded transient voltage suppression for light emitting devices |
| TW201221501A (en) * | 2010-11-26 | 2012-06-01 | Sfi Electronics Technology Inc | Process for producing ZnO varistor particularly having internal electrode composed of pure silver and sintered at a lower sintering temperature |
| US20130247777A1 (en) * | 2010-12-02 | 2013-09-26 | Nestec S.A. | Low-inertia thermal sensor in a beverage machine |
| DE102012111458B4 (de) * | 2012-11-27 | 2022-12-08 | Tdk Electronics Ag | Halbleitervorrichtung |
| DE102012113014A1 (de) * | 2012-12-21 | 2014-06-26 | Epcos Ag | Bauelementträger und Bauelementträgeranordnung |
| DE102014020163B4 (de) * | 2014-01-29 | 2025-09-18 | Tdk Electronics Ag | Chip mit Schutzfunktion und Verfahren zur Herstellung |
| DE102014101092B4 (de) * | 2014-01-29 | 2024-09-12 | Tdk Electronics Ag | Chip mit Schutzfunktion und Verfahren zur Herstellung |
| CN106463221B (zh) * | 2014-05-23 | 2018-01-05 | 三菱电机株式会社 | 浪涌吸收元件 |
| DE102014115375A1 (de) * | 2014-08-08 | 2016-02-11 | Epcos Ag | Träger für eine LED |
| DE102016122014A1 (de) * | 2016-11-16 | 2018-05-17 | Epcos Ag | Leistungsmodul mit verringerter Defektanfälligkeit und Verwendung desselben |
| US10741313B1 (en) * | 2019-02-06 | 2020-08-11 | Eaton Intelligent Power Limited | Bus bar assembly with integrated surge arrestor |
Family Cites Families (35)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2024999A1 (https=) * | 1968-12-02 | 1970-09-04 | Matsushita Electric Industrial Co Ltd | |
| US3928242A (en) * | 1973-11-19 | 1975-12-23 | Gen Electric | Metal oxide varistor with discrete bodies of metallic material therein and method for the manufacture thereof |
| US4272411A (en) * | 1979-03-08 | 1981-06-09 | Electric Power Research Institute | Metal oxide varistor and method |
| JPS6329804B2 (https=) | 1980-09-18 | 1988-06-15 | Tokyo Shibaura Electric Co | |
| JPS58171478A (ja) | 1982-04-02 | 1983-10-08 | Mitsubishi Chem Ind Ltd | 石炭液化方法 |
| US4681717A (en) * | 1986-02-19 | 1987-07-21 | The United States Of America As Represented By The United States Department Of Energy | Process for the chemical preparation of high-field ZnO varistors |
| JPS6325902A (ja) | 1986-07-17 | 1988-02-03 | 株式会社村田製作所 | 電圧非直線抵抗体用磁器組成物 |
| JPS63296307A (ja) | 1987-05-28 | 1988-12-02 | Matsushita Electric Ind Co Ltd | 酸化亜鉛形バリスタの製造方法 |
| JPH07105588B2 (ja) | 1988-02-05 | 1995-11-13 | 富士通株式会社 | 加熱チップの位置決め方式 |
| EP0353166A3 (en) * | 1988-07-25 | 1991-04-10 | John Fluke Mfg. Co., Inc. | Overvoltage protection circuit |
| EP0408308B1 (en) * | 1989-07-11 | 1994-10-12 | Ngk Insulators, Ltd. | Process for manufacturing a voltage non-linear resistor and a zinc oxide material to be used therefor |
| JPH0514104A (ja) | 1991-06-27 | 1993-01-22 | Murata Mfg Co Ltd | ノイズフイルタ |
| US5712757A (en) * | 1996-06-27 | 1998-01-27 | Raychem Corporation | Surge arrester having ridged terminals |
| JPH1197215A (ja) | 1997-09-19 | 1999-04-09 | Fujitsu Ltd | バリスタおよびバリスタ内蔵電源装置 |
| JP2001167908A (ja) * | 1999-12-03 | 2001-06-22 | Tdk Corp | 半導体電子部品 |
| JP3822768B2 (ja) | 1999-12-03 | 2006-09-20 | 株式会社ルネサステクノロジ | Icカードの製造方法 |
| JP2002110405A (ja) | 2000-09-28 | 2002-04-12 | Kaho Kagi Kofun Yugenkoshi | 過電圧保護素子の材料及び製造方法 |
| JP2002329872A (ja) * | 2001-04-25 | 2002-11-15 | Kaho Kagi Kofun Yugenkoshi | 過渡過電圧保護素子の材料 |
| US7132922B2 (en) * | 2002-04-08 | 2006-11-07 | Littelfuse, Inc. | Direct application voltage variable material, components thereof and devices employing same |
| JP4292901B2 (ja) * | 2002-08-20 | 2009-07-08 | 株式会社村田製作所 | バリスタ |
| US7279724B2 (en) * | 2004-02-25 | 2007-10-09 | Philips Lumileds Lighting Company, Llc | Ceramic substrate for a light emitting diode where the substrate incorporates ESD protection |
| WO2006106901A1 (ja) * | 2005-04-01 | 2006-10-12 | Matsushita Electric Industrial Co., Ltd. | Led部品およびその製造方法 |
| JP2007088173A (ja) | 2005-09-21 | 2007-04-05 | Tdk Corp | 積層型チップバリスタ及び電子機器の製造方法 |
| JP4134135B2 (ja) * | 2005-09-30 | 2008-08-13 | Tdk株式会社 | 発光装置 |
| US7671468B2 (en) * | 2005-09-30 | 2010-03-02 | Tdk Corporation | Light emitting apparatus |
| JP4600309B2 (ja) | 2006-02-13 | 2010-12-15 | Tdk株式会社 | バリスタ及び発光装置 |
| JP4984930B2 (ja) | 2006-03-20 | 2012-07-25 | Tdk株式会社 | バリスタ素子 |
| US7696856B2 (en) | 2006-03-20 | 2010-04-13 | Tdk Corporation | Varistor element |
| JP4487963B2 (ja) | 2006-03-27 | 2010-06-23 | Tdk株式会社 | バリスタ及び発光装置 |
| TW200903530A (en) * | 2007-03-30 | 2009-01-16 | Tdk Corp | Voltage non-linear resistance ceramic composition and voltage non-linear resistance element |
| WO2009015298A2 (en) * | 2007-07-25 | 2009-01-29 | Intermolecular, Inc. | Nonvolatile memory elements |
| US8350252B2 (en) * | 2008-03-14 | 2013-01-08 | University Of Connecticut | Boundary-modulated nanoparticle junctions and a method for manufacture thereof |
| US8203421B2 (en) * | 2008-04-14 | 2012-06-19 | Shocking Technologies, Inc. | Substrate device or package using embedded layer of voltage switchable dielectric material in a vertical switching configuration |
| DE102008024479A1 (de) * | 2008-05-21 | 2009-12-03 | Epcos Ag | Elektrische Bauelementanordnung |
| DE102012104494A1 (de) * | 2012-05-24 | 2013-11-28 | Epcos Ag | Leuchtdiodenvorrichtung |
-
2008
- 2008-05-21 DE DE102008024479A patent/DE102008024479A1/de not_active Ceased
-
2009
- 2009-05-20 TW TW098116655A patent/TWI427761B/zh not_active IP Right Cessation
- 2009-05-22 KR KR1020107028773A patent/KR101666230B1/ko not_active Expired - Fee Related
- 2009-05-22 US US12/994,146 patent/US9177703B2/en active Active
- 2009-05-22 EP EP09749927.1A patent/EP2289076B1/de not_active Not-in-force
- 2009-05-22 JP JP2011509997A patent/JP2011523778A/ja active Pending
- 2009-05-22 WO PCT/EP2009/056247 patent/WO2009141437A1/de not_active Ceased
- 2009-05-22 CN CN200980128602.2A patent/CN102160129A/zh active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI730077B (zh) * | 2016-04-22 | 2021-06-11 | 德商Epcos Ag集團股份公司 | 多層-載體系統、製造多層-載體系統的方法及多層-載體系統的應用 |
| CN106124994A (zh) * | 2016-06-12 | 2016-11-16 | 北京长城华冠汽车科技股份有限公司 | 一种电动汽车的电池参数检测装置和电动汽车 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2009141437A1 (de) | 2009-11-26 |
| KR101666230B1 (ko) | 2016-10-13 |
| TWI427761B (zh) | 2014-02-21 |
| EP2289076B1 (de) | 2016-04-06 |
| US9177703B2 (en) | 2015-11-03 |
| EP2289076A1 (de) | 2011-03-02 |
| US20110188161A1 (en) | 2011-08-04 |
| TW201001668A (en) | 2010-01-01 |
| KR20110031163A (ko) | 2011-03-24 |
| JP2011523778A (ja) | 2011-08-18 |
| DE102008024479A1 (de) | 2009-12-03 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20110817 |