TWI427761B - 電子元件組裝架構 - Google Patents

電子元件組裝架構 Download PDF

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Publication number
TWI427761B
TWI427761B TW098116655A TW98116655A TWI427761B TW I427761 B TWI427761 B TW I427761B TW 098116655 A TW098116655 A TW 098116655A TW 98116655 A TW98116655 A TW 98116655A TW I427761 B TWI427761 B TW I427761B
Authority
TW
Taiwan
Prior art keywords
varistor
electrical connection
varistor unit
electronic component
component assembly
Prior art date
Application number
TW098116655A
Other languages
English (en)
Chinese (zh)
Other versions
TW201001668A (en
Inventor
寬特 恩葛爾
湯馬士 費奇丁葛爾
艾克索爾 潘西娜
Original Assignee
Ｅｐｃｏｓ Ａｇ集團股份公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ｅｐｃｏｓ Ａｇ集團股份公司 filed Critical Ｅｐｃｏｓ Ａｇ集團股份公司
Publication of TW201001668A publication Critical patent/TW201001668A/zh
Application granted granted Critical
Publication of TWI427761B publication Critical patent/TWI427761B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H01C7/12—Overvoltage protection resistors; Arresters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H01C7/102—Varistor boundary, e.g. surface layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H01C7/105—Varistor cores
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5434—Dispositions of bond wires the connected ends being on auxiliary connecting means on bond pads, e.g. on other bond wires

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Thermistors And Varistors (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
TW098116655A 2008-05-21 2009-05-20 電子元件組裝架構 TWI427761B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102008024479A DE102008024479A1 (de) 2008-05-21 2008-05-21 Elektrische Bauelementanordnung

Publications (2)

Publication Number Publication Date
TW201001668A TW201001668A (en) 2010-01-01
TWI427761B true TWI427761B (zh) 2014-02-21

Family

ID=41010059

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098116655A TWI427761B (zh) 2008-05-21 2009-05-20 電子元件組裝架構

Country Status (8)

Country Link
US (1) US9177703B2 (https=)
EP (1) EP2289076B1 (https=)
JP (1) JP2011523778A (https=)
KR (1) KR101666230B1 (https=)
CN (1) CN102160129A (https=)
DE (1) DE102008024479A1 (https=)
TW (1) TWI427761B (https=)
WO (1) WO2009141437A1 (https=)

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DE102008024479A1 (de) * 2008-05-21 2009-12-03 Epcos Ag Elektrische Bauelementanordnung
WO2012035484A1 (en) * 2010-09-15 2012-03-22 Koninklijke Philips Electronics N.V. Embedded transient voltage suppression for light emitting devices
TW201221501A (en) * 2010-11-26 2012-06-01 Sfi Electronics Technology Inc Process for producing ZnO varistor particularly having internal electrode composed of pure silver and sintered at a lower sintering temperature
US20130247777A1 (en) * 2010-12-02 2013-09-26 Nestec S.A. Low-inertia thermal sensor in a beverage machine
DE102012111458B4 (de) * 2012-11-27 2022-12-08 Tdk Electronics Ag Halbleitervorrichtung
DE102012113014A1 (de) * 2012-12-21 2014-06-26 Epcos Ag Bauelementträger und Bauelementträgeranordnung
DE102014020163B4 (de) * 2014-01-29 2025-09-18 Tdk Electronics Ag Chip mit Schutzfunktion und Verfahren zur Herstellung
DE102014101092B4 (de) * 2014-01-29 2024-09-12 Tdk Electronics Ag Chip mit Schutzfunktion und Verfahren zur Herstellung
CN106463221B (zh) * 2014-05-23 2018-01-05 三菱电机株式会社 浪涌吸收元件
DE102014115375A1 (de) * 2014-08-08 2016-02-11 Epcos Ag Träger für eine LED
DE102016107495B4 (de) * 2016-04-22 2022-04-14 Tdk Electronics Ag Vielschicht-Trägersystem, Verfahren zur Herstellung eines Vielschicht-Trägersystems und Verwendung eines Vielschicht-Trägersystems
CN106124994A (zh) * 2016-06-12 2016-11-16 北京长城华冠汽车科技股份有限公司 一种电动汽车的电池参数检测装置和电动汽车
DE102016122014A1 (de) * 2016-11-16 2018-05-17 Epcos Ag Leistungsmodul mit verringerter Defektanfälligkeit und Verwendung desselben
US10741313B1 (en) * 2019-02-06 2020-08-11 Eaton Intelligent Power Limited Bus bar assembly with integrated surge arrestor

Citations (2)

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EP0353166A2 (en) * 1988-07-25 1990-01-31 John Fluke Mfg. Co., Inc. Overvoltage protection circuit
US20070075323A1 (en) * 2005-09-30 2007-04-05 Tdk Corporation Light emitting apparatus

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US4272411A (en) * 1979-03-08 1981-06-09 Electric Power Research Institute Metal oxide varistor and method
JPS6329804B2 (https=) 1980-09-18 1988-06-15 Tokyo Shibaura Electric Co
JPS58171478A (ja) 1982-04-02 1983-10-08 Mitsubishi Chem Ind Ltd 石炭液化方法
US4681717A (en) * 1986-02-19 1987-07-21 The United States Of America As Represented By The United States Department Of Energy Process for the chemical preparation of high-field ZnO varistors
JPS6325902A (ja) 1986-07-17 1988-02-03 株式会社村田製作所 電圧非直線抵抗体用磁器組成物
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JP2002110405A (ja) 2000-09-28 2002-04-12 Kaho Kagi Kofun Yugenkoshi 過電圧保護素子の材料及び製造方法
JP2002329872A (ja) * 2001-04-25 2002-11-15 Kaho Kagi Kofun Yugenkoshi 過渡過電圧保護素子の材料
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JP4600309B2 (ja) 2006-02-13 2010-12-15 Ｔｄｋ株式会社 バリスタ及び発光装置
JP4984930B2 (ja) 2006-03-20 2012-07-25 Ｔｄｋ株式会社 バリスタ素子
US7696856B2 (en) 2006-03-20 2010-04-13 Tdk Corporation Varistor element
JP4487963B2 (ja) 2006-03-27 2010-06-23 Ｔｄｋ株式会社 バリスタ及び発光装置
TW200903530A (en) * 2007-03-30 2009-01-16 Tdk Corp Voltage non-linear resistance ceramic composition and voltage non-linear resistance element
WO2009015298A2 (en) * 2007-07-25 2009-01-29 Intermolecular, Inc. Nonvolatile memory elements
US8350252B2 (en) * 2008-03-14 2013-01-08 University Of Connecticut Boundary-modulated nanoparticle junctions and a method for manufacture thereof
US8203421B2 (en) * 2008-04-14 2012-06-19 Shocking Technologies, Inc. Substrate device or package using embedded layer of voltage switchable dielectric material in a vertical switching configuration
DE102008024479A1 (de) * 2008-05-21 2009-12-03 Epcos Ag Elektrische Bauelementanordnung
DE102012104494A1 (de) * 2012-05-24 2013-11-28 Epcos Ag Leuchtdiodenvorrichtung

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0353166A2 (en) * 1988-07-25 1990-01-31 John Fluke Mfg. Co., Inc. Overvoltage protection circuit
US20070075323A1 (en) * 2005-09-30 2007-04-05 Tdk Corporation Light emitting apparatus

Also Published As

Publication number Publication date
WO2009141437A1 (de) 2009-11-26
KR101666230B1 (ko) 2016-10-13
EP2289076B1 (de) 2016-04-06
US9177703B2 (en) 2015-11-03
EP2289076A1 (de) 2011-03-02
US20110188161A1 (en) 2011-08-04
TW201001668A (en) 2010-01-01
CN102160129A (zh) 2011-08-17
KR20110031163A (ko) 2011-03-24
JP2011523778A (ja) 2011-08-18
DE102008024479A1 (de) 2009-12-03

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MM4A Annulment or lapse of patent due to non-payment of fees