DE102008024479A1 - Elektrische Bauelementanordnung - Google Patents

Elektrische Bauelementanordnung Download PDF

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Publication number
DE102008024479A1
DE102008024479A1 DE102008024479A DE102008024479A DE102008024479A1 DE 102008024479 A1 DE102008024479 A1 DE 102008024479A1 DE 102008024479 A DE102008024479 A DE 102008024479A DE 102008024479 A DE102008024479 A DE 102008024479A DE 102008024479 A1 DE102008024479 A1 DE 102008024479A1
Authority
DE
Germany
Prior art keywords
varistor body
varistor
arrangement according
component arrangement
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE102008024479A
Other languages
German (de)
English (en)
Inventor
Thomas Feichtinger
Günter Dr. Engel
Axel Dr. Pecina
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Electronics AG
Original Assignee
Epcos AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epcos AG filed Critical Epcos AG
Priority to DE102008024479A priority Critical patent/DE102008024479A1/de
Priority to TW098116655A priority patent/TWI427761B/zh
Priority to US12/994,146 priority patent/US9177703B2/en
Priority to EP09749927.1A priority patent/EP2289076B1/de
Priority to JP2011509997A priority patent/JP2011523778A/ja
Priority to PCT/EP2009/056247 priority patent/WO2009141437A1/de
Priority to KR1020107028773A priority patent/KR101666230B1/ko
Priority to CN200980128602.2A priority patent/CN102160129A/zh
Publication of DE102008024479A1 publication Critical patent/DE102008024479A1/de
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H01C7/12—Overvoltage protection resistors; Arresters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H01C7/102—Varistor boundary, e.g. surface layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H01C7/105—Varistor cores
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5434—Dispositions of bond wires the connected ends being on auxiliary connecting means on bond pads, e.g. on other bond wires

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Thermistors And Varistors (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
DE102008024479A 2008-05-21 2008-05-21 Elektrische Bauelementanordnung Ceased DE102008024479A1 (de)

Priority Applications (8)

Application Number Priority Date Filing Date Title
DE102008024479A DE102008024479A1 (de) 2008-05-21 2008-05-21 Elektrische Bauelementanordnung
TW098116655A TWI427761B (zh) 2008-05-21 2009-05-20 電子元件組裝架構
US12/994,146 US9177703B2 (en) 2008-05-21 2009-05-22 Electric component assembly
EP09749927.1A EP2289076B1 (de) 2008-05-21 2009-05-22 Elektrische bauelementanordnung
JP2011509997A JP2011523778A (ja) 2008-05-21 2009-05-22 電気的構成要素アセンブリ
PCT/EP2009/056247 WO2009141437A1 (de) 2008-05-21 2009-05-22 Elektrische bauelementanordnung
KR1020107028773A KR101666230B1 (ko) 2008-05-21 2009-05-22 전기 소자 어셈블리
CN200980128602.2A CN102160129A (zh) 2008-05-21 2009-05-22 电器件装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102008024479A DE102008024479A1 (de) 2008-05-21 2008-05-21 Elektrische Bauelementanordnung

Publications (1)

Publication Number Publication Date
DE102008024479A1 true DE102008024479A1 (de) 2009-12-03

Family

ID=41010059

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102008024479A Ceased DE102008024479A1 (de) 2008-05-21 2008-05-21 Elektrische Bauelementanordnung

Country Status (8)

Country Link
US (1) US9177703B2 (https=)
EP (1) EP2289076B1 (https=)
JP (1) JP2011523778A (https=)
KR (1) KR101666230B1 (https=)
CN (1) CN102160129A (https=)
DE (1) DE102008024479A1 (https=)
TW (1) TWI427761B (https=)
WO (1) WO2009141437A1 (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014101092A1 (de) * 2014-01-29 2015-07-30 Epcos Ag Chip mit Schutzfunktion und Verfahren zur Herstellung
DE102014115375A1 (de) * 2014-08-08 2016-02-11 Epcos Ag Träger für eine LED
WO2017182159A1 (de) * 2016-04-22 2017-10-26 Epcos Ag Vielschicht-trägersystem, verfahren zur herstellung eines vielschicht-trägersystems und verwendung eines vielschicht-trägersystems
DE102014020163B4 (de) * 2014-01-29 2025-09-18 Tdk Electronics Ag Chip mit Schutzfunktion und Verfahren zur Herstellung

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008024479A1 (de) * 2008-05-21 2009-12-03 Epcos Ag Elektrische Bauelementanordnung
WO2012035484A1 (en) * 2010-09-15 2012-03-22 Koninklijke Philips Electronics N.V. Embedded transient voltage suppression for light emitting devices
TW201221501A (en) * 2010-11-26 2012-06-01 Sfi Electronics Technology Inc Process for producing ZnO varistor particularly having internal electrode composed of pure silver and sintered at a lower sintering temperature
US20130247777A1 (en) * 2010-12-02 2013-09-26 Nestec S.A. Low-inertia thermal sensor in a beverage machine
DE102012111458B4 (de) * 2012-11-27 2022-12-08 Tdk Electronics Ag Halbleitervorrichtung
DE102012113014A1 (de) * 2012-12-21 2014-06-26 Epcos Ag Bauelementträger und Bauelementträgeranordnung
CN106463221B (zh) * 2014-05-23 2018-01-05 三菱电机株式会社 浪涌吸收元件
CN106124994A (zh) * 2016-06-12 2016-11-16 北京长城华冠汽车科技股份有限公司 一种电动汽车的电池参数检测装置和电动汽车
DE102016122014A1 (de) * 2016-11-16 2018-05-17 Epcos Ag Leistungsmodul mit verringerter Defektanfälligkeit und Verwendung desselben
US10741313B1 (en) * 2019-02-06 2020-08-11 Eaton Intelligent Power Limited Bus bar assembly with integrated surge arrestor

Citations (3)

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Publication number Priority date Publication date Assignee Title
US3928242A (en) * 1973-11-19 1975-12-23 Gen Electric Metal oxide varistor with discrete bodies of metallic material therein and method for the manufacture thereof
EP1580809A2 (en) * 2004-02-25 2005-09-28 LumiLeds Lighting U.S., LLC Ceramic substrate incorporating an ESD protection for a light emitting diode
DE102007014300A1 (de) 2006-03-27 2007-10-11 Tdk Corp. Varistor und Licht emittierende Vorrichtung

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JPS6329804B2 (https=) 1980-09-18 1988-06-15 Tokyo Shibaura Electric Co
JPS58171478A (ja) 1982-04-02 1983-10-08 Mitsubishi Chem Ind Ltd 石炭液化方法
US4681717A (en) * 1986-02-19 1987-07-21 The United States Of America As Represented By The United States Department Of Energy Process for the chemical preparation of high-field ZnO varistors
JPS6325902A (ja) 1986-07-17 1988-02-03 株式会社村田製作所 電圧非直線抵抗体用磁器組成物
JPS63296307A (ja) 1987-05-28 1988-12-02 Matsushita Electric Ind Co Ltd 酸化亜鉛形バリスタの製造方法
JPH07105588B2 (ja) 1988-02-05 1995-11-13 富士通株式会社 加熱チップの位置決め方式
EP0353166A3 (en) * 1988-07-25 1991-04-10 John Fluke Mfg. Co., Inc. Overvoltage protection circuit
EP0408308B1 (en) * 1989-07-11 1994-10-12 Ngk Insulators, Ltd. Process for manufacturing a voltage non-linear resistor and a zinc oxide material to be used therefor
JPH0514104A (ja) 1991-06-27 1993-01-22 Murata Mfg Co Ltd ノイズフイルタ
US5712757A (en) * 1996-06-27 1998-01-27 Raychem Corporation Surge arrester having ridged terminals
JPH1197215A (ja) 1997-09-19 1999-04-09 Fujitsu Ltd バリスタおよびバリスタ内蔵電源装置
JP2001167908A (ja) * 1999-12-03 2001-06-22 Tdk Corp 半導体電子部品
JP3822768B2 (ja) 1999-12-03 2006-09-20 株式会社ルネサステクノロジ Ｉｃカードの製造方法
JP2002110405A (ja) 2000-09-28 2002-04-12 Kaho Kagi Kofun Yugenkoshi 過電圧保護素子の材料及び製造方法
JP2002329872A (ja) * 2001-04-25 2002-11-15 Kaho Kagi Kofun Yugenkoshi 過渡過電圧保護素子の材料
US7132922B2 (en) * 2002-04-08 2006-11-07 Littelfuse, Inc. Direct application voltage variable material, components thereof and devices employing same
JP4292901B2 (ja) * 2002-08-20 2009-07-08 株式会社村田製作所 バリスタ
WO2006106901A1 (ja) * 2005-04-01 2006-10-12 Matsushita Electric Industrial Co., Ltd. Ｌｅｄ部品およびその製造方法
JP2007088173A (ja) 2005-09-21 2007-04-05 Tdk Corp 積層型チップバリスタ及び電子機器の製造方法
JP4134135B2 (ja) * 2005-09-30 2008-08-13 Ｔｄｋ株式会社 発光装置
US7671468B2 (en) * 2005-09-30 2010-03-02 Tdk Corporation Light emitting apparatus
JP4600309B2 (ja) 2006-02-13 2010-12-15 Ｔｄｋ株式会社 バリスタ及び発光装置
JP4984930B2 (ja) 2006-03-20 2012-07-25 Ｔｄｋ株式会社 バリスタ素子
US7696856B2 (en) 2006-03-20 2010-04-13 Tdk Corporation Varistor element
TW200903530A (en) * 2007-03-30 2009-01-16 Tdk Corp Voltage non-linear resistance ceramic composition and voltage non-linear resistance element
WO2009015298A2 (en) * 2007-07-25 2009-01-29 Intermolecular, Inc. Nonvolatile memory elements
US8350252B2 (en) * 2008-03-14 2013-01-08 University Of Connecticut Boundary-modulated nanoparticle junctions and a method for manufacture thereof
US8203421B2 (en) * 2008-04-14 2012-06-19 Shocking Technologies, Inc. Substrate device or package using embedded layer of voltage switchable dielectric material in a vertical switching configuration
DE102008024479A1 (de) * 2008-05-21 2009-12-03 Epcos Ag Elektrische Bauelementanordnung
DE102012104494A1 (de) * 2012-05-24 2013-11-28 Epcos Ag Leuchtdiodenvorrichtung

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3928242A (en) * 1973-11-19 1975-12-23 Gen Electric Metal oxide varistor with discrete bodies of metallic material therein and method for the manufacture thereof
EP1580809A2 (en) * 2004-02-25 2005-09-28 LumiLeds Lighting U.S., LLC Ceramic substrate incorporating an ESD protection for a light emitting diode
DE102007014300A1 (de) 2006-03-27 2007-10-11 Tdk Corp. Varistor und Licht emittierende Vorrichtung

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014101092A1 (de) * 2014-01-29 2015-07-30 Epcos Ag Chip mit Schutzfunktion und Verfahren zur Herstellung
US9865381B2 (en) 2014-01-29 2018-01-09 Epcos Ag Chip with protection function and method for producing same
DE102014101092B4 (de) 2014-01-29 2024-09-12 Tdk Electronics Ag Chip mit Schutzfunktion und Verfahren zur Herstellung
DE102014020163B4 (de) * 2014-01-29 2025-09-18 Tdk Electronics Ag Chip mit Schutzfunktion und Verfahren zur Herstellung
DE102014115375A1 (de) * 2014-08-08 2016-02-11 Epcos Ag Träger für eine LED
US9978912B2 (en) 2014-08-08 2018-05-22 Epcos Ag Carrier for an LED
WO2017182159A1 (de) * 2016-04-22 2017-10-26 Epcos Ag Vielschicht-trägersystem, verfahren zur herstellung eines vielschicht-trägersystems und verwendung eines vielschicht-trägersystems

Also Published As

Publication number Publication date
WO2009141437A1 (de) 2009-11-26
KR101666230B1 (ko) 2016-10-13
TWI427761B (zh) 2014-02-21
EP2289076B1 (de) 2016-04-06
US9177703B2 (en) 2015-11-03
EP2289076A1 (de) 2011-03-02
US20110188161A1 (en) 2011-08-04
TW201001668A (en) 2010-01-01
CN102160129A (zh) 2011-08-17
KR20110031163A (ko) 2011-03-24
JP2011523778A (ja) 2011-08-18

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R002 Refusal decision in examination/registration proceedings
R003 Refusal decision now final