CN102157482A - 具有复合基材的电子系统 - Google Patents

具有复合基材的电子系统 Download PDF

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CN102157482A
CN102157482A CN2010102083797A CN201010208379A CN102157482A CN 102157482 A CN102157482 A CN 102157482A CN 2010102083797 A CN2010102083797 A CN 2010102083797A CN 201010208379 A CN201010208379 A CN 201010208379A CN 102157482 A CN102157482 A CN 102157482A
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circuit board
electronic system
chip
metal
circuit
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李翰祥
施坤宏
李正人
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Cyntec Co Ltd
Qiankun Science and Technology Co Ltd
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Qiankun Science and Technology Co Ltd
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    • H—ELECTRICITY
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    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • H05K7/1432—Housings specially adapted for power drive units or power converters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
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    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M3/00—Conversion of dc power input into dc power output
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • H05K7/1432—Housings specially adapted for power drive units or power converters
    • H05K7/14322—Housings specially adapted for power drive units or power converters wherein the control and power circuits of a power converter are arranged within the same casing
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
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    • H01L23/00—Details of semiconductor or other solid state devices
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    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H01L2924/13055—Insulated gate bipolar transistor [IGBT]
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Abstract

本发明公开了一种具有复合基材的电子系统。该电子系统由电路板安置在金属框架上所构成，高发热的电子组件安置在金属框架上，低发热的电子组件安置在电路板上；芯片中的电路以金属线电性耦合至电路板上的电路。整个电子系统使用胶体封装以后，将金属框架的底面裸露出来提供散热用，使用本发明电子系统可以同时获得金属框架的优良散热性以及电路板的优良布线性。

Description

具有复合基材的电子系统
技术领域
本发明涉及一种电子系统；尤其涉及具有复合基材的电子系统之封装，且该复合基材系由电路板(circuit board)以及金属框架(lead frame)所结合而构成的复合基材。
背景技术
如图1所示，美国专利US6,212,086于2001年04月03日揭露了一个直流到直流转换系统(DC-to-DC converter system)，它包含了一个铜制基材110在系统底部提供均匀的散热功能，也包含了安置在铜制基材110上面的电路板120，电子组件则包含了主变压器130、输出电感140、同步整流器150、输出电容器160、以及输入电容器170，这些组件都安置在系统电路板120上面。一个独立的输出连接器在系统电路板120右边，经由软性电路板耦合到系统电路板120。
前述电子系统的缺点之一便是系统电路板120并非是一个良好的散热体，无法将安装在上面的电子组件120，130，140，150，160，以及170所产生的热量有效地传导至下方的铜制基材110散热之。电路板有利于电路配置但是不利于热量的传导，相对地，铜制基材不利于电路配置却有利于热量的传导。同一行业人士都积极研发，期望能有一种基材兼具两者优点。
发明内容
针对现有技术的上述不足，本发明所要解决的技术问题是提出一种同时具备金属框架的优良散热性以及电路板的优良布线性之具有复合基材的电子系统。
为了解决上述技术问题，本发明提供的具有复合基材的电子系统，包括金属框架、电路板和芯片，金属框架具有一组金属脚；电路板和芯片均安置于金属框架上；芯片上具有电路，该电路电性耦合至电路板上的电路。
优选地，本发明上述电子系统为直流到直流的转换系统。
优选地，本发明上述电子系统中，电路板具有矩形开口，芯片安置在该矩形开口中。
优选地，本发明上述电子系统中，电路板具有U形开口，芯片安置在该U形开口中。
优选地，本发明上述电子系统中，电路板具有L形开口，芯片安置在该L形开口中。
优选地，本发明上述电子系统中，电路板具有线性边缘，芯片安置在电路板的一个线性边缘。
优选地，本发明上述电子系统还包括封装胶体，该封装胶体具有一个底面，该底面与金属框架的底面切齐，形成一个平面底面的表面黏着封装。
优选地，本发明上述电子系统还包括垫子，该垫子安置于芯片下方。
相对于现有技术，本发明揭露一个复合基材被使用在「直流到直流转换系统」(DC-to-DC converter system)，该复合基材由电路板安置在金属框架上所构成的。这种复合基材使得集成电路等高发热的电子组件可以安置在金属框架上，低发热的电子组件则可以安置在电路板上，然后再用金属线将集成电路电性耦合到电路板上的电路。采用这种复合基材的电子系统，可以兼具有电路板的布线优点以及金属框架的导热优点。
附图说明
图1是现有技术中电子系统的结构示意图。
图2A是本发明实施例1所使用的电路板顶面视图。
图2B是图2A的底面视图。
图2C是本发明实施例1所使用的金属框架的结构示意图。
图3是本发明实施例1所使用的复合基材的结构示意图。
图4A是本发明实施例1的顶面视图。
图4B是图4A的底面视图。
图4C是图4A的AA’剖面放大图。
图4D是图4A的AA’剖面放大图。
图5A是本发明实施例2所使用的电路板顶面视图。
图5B是本发明实施例2所使用的金属框架的结构示意图。
图5C是本发明实施例2所使用的复合基材的结构示意图。
图5D是本发明实施例2的顶面视图。
图6A是本发明实施例3所使用的电路板顶面视图。
图6B是本发明实施例3的顶面视图。
图7A是本发明实施例4所使用的电路板顶面视图。
图7B是本发明实施例4的顶面视图。
图8A是本发明实施例1-4具有复合基材的电子系统封胶以后的侧面视图。
图8B是本发明实施例1-4具有复合基材的电子系统封胶以后的底面视图。
其中：20，203，202，201为电路板；20B为电路板底面；21为矩形开口；213为U形开口；212为L形开口；213为U形开口；211为平的边缘；22，223，222，221为金属焊垫；24，243，242，241为开口的边缘；25，253，252，251为底面金属接点；26为金属框架；26C，26C3为复合基材；261S为金属表面；262为外围金属脚；27为厚度调整片；30，30B，303，302，301为芯片；32为金属线。
具体实施方式
下面结合附图和具体实施例，进一步阐述本发明。这些实施例应理解为仅用于说明本发明而不用于限制本发明的保护范围。在阅读了本发明记载的内容之后，本领域技术人员可以对本发明作各种改动或修改，这些等效变化和修饰同样落入本发明权利要求所限定的范围。
实施例1
如图2A显示电路板20具有一个矩形开口21，一组金属焊垫22围绕在矩形开口21的四个边缘24。金属焊垫22是电路板20上的电路的一部分，金属焊垫22经由金属线23电性耦合至电路板20上的电路(图中未表示)。
如图2B所示，一组底面金属接点25安置在电路板20的底面20B，金属接点25后续将电性耦合到电路板20上面的对应之金属脚262。
如图2C所示，一片金属框架26具有数个大块金属261，大块金属261可以承载高发热的电子组件；金属框架26且具有一组外围金属脚262分布在金属框架26的周边，后续以封装胶体封装以后，外围金属脚262作为电子系统的输出/输入脚。电路板20后续将被安置在金属框架26上，构成本发明所使用之复合基材。
如图3所示，图2A的电路板20被安置在图2C的金属框架26上面，构成复合式基材26C。电路板20的底面20B具有底面金属接点25，底面金属接点25分别电性耦合到对应的周边金属脚262。电路板20的矩形开口21曝露出金属表面261S，金属表面261S是大块金属261的局部表面。
如图4A所示，芯片30安置在曝露在电路板20的矩形开口21内的金属表面261S上，芯片30内部的电路(图中未显示)经由芯片30上面的金属接点，以导线32电性耦合至电路板20上的金属焊垫22。矩形开口21具有四个平边24与芯片30的四个平边相邻，此一安排可以提供芯片30与电路板20之间有四边电性耦合的容量。
如图4B所示，图4A复合基材26C的底面26CB设置状况，显示大块金属261的底面以及外围金属脚262的底面呈共平面(coplanar)安置。
如图4C所示，芯片30安置在金属框架26中的一块大块金属261的金属表面261S上面，芯片30具有厚度T1，厚度T1相等或是接近于电路板20的厚度T3。这种高度约略相近的设计，可以方便金属线32将芯片30的顶面接点(图中未表示)电性耦合至电路板20上面的金属焊垫22。
如图4D所示，芯片30B安置在一片高度调整垫子27上面，以当芯片30B的厚度T2显著小于电路板20的厚度T3的时候，便可以使用高度调整垫子27于下方，以便使得芯片30B的上表面可以约略共平面于电路板20的上表面。这种高度约略相近的设计，可以方便金属线32将芯片30B的顶面接点电性耦合至电路板20上面的金属焊垫22。
实施例2
如图5A所示，电路板203边缘具有一个U形开口213，一组金属焊垫223安置在U形开口213的三个边缘243旁边。金属焊垫223是电路板203上面的电路的一部分电路，金属焊垫223以金属线233电性耦合至电路板203上面的电路(图中未表示)。电路板203底面设置有一组金属接点253，作为电路板203上的电路之输出入接点。
如图5B所示，金属框架26具有多个大块金属261，大块金属261适合于承载如芯片...等高发热性电子组件；一组外围金属脚262安置在金属框架26的周边，作为后续整个电子系统的输出入接点。后续，电路板203将被安置在金属框架26上面。
如图5C所示，图5A所示的电路板203被安置在如图5B所示的金属框架26上面，构成本发明的第二复合基材26C3。电路板203下方的底面金属接点253分别电性耦合至金属框架26的对应的周边金属脚262。电路板203的U形开口213曝露出大块金属261的部分金属表面261S。
如图5D所示，一片芯片303，安置在电路板203的U形开口213中的金属表面261S上面。芯片303内部电路经由金属线323电性耦合至电路板203上面的电路。图中显示金属线323将电路板203的金属焊垫223电性耦合至芯片303顶面的金属接点。U形开口213具有三个边缘分别邻接于芯片303的三个边缘，这种安排使得芯片303与电路板203之间具有三边电性耦合的容量。
实施例3
如图6A所示，电路板202边缘具有一个L形开口212，一组金属焊垫222安置在L形开口212的两个边缘242的旁边。金属焊垫222是电路板202上面的电路的一部分电路，金属焊垫222以金属线232电性耦合至电路板202上面的电路。电路板202底面设置有一组金属接点252，作为电路板202上的电路之输出入接点。
如图6B所示，本实施例的基本观念与实施例1-2相同，唯一不同在于电路板具有的开口形状不同。图6A显示电路板202具有L形开口212，芯片302安置在开口212所曝露之金属表面261S上面。芯片302内的电路经由金属线322电性耦合至电路板202上面的电路，金属线322系将电路板202上面的金属焊垫222电性耦合到芯片302顶面的金属接点。L形开口212具有两个边缘242分别邻接于芯片302的两个边缘，这种安排使得芯片302与电路板202之间具有两边电性耦合的容量。
实施例4
如图7A所示，一片电路板201具有一个线性边缘211，一组金属焊垫221安置于线性边缘211旁边。金属焊垫221是电路板201上的电路的一部分，金属焊垫221以金属线231电性耦合至电路板201上的电路(图中未显示)。一组底面金属接点251设置于电路板201的底面，作为电路板201上的电路的输出入接点。
如图7B所示，本实施例的基本观念与实施例1-2一样，唯一不同的是本实施例所使用的电路板201具有一个线性边缘241。一个集成电路芯片301安置在靠近线性边缘241的曝露的金属表面261S上面。芯片301内的电路(图中未显示)经由金属线321电性耦合至电路板201上的电路(图中未显示)，金属线321系将电路板201上的金属焊垫221电性耦合到芯片301上面的金属接点。电路板201的线性边缘241靠近芯片301的线性边缘，这种设计使得芯片301与电路板201之间具有单边电性耦合之容量。
如图图8A所示，前述实施例1-4之图4A，图5D，图6B以及图7B所示之具有复合基材的电子系统，以封装胶体51加以封装保护起来。周边金属脚262凸出封装胶体51，且金属脚的262的底面与封装胶体51的底面切齐或是称之为共平面。
如图8B所示，封装胶体51的底面与金属框架的底面齐平，裸露金属框架的底面便于散热，换句话说，整个底面是平面的，形成一个底面为平面的封装，构成一个表面黏着式组件。

Claims (8)

1.一种具有复合基材的电子系统，其特征是，该电子系统包括金属框架、电路板和芯片，金属框架具有一组金属脚；电路板和芯片均安置于金属框架上；芯片上具有电路，该电路电性耦合至电路板上的电路。
2.根据权利要求1所述的电子系统，其特征是，该电子系统为直流到直流的转换系统。
3.根据权利要求1所述的电子系统，其特征是，电路板具有矩形开口，芯片安置在该矩形开口中。
4.根据权利要求1所述的电子系统，其特征是，电路板具有U形开口，芯片安置在该U形开口中。
5.根据权利要求1所述的电子系统，其特征是，电路板具有L形开口，芯片安置在该L形开口中。
6.根据权利要求1所述的电子系统，其特征是，电路板具有线性边缘，芯片安置在电路板的一个线性边缘。
7.根据权利要求1-6中任何一项所述的电子系统，其特征是，该电子系统还包括封装胶体，该封装胶体具有一个底面，该底面与金属框架的底面切齐，形成一个平面底面的表面黏着封装。
8.根据权利要求1-6中任何一项所述的电子系统，其特征是，该电子系统还包括垫子，该垫子安置于芯片下方。
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