FR2839607B1 - Assemblage de composants de puissance sur un circuit imprime ainsi qu'un procede d'obtention d'un tel assemblage - Google Patents

Assemblage de composants de puissance sur un circuit imprime ainsi qu'un procede d'obtention d'un tel assemblage

Info

Publication number
FR2839607B1
FR2839607B1 FR0205777A FR0205777A FR2839607B1 FR 2839607 B1 FR2839607 B1 FR 2839607B1 FR 0205777 A FR0205777 A FR 0205777A FR 0205777 A FR0205777 A FR 0205777A FR 2839607 B1 FR2839607 B1 FR 2839607B1
Authority
FR
France
Prior art keywords
assembly
obtaining
well
printed circuit
power components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0205777A
Other languages
English (en)
Other versions
FR2839607A1 (fr
Inventor
Michel Guillet
Jean Claude Guignard
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Universite dAngers
Original Assignee
Universite dAngers
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Universite dAngers filed Critical Universite dAngers
Priority to FR0205777A priority Critical patent/FR2839607B1/fr
Priority to PCT/FR2003/001426 priority patent/WO2003096414A2/fr
Priority to AU2003254528A priority patent/AU2003254528A1/en
Priority to EP03749937A priority patent/EP1506575A2/fr
Priority to US10/513,627 priority patent/US7180177B2/en
Publication of FR2839607A1 publication Critical patent/FR2839607A1/fr
Application granted granted Critical
Publication of FR2839607B1 publication Critical patent/FR2839607B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/115—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10409—Screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
FR0205777A 2002-05-07 2002-05-07 Assemblage de composants de puissance sur un circuit imprime ainsi qu'un procede d'obtention d'un tel assemblage Expired - Fee Related FR2839607B1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
FR0205777A FR2839607B1 (fr) 2002-05-07 2002-05-07 Assemblage de composants de puissance sur un circuit imprime ainsi qu'un procede d'obtention d'un tel assemblage
PCT/FR2003/001426 WO2003096414A2 (fr) 2002-05-07 2003-05-07 Assemblage de composants de puissance sur un circuit imprime ainsi qu'un procede d'un tel assemblage
AU2003254528A AU2003254528A1 (en) 2002-05-07 2003-05-07 Power supply component assembly on a printed circuit and method for obtaining same
EP03749937A EP1506575A2 (fr) 2002-05-07 2003-05-07 Assemblage de composants de puissance sur un circuit imprime ainsi qu un procede d obtention d un tel assemblage
US10/513,627 US7180177B2 (en) 2002-05-07 2003-05-07 Power supply component assembly on a printed circuit and method for obtaining same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0205777A FR2839607B1 (fr) 2002-05-07 2002-05-07 Assemblage de composants de puissance sur un circuit imprime ainsi qu'un procede d'obtention d'un tel assemblage

Publications (2)

Publication Number Publication Date
FR2839607A1 FR2839607A1 (fr) 2003-11-14
FR2839607B1 true FR2839607B1 (fr) 2004-09-10

Family

ID=29286384

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0205777A Expired - Fee Related FR2839607B1 (fr) 2002-05-07 2002-05-07 Assemblage de composants de puissance sur un circuit imprime ainsi qu'un procede d'obtention d'un tel assemblage

Country Status (5)

Country Link
US (1) US7180177B2 (fr)
EP (1) EP1506575A2 (fr)
AU (1) AU2003254528A1 (fr)
FR (1) FR2839607B1 (fr)
WO (1) WO2003096414A2 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7150904B2 (en) * 2004-07-27 2006-12-19 Ut-Battelle, Llc Composite, ordered material having sharp surface features
DE102005047025A1 (de) 2005-09-30 2007-04-05 Siemens Ag Leiterplatte
US8445913B2 (en) 2007-10-30 2013-05-21 Spansion Llc Metal-insulator-metal (MIM) device and method of formation thereof
US8547709B2 (en) * 2010-02-12 2013-10-01 Cyntec Co. Ltd. Electronic system with a composite substrate
FR2984679B1 (fr) * 2011-12-15 2015-03-06 Valeo Sys Controle Moteur Sas Liaison thermiquement conductrice et electriquement isolante entre au moins un composant electronique et un radiateur en tout ou partie metallique
DE102014006841A1 (de) * 2014-05-13 2015-11-19 Auto-Kabel Management Gmbh Schaltungsanordnung für Kraftfahrzeuge und Verwendung einer Schaltungsanordnung
EP3799536A1 (fr) * 2019-09-27 2021-03-31 Siemens Aktiengesellschaft Support pour composants électriques et module électronique

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2615347B1 (fr) * 1987-05-15 1993-07-23 Neiman Sa Module de puissance pour equipements automobiles
US5014904A (en) * 1990-01-16 1991-05-14 Cray Research, Inc. Board-mounted thermal path connector and cold plate
JP3157362B2 (ja) * 1993-09-03 2001-04-16 株式会社東芝 半導体装置
EP0751562B1 (fr) * 1995-06-27 2001-07-18 Braun GmbH Fixation thermiquement conductive d'un dispositif électronique de puissance sur une plaquette de circuit avec dissipateur de chaleur
JP3206717B2 (ja) * 1996-04-02 2001-09-10 富士電機株式会社 電力用半導体モジュール
US5825625A (en) * 1996-05-20 1998-10-20 Hewlett-Packard Company Heat conductive substrate mounted in PC board for transferring heat from IC to heat sink
EP0907307A1 (fr) * 1997-10-03 1999-04-07 STMicroelectronics S.r.l. Dissipateur de chaleur pour des empaquetages de puissance montés en surface
US6156980A (en) * 1998-06-04 2000-12-05 Delco Electronics Corp. Flip chip on circuit board with enhanced heat dissipation and method therefor
DE19924991A1 (de) * 1999-05-31 2000-12-21 Tyco Electronics Logistics Ag Intelligentes Leistungsmodul in Sandwich-Bauweise
US6490161B1 (en) * 2002-01-08 2002-12-03 International Business Machines Corporation Peripheral land grid array package with improved thermal performance
US6807061B1 (en) * 2003-04-28 2004-10-19 Hewlett-Packard Development Company, L.P. Stack up assembly

Also Published As

Publication number Publication date
WO2003096414A3 (fr) 2004-04-08
AU2003254528A1 (en) 2003-11-11
WO2003096414A2 (fr) 2003-11-20
US20050151245A1 (en) 2005-07-14
EP1506575A2 (fr) 2005-02-16
US7180177B2 (en) 2007-02-20
AU2003254528A8 (en) 2003-11-11
FR2839607A1 (fr) 2003-11-14

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20120131