FR2828580B1 - Module de puissance - Google Patents

Module de puissance

Info

Publication number
FR2828580B1
FR2828580B1 FR0208461A FR0208461A FR2828580B1 FR 2828580 B1 FR2828580 B1 FR 2828580B1 FR 0208461 A FR0208461 A FR 0208461A FR 0208461 A FR0208461 A FR 0208461A FR 2828580 B1 FR2828580 B1 FR 2828580B1
Authority
FR
France
Prior art keywords
power module
module
power
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0208461A
Other languages
English (en)
Other versions
FR2828580A1 (fr
Inventor
Takeshi Oumaru
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of FR2828580A1 publication Critical patent/FR2828580A1/fr
Application granted granted Critical
Publication of FR2828580B1 publication Critical patent/FR2828580B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • H05K7/1432—Housings specially adapted for power drive units or power converters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • H05K7/1432—Housings specially adapted for power drive units or power converters
    • H05K7/14329—Housings specially adapted for power drive units or power converters specially adapted for the configuration of power bus bars
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H01L2924/13055—Insulated gate bipolar transistor [IGBT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Conversion In General (AREA)
  • Wire Bonding (AREA)
  • Inverter Devices (AREA)
FR0208461A 2001-08-08 2002-07-05 Module de puissance Expired - Fee Related FR2828580B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001240738A JP2003060157A (ja) 2001-08-08 2001-08-08 パワーモジュール

Publications (2)

Publication Number Publication Date
FR2828580A1 FR2828580A1 (fr) 2003-02-14
FR2828580B1 true FR2828580B1 (fr) 2005-06-24

Family

ID=19071300

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0208461A Expired - Fee Related FR2828580B1 (fr) 2001-08-08 2002-07-05 Module de puissance

Country Status (4)

Country Link
US (1) US6800934B2 (fr)
JP (1) JP2003060157A (fr)
DE (1) DE10230716A1 (fr)
FR (1) FR2828580B1 (fr)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7095790B2 (en) * 2003-02-25 2006-08-22 Qualcomm, Incorporated Transmission schemes for multi-antenna communication systems utilizing multi-carrier modulation
DE10331574A1 (de) * 2003-07-11 2005-02-17 eupec Europäische Gesellschaft für Leistungshalbleiter mbH Leistungshalbleitermodul
JP4159951B2 (ja) * 2003-09-05 2008-10-01 三菱電機株式会社 半導体モジュールの製造方法
US7327024B2 (en) * 2004-11-24 2008-02-05 General Electric Company Power module, and phase leg assembly
US8431973B2 (en) * 2008-12-10 2013-04-30 Kabushiki Kaisha Toshiba High frequency semiconductor device
JP5939055B2 (ja) * 2012-06-28 2016-06-22 住友電気工業株式会社 半導体装置及び半導体装置の製造方法
JP6672908B2 (ja) * 2016-03-10 2020-03-25 富士電機株式会社 半導体装置及び半導体装置の製造方法
JP6597549B2 (ja) * 2016-10-20 2019-10-30 トヨタ自動車株式会社 半導体モジュール
JP6836201B2 (ja) * 2017-12-19 2021-02-24 株式会社デンソー 電力変換装置
JP2019140722A (ja) * 2018-02-06 2019-08-22 トヨタ自動車株式会社 電力変換装置
WO2020071102A1 (fr) * 2018-10-05 2020-04-09 富士電機株式会社 Dispositif à semi-conducteur, module à semi-conducteur et véhicule
JP7447480B2 (ja) 2019-12-23 2024-03-12 富士電機株式会社 電子回路、半導体モジュール及び半導体装置
DE112021002087T5 (de) 2020-12-17 2023-02-16 Fuji Electric Co., Ltd. Halbleitermodul
WO2023233936A1 (fr) * 2022-06-01 2023-12-07 富士電機株式会社 Module semi-conducteur

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5823469A (ja) * 1981-08-03 1983-02-12 Mitsubishi Electric Corp 複合パワ−トランジスタ
JPS61139051A (ja) 1984-12-11 1986-06-26 Toshiba Corp 半導体装置
JPH03263363A (ja) * 1990-02-23 1991-11-22 Fuji Electric Co Ltd 半導体装置
JPH06334066A (ja) 1993-05-25 1994-12-02 Stanley Electric Co Ltd 回路構成方法
JPH08340082A (ja) 1995-06-09 1996-12-24 Origin Electric Co Ltd 電力用半導体装置
JP3481735B2 (ja) * 1995-07-26 2003-12-22 株式会社東芝 半導体装置
US5642253A (en) * 1995-07-31 1997-06-24 Delco Electronics Corporation Multi-channel ignition coil driver module
US6100728A (en) * 1995-07-31 2000-08-08 Delco Electronics Corp. Coil current limiting feature for an ignition coil driver module
JPH09312357A (ja) * 1996-05-21 1997-12-02 Fuji Electric Co Ltd 半導体装置
DE69726518T2 (de) * 1996-09-06 2004-10-07 Hitachi Ltd Leistungshalbleiteranordnung in modularer Bauart
JPH11238851A (ja) 1998-02-23 1999-08-31 Hitachi Ltd 集積回路装置およびそれを用いた通信機
JP2000049184A (ja) * 1998-05-27 2000-02-18 Hitachi Ltd 半導体装置およびその製造方法
DE29823619U1 (de) * 1998-08-21 1999-09-30 Semikron Elektronik Gmbh Leistungshalbleiterschaltungsanordnung mit schwingungsgedämpfter Parallelschaltung
JP3521757B2 (ja) * 1998-09-08 2004-04-19 株式会社豊田自動織機 半導体モジュール電極構造
JP2001007282A (ja) 1999-06-25 2001-01-12 Toshiba Corp パワー半導体素子
JP3695260B2 (ja) * 1999-11-04 2005-09-14 株式会社日立製作所 半導体モジュール
JP4004715B2 (ja) * 2000-05-31 2007-11-07 三菱電機株式会社 パワーモジュール
US20020024134A1 (en) * 2000-08-28 2002-02-28 Mitsubishi Denki Kabushiki Kaisha Semiconductor device

Also Published As

Publication number Publication date
DE10230716A1 (de) 2003-03-06
US20030030481A1 (en) 2003-02-13
JP2003060157A (ja) 2003-02-28
US6800934B2 (en) 2004-10-05
FR2828580A1 (fr) 2003-02-14

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20110331