CN102122115B - 生成光掩模及数据、固态图像传感器和微透镜阵列的方法 - Google Patents

生成光掩模及数据、固态图像传感器和微透镜阵列的方法 Download PDF

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Publication number
CN102122115B
CN102122115B CN2011100002107A CN201110000210A CN102122115B CN 102122115 B CN102122115 B CN 102122115B CN 2011100002107 A CN2011100002107 A CN 2011100002107A CN 201110000210 A CN201110000210 A CN 201110000210A CN 102122115 B CN102122115 B CN 102122115B
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China
Prior art keywords
photomask
light part
shading light
area
microlens array
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Expired - Fee Related
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CN2011100002107A
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English (en)
Chinese (zh)
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CN102122115A (zh
Inventor
栗原政树
渡边杏平
北村慎吾
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Canon Inc
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Canon Inc
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Publication of CN102122115A publication Critical patent/CN102122115A/zh
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00—Producing optical elements, e.g. lenses or prisms
    • B29D11/00009—Production of simple or compound lenses
    • B29D11/00278—Lenticular sheets
    • B29D11/00298—Producing lens arrays
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/50—Mask blanks not covered by G03F1/20 - G03F1/34; Preparation thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/14685—Process for coatings or optical elements

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Ophthalmology & Optometry (AREA)
  • Mechanical Engineering (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
CN2011100002107A 2010-01-07 2011-01-04 生成光掩模及数据、固态图像传感器和微透镜阵列的方法 Expired - Fee Related CN102122115B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2010-002375 2010-01-07
JP2010002375 2010-01-07
JP2010-282401 2010-12-17
JP2010282401A JP5677076B2 (ja) 2010-01-07 2010-12-17 フォトマスクデータの生成方法、その作製方法、そのためのプログラム、固体撮像装置の製造方法、および、マイクロレンズアレイの製造方法

Publications (2)

Publication Number Publication Date
CN102122115A CN102122115A (zh) 2011-07-13
CN102122115B true CN102122115B (zh) 2013-03-27

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CN2011100002107A Expired - Fee Related CN102122115B (zh) 2010-01-07 2011-01-04 生成光掩模及数据、固态图像传感器和微透镜阵列的方法

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US (1) US8354206B2 (ja)
JP (1) JP5677076B2 (ja)
CN (1) CN102122115B (ja)

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* Cited by examiner, † Cited by third party
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CN103365071B (zh) * 2012-04-09 2016-03-09 中芯国际集成电路制造(上海)有限公司 掩膜板的光学邻近校正方法
CN103345010A (zh) * 2013-07-11 2013-10-09 中国科学院光电技术研究所 一种基于聚二甲基硅氧烷模板的微透镜阵列元件制作方法
JP6409499B2 (ja) * 2014-10-24 2018-10-24 大日本印刷株式会社 パターンデータの作製方法およびフォトマスク
JP6409498B2 (ja) * 2014-10-24 2018-10-24 大日本印刷株式会社 パターンデータの作製方法
US20190206912A1 (en) * 2018-01-03 2019-07-04 Himax Technologies Limited Image sensor, micro-lens array, and method for fabricating micro-lens array with different heights in image sensor
WO2020108902A1 (en) 2018-11-30 2020-06-04 Asml Netherlands B.V. Method for determining patterning device pattern based on manufacturability

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1423168A (zh) * 1994-06-29 2003-06-11 株式会社日立制作所 光掩模及其制造方法
CN1574223A (zh) * 2003-06-24 2005-02-02 松下电器产业株式会社 光掩模、使用该光掩模的图案形成方法及该光掩模的掩模数据编制方法
CN1975568A (zh) * 2002-04-30 2007-06-06 松下电器产业株式会社 使用光罩的图案形成方法

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JP2988556B2 (ja) * 1992-09-24 1999-12-13 松下電子工業株式会社 マイクロレンズの製造方法および半導体装置の製造方法
JPH07318715A (ja) * 1994-05-30 1995-12-08 Toppan Printing Co Ltd カラーフィルターの製造方法
JP4249586B2 (ja) * 2002-09-30 2009-04-02 大日本印刷株式会社 マイクロレンズの形成方法
JP4489471B2 (ja) * 2004-03-15 2010-06-23 大日本印刷株式会社 マイクロレンズアレイの形成方法
JPWO2006028128A1 (ja) * 2004-09-09 2008-05-08 松下電器産業株式会社 固体撮像素子
JP2007193243A (ja) 2006-01-23 2007-08-02 Sony Corp 露光用マスク、露光方法、露光用マスクの製造方法、３次元デバイスおよび３次元デバイスの製造方法
JP4696927B2 (ja) * 2006-01-23 2011-06-08 凸版印刷株式会社 マイクロレンズアレイの製造方法
JP4936515B2 (ja) * 2006-05-18 2012-05-23 Ｈｏｙａ株式会社 フォトマスクの製造方法、およびハーフトーン型位相シフトマスクの製造方法
KR100831273B1 (ko) * 2006-09-12 2008-05-22 동부일렉트로닉스 주식회사 씨모스 이미지 센서의 마이크로렌즈용 사진 마스크
JP4607944B2 (ja) * 2007-04-17 2011-01-05 キヤノン株式会社 マスクパターンデータの生成方法、情報処理装置、フォトマスク作製システム、及び、マイクロレンズアレイの製造方法
JP2009031400A (ja) * 2007-07-25 2009-02-12 Toppan Printing Co Ltd 濃度分布マスク
JP4941233B2 (ja) * 2007-10-31 2012-05-30 大日本印刷株式会社 固体撮像素子およびそれを用いた撮像装置
JP2012109541A (ja) * 2010-10-25 2012-06-07 Canon Inc 固体撮像装置の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1423168A (zh) * 1994-06-29 2003-06-11 株式会社日立制作所 光掩模及其制造方法
CN1975568A (zh) * 2002-04-30 2007-06-06 松下电器产业株式会社 使用光罩的图案形成方法
CN1574223A (zh) * 2003-06-24 2005-02-02 松下电器产业株式会社 光掩模、使用该光掩模的图案形成方法及该光掩模的掩模数据编制方法

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Publication number Publication date
CN102122115A (zh) 2011-07-13
JP5677076B2 (ja) 2015-02-25
US20110165503A1 (en) 2011-07-07
US8354206B2 (en) 2013-01-15
JP2011158894A (ja) 2011-08-18

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