CN102110680B - 具有降低电感的功率模块组件 - Google Patents

具有降低电感的功率模块组件 Download PDF

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Publication number
CN102110680B
CN102110680B CN201010538460.1A CN201010538460A CN102110680B CN 102110680 B CN102110680 B CN 102110680B CN 201010538460 A CN201010538460 A CN 201010538460A CN 102110680 B CN102110680 B CN 102110680B
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China
Prior art keywords
terminal
electrically
power semiconductor
power
backing plate
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CN201010538460.1A
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Chinese (zh)
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CN102110680A (zh
Inventor
R·A·博普雷
E·C·德尔加多
L·D·斯特瓦诺维克
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General Electric Co
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General Electric Co
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5473—Dispositions of multiple bond wires multiple bond wires connected to a common bond pad
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips

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  • Inverter Devices (AREA)
  • Rectifiers (AREA)
CN201010538460.1A 2009-10-30 2010-10-29 具有降低电感的功率模块组件 Active CN102110680B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/609,400 US8076696B2 (en) 2009-10-30 2009-10-30 Power module assembly with reduced inductance
US12/609400 2009-10-30

Publications (2)

Publication Number Publication Date
CN102110680A CN102110680A (zh) 2011-06-29
CN102110680B true CN102110680B (zh) 2019-08-06

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Family Applications (1)

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CN201010538460.1A Active CN102110680B (zh) 2009-10-30 2010-10-29 具有降低电感的功率模块组件

Country Status (6)

Country Link
US (1) US8076696B2 (https=)
EP (1) EP2317551B1 (https=)
JP (1) JP2011097053A (https=)
CN (1) CN102110680B (https=)
BR (1) BRPI1004830B1 (https=)
CA (1) CA2719179C (https=)

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JP6603676B2 (ja) * 2015-02-13 2019-11-06 株式会社日産アーク ハーフブリッジパワー半導体モジュール及びその製造方法
JP6594000B2 (ja) 2015-02-26 2019-10-23 ローム株式会社 半導体装置
CN106340513B (zh) * 2015-07-09 2019-03-15 台达电子工业股份有限公司 一种集成控制电路的功率模块
JP6488940B2 (ja) * 2015-08-07 2019-03-27 富士電機株式会社 半導体装置
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CN105957860B (zh) * 2016-05-03 2018-07-20 扬州国扬电子有限公司 一种设有绝缘隔板的功率模块
CN105789192B (zh) * 2016-05-03 2018-11-30 扬州国扬电子有限公司 一种设有电极大臂的功率模块
CN105810653B (zh) * 2016-05-03 2018-09-28 扬州国扬电子有限公司 一种设有可共用电极大臂的功率模块
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JP7210446B2 (ja) * 2016-11-25 2023-01-23 ヒタチ・エナジー・スウィツァーランド・アクチェンゲゼルシャフト パワー半導体モジュール
US10212838B2 (en) * 2017-01-13 2019-02-19 Cree Fayetteville, Inc. High power multilayer module having low inductance and fast switching for paralleling power devices
IT201700033230A1 (it) * 2017-03-27 2018-09-27 S M E S P A Modulo di potenza per un convertitore di grandezze elettriche
WO2018207406A1 (ja) * 2017-05-12 2018-11-15 三菱電機株式会社 半導体モジュールおよび電力変換装置
JP7119399B2 (ja) * 2018-02-06 2022-08-17 株式会社デンソー 半導体装置
CN109860160B (zh) * 2018-12-25 2020-10-09 扬州国扬电子有限公司 一种结构紧凑且寄生电感低的功率模块
DE102019204889A1 (de) * 2019-04-05 2020-10-08 Robert Bosch Gmbh Elektronische Schaltungseinheit
JP7050732B2 (ja) * 2019-09-24 2022-04-08 ローム株式会社 半導体装置
JP7240541B2 (ja) * 2019-09-24 2023-03-15 ローム株式会社 半導体装置
CN111162051B (zh) * 2019-12-23 2021-08-03 湖南国芯半导体科技有限公司 功率端子、功率模块封装结构及封装方法
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JP7542390B2 (ja) 2020-10-08 2024-08-30 株式会社東芝 電気機器及び電力変換装置
WO2022176675A1 (ja) * 2021-02-16 2022-08-25 住友電気工業株式会社 半導体装置
WO2022209381A1 (ja) * 2021-04-01 2022-10-06 住友電気工業株式会社 半導体装置
EP4495989A1 (de) * 2023-07-21 2025-01-22 Siemens Aktiengesellschaft Halbleiteranordnung mit einem halbleiterelement

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Also Published As

Publication number Publication date
JP2011097053A (ja) 2011-05-12
CA2719179C (en) 2013-08-13
EP2317551A1 (en) 2011-05-04
CN102110680A (zh) 2011-06-29
EP2317551B1 (en) 2020-04-29
BRPI1004830B1 (pt) 2020-02-27
US8076696B2 (en) 2011-12-13
CA2719179A1 (en) 2011-04-30
BRPI1004830A2 (pt) 2013-02-19
US20110101515A1 (en) 2011-05-05

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